The thermomechanical property of the synthesized polymer network was analyzed by a TA Instruments Q800 Dynamic Mechanical Analyzer. Using the multi-frequency mode, the three-point bending test was carried out with fixed displacement. The temperature was scanned at a rate of 10 °C/min. The thermal expansion behavior was also measured by the dynamic mechanical analysis (DMA) under the controlled force mode. The fixture was changed to the tensile clamps. The cyclic temperature was scanned from −25 to 180 °C.
Q800 dynamic mechanical analyzer
Manufactured by TA Instruments
Sourced in United States, United Kingdom
The Q800 dynamic mechanical analyzer (DMA) is a laboratory instrument designed to measure the viscoelastic properties of materials. It applies an oscillating force to a sample and measures the resulting deformation, providing data on the material's stiffness, damping, and other mechanical characteristics.
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Lab products found in correlation
Universal analysis software, by TA Instruments (2 mentions)
Q series software, by TA Instruments (2 mentions)
S 4200 sem, by Hitachi (2 mentions)
Tga 550 thermal analyzer, by TA Instruments (1 mentions)
Tg209f1 tga, by Netzsch (1 mentions)
Autograph ag x, by Shimadzu (1 mentions)
Polarized microscopy, by Leica camera (1 mentions)
Su8010 scanning electron microscope, by Hitachi (1 mentions)
Ix71 inverted fluorescence microscope, by Olympus (1 mentions)
Nicolet 6700 ft ir spectrometer, by Thermo Fisher Scientific (1 mentions)
X pert pro diffractometer, by Malvern Panalytical (1 mentions)
Tensor 27 infrared spectrometer, by Bruker (1 mentions)
Ultra plus, by Zeiss (1 mentions)
45 protocols using q800 dynamic mechanical analyzer
1
Thermomechanical Analysis of Polymer Network
2
Dynamic Mechanical Analysis of Film Strips
3
Tensile and Compression Testing of External Device Leads
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Tensile and compression tests were performed with the Q800 Dynamic Mechanical Analyzer (TA Instruments Inc., United States) to determine the force required to connect and disconnect an external lead to and from the device. Tensile clamps were used for all tests, and position and mass calibrations were conducted before each test session. The device wires were bent 180 degrees to avoid interference with the clamps. Starting with the tensile test, the device was secured in the bottom clamp with the pin holes facing upward and the edge of the connector leveled with the edge of the clamp. A machine pin with the plastic casing still attached was inserted into one of the device channels. The alignment of the pin was visually checked to be fully vertical before continuing, readjusting the clamped device if necessary. The bottom clamp was raised to the zero position and the top clamp was secured around the machine pin casing. Tensile force was applied at a rate of 0.5 N/min until the pieces were separated, which registered as sample yield by the DMA software, stopping the test. The bottom clamp was then locked in position so that the tip of the machine pin and top of the device were almost touching. Compressive force was applied at a rate of −0.5 N/min until the pin was fully inserted. The test was stopped manually once the DMA software was recording no significant displacement.
4
Dynamic Mechanical Analysis of Irradiated Polymers
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The DMA tests were done using a Q800 Dynamic Mechanical Analyzer (TA Instruments, Baesweiler, Germany). The measurements were carried out in the uniaxial tensile mode, at a constant frequency of dynamic mechanical loading of 1 Hz with an amplitude of 20 μm, in a temperature range from 176 K up to 573 K, and at a constant heating rate of 3 K·min−1. The amplitude of applied dynamic stress was 0.1 MPa, and the strain rate was 0.1 s−1. The measurements for each radiation dose were performed on 10 specimens. The average values of storage modulus, loss modulus, and loss tangent for each temperature and applied radiation dose were computed; they are presented in Figure 1 . The measurement uncertainty was approx. 2%.
5
Dynamic Mechanical Analysis for Shape Memory
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Dynamic mechanical analysis (DMA) was used to determine the glass transition temperature (Tg). Tg can be used to examine the effect of the filler on the shape memory performance. All samples were studied using a TA Instruments Q800 Dynamic Mechanical Analyzer with a film tension accessory. The test was run in Multi-frequency Strain mode to obtain Tg at a maximum frequency of 0.1 Hz. To monitor shape memory strain, the instrument was run in Controlled Force mode. Two cycles of heating and cooling were carried out; stresses and resulting deformation strains were measured.
