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Titan3 g2 s tem

Manufactured by Thermo Fisher Scientific

The Titan3 G2 S/TEM is a scanning/transmission electron microscope designed for high-resolution imaging and analytical capabilities. It provides advanced electron optics and a range of detectors to enable detailed characterization of a variety of samples.

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2 protocols using titan3 g2 s tem

1

STEM Imaging of WS2 Triangles

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WS2 triangles grown on the SiO2 substrate were transferred to a QUANTIFOIL gold TEM grid. Poly(methyl methacrylate) (PMMA) was spin-coated onto WS2 triangles as a supporting film during transfer. The SiO2 layer was etched away by soaking the substrate in 1 M sodium hydroxide (NaOH) aqueous solution; the PMMA/WS2 triangle film was cleaned using distilled water several times, followed by fishing out of the film with the QUANTIFOIL grid. After the film was completely dried, the PMMA layer was cleaned using acetone and isopropanol. STEM was carried out by FEI Titan3 G2 S/TEM operating at 80 keV. To reduce irradiation damage, we kept the beam current below 40 pA. A high-angle ADF (HAADF) detector was used for STEM-ADF imaging. To enhance the contrast from sulfur atoms to ensure accurate counting of monosulfur vacancies, we used a LAADF condition rather than a HAADF condition. For most images in the text, a Gaussian blur filter was applied by the ImageJ program to reduce noise and enhance the visibility of structural details, but raw images were used to acquire line profiles of ADF intensity. STEM-ADF image simulation was conducted by the QSTEM package (49 ). Simulation parameters, such as acceleration voltage, spherical aberration (C3 and C5), and convergence angle and inner/outer angle for the HAADF detector, were set according to the experimental conditions.
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2

Pt/Cu/WO_x Thin Film ReRAM Fabrication

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The Pt/Cu/WOx film was deposited at room temperature (RT) on TiN/Si where TiN acted as the BE. The Pt (100 nm thick) and Cu (30 nm thick) layers were deposited using RF (radio frequency) sputtering with Ar while the WOx layer (20 nm thick) was prepared using reactive RF sputtering (using Ar gas with 20% O2). The schematics of a reference ReRAM device in the conventional device geometry is shown in Fig. 6(a). These devices were prepared by using photolithography followed by reactive ion etching (RIE) and/or lift-off. The circular contact hole was 4 μm in diameter. For IV measurements (performed in air at room temperature using a Yokogawa GS610 source-measure-unit (SMU)), a resistor of 1 kΩ was serially connected to prevent permanent breakdown of ReRAM during Set switching. The TEM sample shown in Fig. 6(b) was obtained after processing using the ion shadow method44 45 46 . Elemental mapping [from a different sample to that shown in Fig. 6(b)] is shown in Fig. 6(c), which was measured using EDX (energy dispersive X-ray spectroscopy) with a FEI Titan3 G2 STEM (scanning TEM). Clear stacking was identified.
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