The mechanical properties of the different PTK-UR and PEUR scaffold formulations were measured in compression at 37°C in a submersion compression clamp using the Q800 DMA. Cylindrical 6 × 6 mm scaffold samples were tested after incubation in phosphate buffered saline (PBS) for 7 days at 37°C. Using a preload force of 0.1 N, samples were compressed along the longitudinal axis at a strain rate of 10% per min until 60% compressive strain was achieved. The Young’s modulus for each sample was calculated from the slope of the initial linear region of each respective stress-strain curve after toe-in.
Dma q800
The DMA Q800 is a dynamic mechanical analyzer that measures the viscoelastic properties of materials. It provides quantitative data on a material's stiffness, damping, and other mechanical characteristics.
Lab products found in correlation
398 protocols using dma q800
Thermal and Mechanical Analysis of PTK-UR and PEUR Scaffolds
Dynamic Mechanical and Tensile Properties
Tensile tests were carried out at 21 °C in a Q-800 DMA equipment (TA Instruments) according to the ISO 527-3 method and with rectangular compression-molded films 14.0 mm × 8.0 mm × 0.3 mm that had previously been conditioned at 21 °C and 50% relative humidity for a period of at least 48 h. The samples were placed between a fixed and a moveable film clamp, and the experiments were performed in triplicate in tensile mode. The tensile strength (σ), Young’s modulus (E) and elongation at break (ε) were determined [73 (link)].
Comprehensive Material Characterization
Characterization of Polymer Materials
Thermal and Viscoelastic Properties of PLA
DSC Q200, the thermal properties of the samples were studied. Two
tests per sample were performed to create a standard deviation. Approximately,
5 mg was cut from each sample and was encapsulated in aluminum. With
a 50 mL/min–1 nitrogen flow rate, the samples were
ramped at 5.00 °C/min using a heat/cool/heat method. The crystallinity
of the samples was calculated using the following formula where ΔHm is the measured melting enthalpy, ΔHcc is the measured enthalpy of cold crystallization, and
ΔHm0 is the theoretical melting enthalpy of 100%
crystalline PLA, taken
from the literature to be 93.7 J/g4.
Dynamic thermal
analysis (DMA) was performed with the use of a DMA Q800 (TA Instruments,
New Castle, DE). All measurements were carried out at a constant frequency
of 1 Hz and strain amplitude of 0.01%. The temperature range was 30–150
°C, whereas the heating rate was 3 °C/min. The viscoelastic
properties were collected from rectangular samples (3.2 × 12.7
× 50 mm) using the dual cantilever measurement mode.
The
heat deflection temperature (HDT) of the samples was acquired
using TA Instruments DMA Q800 following ASTM D648. The desired stress
of 0.455 MPa was applied to the midsection of the sample, and a heating
rate of 2 °C/min was utilized. The strain rate was measured at
250 μm (0.2% strain), and two tests were performed on each type
of sample.
Tensile and Adhesion Testing of PEDOT:Nafion Fibers
fibers was performed using a DMA Q800 (TA Instruments) with a ramped
force of 0.5 N min–1. The dynamic characterization
was performed by subjecting a fiber to 100 cycles of 6 s displacement
to 10% strain followed by 30 s release. The electrical resistance
was measured in situ using a Keysight U1253B multimeter collecting
1 data point s–1. Samples of the Nafion/ABS blends
for tensile testing were prepared in a hot press (AB Nike Hydralik)
at 240 °C in two steps, 5 ton for 2 min and 10 tons for 3 min,
with 0.1 mm spacers. The resulting films were cut into strips with
a width of 4 mm and a thickness varying from 0.07 to 0.13 mm. The
Young’s modulus of Nafion/ABS blends was determined from tensile
tests at a force rate of 1 N min–1 using a DMA Q800
(TA Instruments). To test the adhesion between Nafion/ABS blends,
ABS and HIPS, rectangular test strips (30 mm × 5 mm × 0.2
mm) were 3D printed onto printed substrates (thickness 0.2 mm). At
one end, the strips were separated from the substrate by a thin paper.
The loose ends of the strips and the substrate were mounted into a
DMA TA Q800, and peeling tests were performed with a constant displacement
rate of 1 mm min–1.
Dynamic Mechanical Analysis of EFMs
Cyclic Tensile Strain Analysis of Rectangular Gels
Stress Relaxation Behavior of Composite Bars
Comprehensive Surface Morphology Analysis
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