Example 2
To prepare the electrode from CNS grown on Si wafer, the surface of CNS was gently scratched at the edge of a piece of cleaved 1.0×1.5 cm2 CNS-coated wafer, and a small piece of indium metal (Alfa Aesar, >99.99%) was pressed on the scratch to produce an ohmic contact. Then, silver paste (Ted Pella) was used as conductive glue between a copper wire and the indium pad. The edges and backside of the samples were protected by epoxy to isolate them from contacting the electrolyte.