The UHF lithium niobate (LiNbO3) PF ultrasonic transducer was fabricated using conventional transducer technology. The LiNbO3 single crystal was selected because it exhibits good electromechanical coupling capability, low dielectric permittivity, and high longitudinal sound velocity. These material properties are ideal for designing large aperture and high sensitivity single-element transducers.
The aperture size and proper thickness of acoustic stacks, such as LiNbO3 single crystal transducer element and parylene matching layer, were optimized by a Krimholtz, Leedom, and Matthaei model. Firstly, a conductive silver epoxy (E-Solder 3022, Von Roll Isola Inc., New Haven, CT) was cast onto the back side of a gold-electroplated 36° rotated Y-cut LiNbO3 plate (Boston Piezo-Optics, Bellingham, MA) as a backing material by centrifuging it at 1,200g for 15 min. After curing at room temperature overnight and lapping the backing layer, the front side of the LiNbO3 single crystal was lapped to its designed thickness of 17 μm. The sample was then diced into the designated dimension of 0.8 × 0.8 mm2. A lead wire was connected to the backing layer of the acoustic stack using conductive epoxy. The acoustic stack was then concentrically placed in the brass housing. The gap between the stack and housing was filled in by an insulating epoxy (Epo-Tek 301; Epoxy Technologies, Billerica, MA). The stack was PF at a focal length of 1.3 mm to obtain an f-number (f#) of ~1.6. The transducer surface was then sputtered with chrome/gold layers of approximately 1,500 Å in total thickness to make ground connection between the stack and the brass housing. A ~1.5 μm-thick parylene layer was vapor-deposited on the front face of the transducer to serve as an acoustic matching layer and a protection layer using a PDS 2010 Labcoater (SCS, Indianapolis, IN). The transducer was assembled in an SMA connector for further measurements, for example, pulse-echo characterization.
The aperture size and proper thickness of acoustic stacks, such as LiNbO3 single crystal transducer element and parylene matching layer, were optimized by a Krimholtz, Leedom, and Matthaei model. Firstly, a conductive silver epoxy (E-Solder 3022, Von Roll Isola Inc., New Haven, CT) was cast onto the back side of a gold-electroplated 36° rotated Y-cut LiNbO3 plate (Boston Piezo-Optics, Bellingham, MA) as a backing material by centrifuging it at 1,200g for 15 min. After curing at room temperature overnight and lapping the backing layer, the front side of the LiNbO3 single crystal was lapped to its designed thickness of 17 μm. The sample was then diced into the designated dimension of 0.8 × 0.8 mm2. A lead wire was connected to the backing layer of the acoustic stack using conductive epoxy. The acoustic stack was then concentrically placed in the brass housing. The gap between the stack and housing was filled in by an insulating epoxy (Epo-Tek 301; Epoxy Technologies, Billerica, MA). The stack was PF at a focal length of 1.3 mm to obtain an f-number (f#) of ~1.6. The transducer surface was then sputtered with chrome/gold layers of approximately 1,500 Å in total thickness to make ground connection between the stack and the brass housing. A ~1.5 μm-thick parylene layer was vapor-deposited on the front face of the transducer to serve as an acoustic matching layer and a protection layer using a PDS 2010 Labcoater (SCS, Indianapolis, IN). The transducer was assembled in an SMA connector for further measurements, for example, pulse-echo characterization.