Nanoscope 5 multimode setup

XRD measurements
were performed to investigate the crystal structures of the different
thin films and microelectrodes using an Empyrean X-ray diffractometer
(Malvern Panalytical, U.K.) with a copper radiation source in grazing-incidence
and Bragg–Brentano geometry. For the grazing-incidence scans,
which were performed at an incidence angle of 2 °, a parallel
beam mirror on the incident-beam side and a parallel-plate collimator,
together with a scintillation detector, on the diffracted-beam side
were employed. A focusing mirror on the incident-beam side and a semiconductor
area detector (GaliPix3D, Malvern Panalytical, U.K.) on the diffracted-beam
side were applied for the measurements in Bragg–Brentano geometry.
In order to focus the beam onto individual microelectrodes, a 0.3 mm
slit was used.
Atomic force microscopy (AFM) measurements were
conducted in order to analyze the surface structures of different
LSC samples [Nanoscope V multimode setup (Bruker, USA) operated in
tapping mode].

The as-prepared samples
were characterized by means of X-ray diffraction (XRD), atomic force
microscopy (AFM), and transmission electron microscopy (TEM). Out-of-plane
θ-2θ diffractograms were acquired for 2θ angles
of 10°–90° on an Empyrean X-ray diffractometer (Malvern
Panalytical, UK) using a hybrid Kα monochromator of type 2XGe(220)
on the incident beam side and a GaliPIX3D area detector in scanning
line mode on the diffracted beam side. AFM images of the sample surface
were recorded on a Nanoscope V multimode setup (Bruker) and analyzed
using Gwyddion.^{16 (link)} An electron-transparent
lamella for TEM imaging was prepared via standard lift-out techniques
on a Thermo Fisher Scios 2 DualBeam FIB/SEM, operating with a Ga-ion
beam at 30 kV accelerating voltage. After thinning at 30 kV, a final
low-voltage cleaning step was performed at 5 and 2 kV to reduce the
extent of superficial amorphization on the lamella. All TEM measurements
were carried out on a JEOL JEM-2100F field-emission gun microscope
equipped with an image-side spherical aberration corrector, operating
at an accelerating voltage of 200 kV. TEM images were recorded using
a Gatan Orisu SC1000 CCD camera. High-resolution TEM images were post-processed
using an average background subtraction filter (ABSF).