Example 1
A conventional material lay-up referred to as a panel having carbon fiber present at a rate of 30 percent by volume of the carbon fiber reinforced plastic material.
A vinyl ester resin without any fillers was prepared according to the following table.
Trade nameComponent% (by resin volume)
Atlac XP810XVinyl Ester Resin92.5
Palapreg H 2681-01Low profile additive7.5
The Palapreg H 2681-01 contained fractions of styrene, wetting additives, processing additives, LDPE, peroxide, and MgO.
The panel was coated with the vinyl ester resin and was subsequently compression molded at a temperature of 150 degrees at 12 MPa for 20 seconds, with a decrease in pressure to 4.8 MPa for 80 seconds. The mold was then opened, the panel de-molded and allowed to cool.
The produced panel was then measured with a Mitutoyo SV-3000CNC profilometer device to determine surface roughness of the top surface, with filter cutoff levels of the profilometer device set at two different values for two separate measurements, the cutoff levels being 0.8 mm and then at 2.5 mm and the results recorded. See Table 2.
Example 2
In this example, the panel was initially prepared as was done for comparative example 1. That is, A conventional material lay-up referred to as a panel having carbon fiber present at a rate of 30 percent by volume of the carbon fiber reinforced plastic material.
Following this preparation, a vinyl resin was prepared similarly to the comparative example, but inducing 16 percent by volume of CaCO3 as a filler (CLTE: 10×10−6/C°, Particle size (D50): 3 um)
The panel was compression molded at a temperature of 150 degrees at 12 MPa for 20 seconds, with a decrease in pressure to 4.8 MPa for 80 seconds. The mold was then opened, the panel de-molded and allowed to cool.
The produced panel was then measured with a Mitutoyo SV-3000CNC profilometer device to determine surface roughness of the top surface, with filter cutoff levels of the profilometer device set at two different values for two separate measurements, the cutoff levels being 0.8 mm and then at 2.5 mm, and the results recorded. See Table 2.
Roughness values were improved over the comparative example, but were not better than steel.
Example 3
In this example, the panel was again prepared as was done for comparative example 1. That is, A conventional material lay-up referred to as a panel having carbon fiber present at a rate of 30 percent by volume of the carbon fiber reinforced plastic material.
Following this preparation, a vinyl resin was prepared similarly to the comparative example, but including 16 percent by volume of a low CLTE filler, in this example, feldspar. (CLTE: 4.2×10−6/C°, Particle size (D50): 3 um)
The panel was coated with the vinyl ester resin and was subsequently compression molded at a temperature of 150 degrees at 12 MPa for 20 seconds, with a decrease in pressure to 4.8 MPa for 80 seconds. The mold was then opened, the panel de-molded and allowed to cool.
The produced panel was then measured with a Mitutoyo SV-3000CNC profilometer device to determine surface roughness of the top surface, with filter cutoff levels of the profilometer device set at two different values for two separate measurements, the cutoff levels being 0.8 mm and then at 2.5 mm, and the results recorded. See Table 2.
Roughness values were improved over the comparative example, and at cut off value Lc of 0.8 mm, was able to meet that of steel, but the longer cut off value Lc of 2.5 mm could not.
Example 4
In this example, the panel was again prepared as was done for comparative example 1. That is, A conventional material lay-up referred to as a panel having carbon fiber present at a rate of 30 percent by volume of the carbon fiber reinforced plastic material.
Following this preparation, a vinyl resin was prepared similarly to the comparative example, but including 16 percent by volume of a low CLTE filler, in this example, fused silica having a Coefficient of Linear Thermal Expansion of 0.5, particle size 4 um.
The panel was coated with the vinyl ester resin and was subsequently compression molded at a temperature of 150 degrees at 12 MPa for 20 seconds, with a decrease in pressure to 4.8 MPa for 80 seconds. The mold was then opened, the panel de-molded and allowed to cool.
