Thermogravimetric
analysis (TGA) was performed on TA SDT650 thermal analysis mass spectrometry
under nitrogen. The surface composition of BN and BN-PCPA was conducted
via an X-ray photoelectron spectroscopy (XPS, Thermo Electron Corporation)
system by using ESCALAB 250. Scanning electron microscopy (SEM; FEI
Quattro S field-emission microscope) and high-resolution transmission
electron microscopy (HR-TEM; Hitachi H9000 microscope) were utilized
to observed the microsturcture of samples. An Instron 3366 tensile
apparatus was used to measure the stress–strain curves at a
speed of 50 mm/min. The elastic modulus values of samples were determined
by the slopes of stress–strain curves at 10% strain. The dielectric
behavior of composites was determined by using a broadband dielectric
spectrometer (Novocontrol, Alpha-A, GmbH Germany). The thermal conductivity
of the sample with a diameter of 20 mm and a thickness of 1 mm was
characterized via a DRL-III flat thermal conduction instrument (Xiangtan,
China). The following equation was as follows where λ, Q, X, and A were the thermal
conductivity
W/(m·K), heat flux (W), thickness (m), and area (m2) of the samples, respectively. ΔT was the
temperature difference.
analysis (TGA) was performed on TA SDT650 thermal analysis mass spectrometry
under nitrogen. The surface composition of BN and BN-PCPA was conducted
via an X-ray photoelectron spectroscopy (XPS, Thermo Electron Corporation)
system by using ESCALAB 250. Scanning electron microscopy (SEM; FEI
Quattro S field-emission microscope) and high-resolution transmission
electron microscopy (HR-TEM; Hitachi H9000 microscope) were utilized
to observed the microsturcture of samples. An Instron 3366 tensile
apparatus was used to measure the stress–strain curves at a
speed of 50 mm/min. The elastic modulus values of samples were determined
by the slopes of stress–strain curves at 10% strain. The dielectric
behavior of composites was determined by using a broadband dielectric
spectrometer (Novocontrol, Alpha-A, GmbH Germany). The thermal conductivity
of the sample with a diameter of 20 mm and a thickness of 1 mm was
characterized via a DRL-III flat thermal conduction instrument (Xiangtan,
China). The following equation was as follows where λ, Q, X, and A were the thermal
conductivity
W/(m·K), heat flux (W), thickness (m), and area (m2) of the samples, respectively. ΔT was the
temperature difference.