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Ta electroforce

Manufactured by TA Instruments

The TA ElectroForce is a versatile mechanical testing instrument designed for a wide range of applications. It provides precise control and measurement of force, displacement, and other mechanical properties of various materials and samples.

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Lab products found in correlation

2 protocols using ta electroforce

1

Mechanical Properties of PCL, PLA Blends

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The flexural modulus of PCL, PLA and 50:50 blends was measured under 3-point bending from extruded filaments of 2 mm diameter mounted on a 1 cm support spam. A TA ElectroForce (TA Instruments) mechanical tester equipped with a 45 N load cell and controlled with WinTest DMA 7.1 software was used to deform he samples at a strain rate of 0.01 mm/s. The experiments were run until creep (or until the maximum applicable load was reached). The flexural modulus was calculated from the slope of the linear region of recorded force-displacement curves. The storage and loss moduli and the tangent δ of PCL, PLA and Janus scaffolds were measured from 3D printed single fibers of 400 µm diameter using a TA Q800 dynamic mechanical thermal analyzer. Experiments were run with a thermal sweep from 20–65 °C, a 3 °C temperature ramp, a dynamic strain of 0.5% and fixed frequency of 0.1 Hz from which the storage modulus, loss modulus and tangent δ are reported as mean ± SD, n = 3. Experiments were also run under a frequency sweep of 0.1–100 Hz at a fixed temperature of 37 °C using a strain of 0.5%. All PLA samples broke above 1.6 Hz. n = 3.
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2

Compressive Mechanical Properties Measurement

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Forward primer 5 to 3 Reverse primer 5 to 3
GGAACCAAGAAGGCACAGAC CGGGACACCTACTCTCATAC noted down for data analysis. The compressive mechanical properties were measured in the dry state in unconfined and nonequilibrium conditions. Samples for biological studies were measured in PBS before and after cell culture. A TA ElectroForce (TA Instruments) mechanical tester equipped with a 45 N load cell was used for all the measurements. The instrument was controlled with WinTest7 software. Tests were conducted at a strain rate of 0.01 mm/s. The experiments were run until approximately 50% deformation (or until the maximum applicable load was reached).
No pre-load was applied and the initial recorded data corresponding to the compression plate traveling to contact the sample was subtracted prior data analysis. The Young's modulus was calculated from the slope of the engineering strain-stress curve between 0.2% and 1.2% strain. This range was chosen to avoid barreling of the sample and correction for the dimensions of the sample.
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