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Sm 090101 cross section polisher

Manufactured by JEOL
Sourced in Japan

The SM-090101 Cross-Section Polisher is a laboratory equipment designed for the preparation of cross-sectional samples. It is used to create a smooth, high-quality surface on the sample, allowing for detailed observation and analysis under a microscope.

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6 protocols using sm 090101 cross section polisher

1

Cement Microstructure Analysis Protocol

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A silicone mold (diameter: 10 mm; thickness: 2 mm) was filled with cement upon mixing 10 wt% of CPC-Mont/SB with liquid according to the manufacturer’s instructions. Fully set cement disks were next cross-sectioned and polished using an argon-ion beam (SM-090101 Cross-Section Polisher, Jeol, Tokyo, Japan), followed by an osmium coating prior to the Feg-SEM examination (JSM-6701F, Jeol). Additionally, ultrathin (70–90 nm) cross-sections of the cement disk were cut with an ultramicrotome (Leica EM UC6, Leica, Vienna, Austria) to be examined by the STEM at 200 kV (JEM-2100F, Jeol).
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2

3D Ultrastructural Characterization of Adhesive-Dentin Interface

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Eight slabs embedded in epoxy resin with the cross-sectioned adhesive-dentin interface exposed at the surface were mechanically polished using diamond lapping films (3M, St.Paul, MN, USA) and argon-ion polishing (SM-090101 Cross-Section Polisher, JEOL, Tokyo, Japan). Orthogonal FIB-SEM (SMF-1000, HITACHI, Tokyo, Japan) imaging was conducted for 3D-ultrastructural characterization. The FIB and SEM ion/electron beams were orthogonally aligned, instead of being set at the standard angle of 60°, to obtain high spatial resolution and high-contrast SEM photomicrographs (Wirth, 2009) . Lucis Pro (Microtechnics, Granite Bay, CA, USA) and Stacker and Visualizer-Kai (System In Frontier, Tokyo, Japan) software packages were utilized for 3D reconstruction. SEM was performed at 0.5 kV. Images were obtained using an annular in-lens secondary electron detector and an annular in-lens energy-selected backscattered electron detector. The observed area was 10x10 µm with 10 nm/pixels each. Serial sectioning observations were carried out with a slice pitch of 10 nm for 990 sheets. The obtained images were rendered by removing resin and pseudo-colored according contrast.
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3

Quantitative Nanomechanical Characterization of Cross-Sectioned Samples

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Similar to the FIB-SEM specimen-preparation procedure, eight embedded specimens were mechanically polished using diamond lapping films (3M) and argon-ion polished (SM-090101 Cross-Section Polisher, JEOL). The SPM system employed was a Bruker MultiMode 8 SPM equipped with a Nanoscope V controller and Nanoscope analysis software (Bruker Nano Surface Business, Santa Barbara, CA, USA). Cross-sectioned surfaces were quantitatively characterized using the PeakForce QNM (Quantitative NanoMechanics) SPM module under ambient conditions. Elastic modulus (EM) was calculated by Nanoscope analysis software using the Derjaguin-Muller-Toropov (DMT) model (Derjaguin et al., 1975; Wang et al., 2013) . Samples were scanned using a probe (RTESPA-525, Bruker) with a nominal radius of 8 nm and a nominal spring constant of 200 Nm -1 with 0.501 Hz scan rates, a 250-mV amplitude set point and a 150-nm peak force amplitude. After SPM, the samples were observed by SEM (JSM-6701F, JEOL).
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4

Surface Analysis of CAD/CAM Blocks

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SEM (JSM-6701F, JEOL, Tokyo, Japan) was used to observe the surface compositions of both CAD/CAM blocks. 1-mm-thick slices were cut from each block using a semi-automated, high-speed, diamond saw (Accutom, Struers, Ballerup, Denmark). The blocks were cross-sectioned by argon ion milling (SM-090101 Cross-Section Polisher, JEOL). After a thin layer of carbon was vaporized on the surface (JEE-420T Vacuum Evaporators, JEOL), the specimens were examined using a field emission-gun SEM (Feg-SEM; JSM-6701F, JEOL), operated at 5 kV and using an annular semiconductor detector.
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5

Microstructural Analysis of CAD-CAM Dental Blocks

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From block size 14, thin 1-mm thick slices were cut using a semi-automated high-speed diamond saw (Accutom, Struers, Ballerup, Denmark). For each brand, three CAD-CAM blocks were cross-sectioned by argon-ion milling (SM-090101 Cross-Section Polisher, JEOL, Tokyo, Japan). Subsequently, a thin layer of carbon was vaporized on the surface (JEE-420T Vacuum Evaporators, JEOL), after which the specimens were examined using Field-emission-gun SEM (Feg-SEM; JSM-6701F, JEOL), being operated at 5 kV and using an annular semi-conductor detector.
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6

Microscopic Characterization of CAD-CAM Composites

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Using the methods described above, additional 1-mm thick and mirror-polished specimens were prepared and sandblasted using a laboratory sandblaster (Hi-Blaster III, Shofu, Kyoto, Japan Shofu, Kyoto, Japan) and at an air pressure of 0.2 MPa for 10 s, the device was held at a distance of 1 cm from the target surface. After coating the sandblasted surface with a thin layer of osmium (Neo Osmium Coater, Meiwafosis, Tokyo, Japan), Feg-SEM equipped with in-lens detectors (JSM-6701F, JEOL) was used to acquire high-resolution photomicrographs.
For SEM of the cross-sections, additional slice specimens were subjected to argon-ion milling (SM-090101 Cross-Section Polisher, JEOL) and osmium coating prior to Feg-SEM analysis. Three different specimens for each composite CAD-CAM block were examined.
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