The produced panel was then measured with a Mitutoyo SV-3000CNC profilometer device to determine surface roughness of the top surface, with filter cutoff levels of the profilometer device set at two different values for two separate measurements, the cutoff levels being 0.8 mm and then at 2.5 mm, and the results recorded. See Table 2.
Roughness values were similar to Example 3 for both cut off values Lc of 0.8 mm and 2.5 mm. However, the molded panel was substantially lighter weight.
Example 5
In this example, the panel was again prepared as was done for comparative example 1. That is, A conventional material lay-up referred to as a panel having carbon fiber present at a rate of 30 percent by volume of the carbon fiber reinforced plastic material.
Following this preparation, a vinyl resin was prepared similarly to the comparative example, but including 21 percent by volume of a low CLTE filler, in this example, fused silica.
The panel was coated with the vinyl ester resin and was subsequently compression molded at a temperature of 150 degrees at 12 MPa for 20 seconds, with an increase in pressure to 20 MPa for 80 seconds.
The molding tool was then left at ambient conditions without further application of heat, but with the pressure maintained at 20 MPa. This was done until the temperature of the molding tool reached 50 degrees C. The mold was then opened, the panel de-molded and allowed to further cool.
The produced panel was then measured with a Mitutoyo SV-3000CNC profilometer device to determine surface roughness of the top surface, with filter cutoff levels of the profilometer device set at two different values for two separate measurements, the cutoff levels being 0.8 mm and then at 2.5 mm, and the results recorded. See Table 2.
Roughness values were for this example for both cut off values Lc of 0.8 mm and 2.5 mm were able to reach and even exceed those of steel.
In this example, the panel was again prepared as was done for comparative example 1. That is, a conventional material lay-up referred to as a panel having carbon fiber present at a rate of 30 percent by volume of the carbon fiber reinforced plastic material.
Following this preparation, a vinyl resin was prepared similarly to the comparative example, but including 21 percent by volume of a low CLTE filler, in this example, fused silica.
The panel was coated with the vinyl ester resin and was subsequently compression molded at a temperature of 150 degrees at 12 MPa for 20 seconds, with an increase in pressure to 20 MPa for 80 seconds.
The mold was then opened, the panel de-molded and allowed to cool.
Table 2 shows the results of the six examples as well as reference information for a steel panel.
TABLE 2
Surface Roughness Ra
Filler % 0.160.16
Ref. SteelResinby VolLc = 0.8 mmLc = 2.5 mm
Comp. Ex.Vinyl EsterN/A0.250.54
No Filler
Ex. 2Vinyl Ester160.200.38
CaCO3
Ex. 3Vinyl Ester160.120.25
Feldspar
Ex. 4Vinyl Ester160.120.25
Fused Silica
Ex. 5′Vinyl Ester210.150.23
Fused Silica
Ex. 5Vinyl Ester210.110.15
Fused Silica
Although the present disclosure herein has been described with reference to particular embodiments and examples, it is to be understood that these embodiments and examples are merely illustrative of the principles and applications of the present disclosure.
Throughout the description, including the claims, the term “comprising a” should be understood as being synonymous with “comprising at least one” unless otherwise stated. In addition, any range set forth in the description, including the claims should be understood as including its end value(s) unless otherwise stated. Specific values for described elements should be understood to be within accepted manufacturing or industry tolerances known to one of skill in the art, and any use of the terms “substantially” and/or “approximately” and/or “generally” should be understood to mean falling within such accepted tolerances.
Where any standards of national, international, or other standards body are referenced (e.g., ISO, etc.), such references are intended to refer to the standard as defined by the national or international standards body as of the priority date of the present specification. Any subsequent substantive changes to such standards are not intended to modify the scope and/or definitions of the present disclosure and/or claims.
Additionally, even though some features, concepts or aspects of the inventions may be described herein as being a preferred arrangement, selection, or method, such description is not intended to suggest that such feature is required or necessary unless expressly so stated.
It is intended that the specification and examples be considered as exemplary only, with a true scope of the disclosure being indicated by the following claims.