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Multiphysics simulation software version 5

Manufactured by Comsol

COMSOL Multiphysics Simulation Software, Version 5.1 is a comprehensive software package for modeling and simulating physics-based problems. It provides a unified workflow for electrical, mechanical, fluid, and chemical applications.

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2 protocols using multiphysics simulation software version 5

1

Numerical Simulation of Electrospinning

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Numerical simulation of the electric field strength and distribution were performed (COMSOL Multiphysics Simulation Software, Version 5.1 COMSOL Inc.). The MEW printhead and collecting substrate geometries (flat, wedge and curved) were designed according to the printer and substrates used. The electric conductivity of the stainless-steel printhead and collector was set to 1.45 × 106 S m−1, and of the air volume to 1 × 10−15 S m−1. Relative permittivity of 2.3 and 2.7 where defined for substrate materials PLC and MgP, respectively. GelMA and Al were defined as conductive materials (electrical conductivities of 1.25 × 10−3 S m−1 and 3.20 × 107 S m−1, respectively). The electric field strength and distribution was simulated by applying a negative potential to the collector 9 kV, while the spinneret was kept at 0 kV (grounded) at a distance of 6 mm for flat substrates; 6 mm and 31 mm for the wedge substrates; and 6 mm and 11 mm for curved substrates. For simplicity, no charge dissipation was considered.
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2

Numerical Simulation of Electrospinning

Check if the same lab product or an alternative is used in the 5 most similar protocols
Numerical simulation of the electric field strength and distribution were performed (COMSOL Multiphysics Simulation Software, Version 5.1 COMSOL Inc.). The MEW printhead and collecting substrate geometries (flat, wedge and curved) were designed according to the printer and substrates used. The electric conductivity of the stainless-steel printhead and collector was set to 1.45 × 106 S m−1, and of the air volume to 1 × 10−15 S m−1. Relative permittivity of 2.3 and 2.7 where defined for substrate materials PLC and MgP, respectively. GelMA and Al were defined as conductive materials (electrical conductivities of 1.25 × 10−3 S m−1 and 3.20 × 107 S m−1, respectively). The electric field strength and distribution was simulated by applying a negative potential to the collector 9 kV, while the spinneret was kept at 0 kV (grounded) at a distance of 6 mm for flat substrates; 6 mm and 31 mm for the wedge substrates; and 6 mm and 11 mm for curved substrates. For simplicity, no charge dissipation was considered.
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