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Precision etching coating system

Manufactured by Ametek
Sourced in United States

The Precision Etching Coating System is a laboratory equipment designed for the precise application of coatings and etchants. The system provides controlled and consistent application of materials to ensure accurate and repeatable results. The core function of this product is to enable controlled deposition of coatings and etching of surfaces for various research and manufacturing applications.

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2 protocols using precision etching coating system

1

Inhibiting Staphylococcus aureus Biofilms with 13-cis-Retinoic Acid

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After forming S. aureus biofilms in 96-well plates in the presence or absence of 13-cis-retinoic acid (0, 2, 5, or 10 μg/mL) for 24 h at 37°C, planktonic cells were removed by washing three times with distilled water, and live biofilm cells were observed by the iRiS™ Digital Cell Imaging System (Logos Biosystems, Anyang, Korea). Color-coded 3D biofilm images were generated using ImageJ.1Also, SEM was used to observe biofilm reduction by 13-cis-retinoic acid, as previously reported (Park et al., 2022 (link)). S. aureus ATCC 6538 cells (~107 CFU/mL) were inoculated into 1 mL of fresh LB medium with or without 13-cis-retinoic acid (0, 2, 5, or 10 μg/mL) in a 96-well plate. A piece of nylon membrane (~ 0.16 cm2) was placed in each well, and S. aureus cells were cultured for 24 h at 37°C without agitation. Biofilms developed on the membrane were then fixed with a glutaraldehyde (2.5%) and formaldehyde (2%) for 24 h, post-fixed with OsO4 (1%), and dehydrated with ethanol and isoamyl acetate (99%). After drying biofilms using critical-point dryer (HCP-2, Hitachi, Tokyo, Japan), biofilm cells were coated with Precision Etching Coating System (Gatan, Inc., Pleasanton, United States) and observed under a field emission scanning electron microscope S-4800 (Hitachi, Tokyo, Japan).
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2

Bioglass Powder Sputter-Coating Characterization

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The commercial 45S5 BG and Cu-MBGN powders were sputter-coated with 5 nm Au/Pd layer (90% Au/10% Pd), evaporated with argon plasma at 6 kV using the Precision Etching Coating System (Model 682, Gatan Inc., Pleasanton, CA, USA).
FE-SEM images of prepared samples were taken with a scanning electron microscope JSM7000F (JEOL Ltd., Tokyo, Japan) linked to the energy-dispersive X-ray analyzer EDS/INCA 350 (Oxford Instrument, Abingdon, UK).
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