6
Thermomechanical Characterization of Nanopapers
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Thermomechanical properties of nanopapers at different temperatures
were investigated by using a Q800 dynamic mechanical analyzer by
TA Instruments, in tensile mode, using 5 × 20 mm2 specimens
cut from nanopapers. Tests during a heating ramp were carried out
from RT to 150 °C at a heating rate of 2 °C/min, strain
of 0.05%, and frequency of 1 Hz. Deformation under constant load tests
(referred to as creep tests) were carried out at 120 °C under
5 MPa, for 8 h, followed by deformation recovery at zero load at the
same temperature for 8 h.
were investigated by using a Q800 dynamic mechanical analyzer by
TA Instruments, in tensile mode, using 5 × 20 mm2 specimens
cut from nanopapers. Tests during a heating ramp were carried out
from RT to 150 °C at a heating rate of 2 °C/min, strain
of 0.05%, and frequency of 1 Hz. Deformation under constant load tests
(referred to as creep tests) were carried out at 120 °C under
5 MPa, for 8 h, followed by deformation recovery at zero load at the
same temperature for 8 h.
7
Polymer Film Characterization by DMA
8
Dynamic Mechanical Analysis of Polymer Specimens
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Dynamic mechanical analysis (DMA) experiments were carried out in tension using a TA Instruments Q800 dynamic mechanical analyzer and 4 × 30 × 0.4 mm rectangular specimens (n = 5). The rectangular specimens were machined with a 40W Gravograph LS100 CO2 laser machining device using a 38.1 mm lens, a speed setting of 5, a power setting of 10, and a laser resolution of 1200 dots per inch. Specimens were cleaned with a methanol damp Kimwipe, driedat 90° C under vacuum at 1 Torr, and subsequently stored under desiccation prior to being tested. DMA experiments were carried out from −20 to 140°C in the DMA multifrequency/strain instrument mode using a frequency of 1Hz, a strain of 0.1%, a preload force of 0.01N, a force track of 150%, and a heating rate of 2°C/min. Data were recorded using TA Instruments Q-series software and analyzed using TA Instruments Universal Analysis software.
9
Bulk Rigidity Moduli Characterization
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The macroscopic (hereafter, bulk) rigidity moduli were determined using the TA Instruments Q800 Dynamic Mechanical Analyzer (DMA). A standard 12 mm compression clamp holder was used in all measurements. The measurements were performed under controlled force/strain rate for the static mode of operation. To determine the static bulk modulus, a simple quasistatic compression mode was used (the sample was clamped in between two parallel 12 mm round plates). The static modulus was calculated from the slope of the stress/strain curve. This study was conducted at room temperature (22–24 C) using the maximum force up to 18 N. The bulk values of the Young’s modulus were calculated using the strain less than 0.1% (as recommended by the manufacturer).
Dynamic parameters of the material, such as storage and loss moduli were measured in the multi-stress/strain mode (using the same clamp setup). In this mode, the cycling loading was applied to the sample at the rate of 10–100 Hz and the maximum drive force up to 10N N (which resulted in the amplitude of ~15–30 μm).
Dynamic parameters of the material, such as storage and loss moduli were measured in the multi-stress/strain mode (using the same clamp setup). In this mode, the cycling loading was applied to the sample at the rate of 10–100 Hz and the maximum drive force up to 10N N (which resulted in the amplitude of ~15–30 μm).
10
Frequency-Dependent Viscoelastic Properties of Cereal Kernels
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Frequency sweep experiments were conducted in compression mode, utilizing a TA Instruments Q800 dynamic mechanical analyzer (DMA, New Castle, DE, USA). Every kernel was placed between the bottom and top parallel plates of the DMA with the germ side facing down. A preload of 0.1 N was supplied to guarantee proper contact between the compression plate and the kernel’s surface. The frequency sweep (1–30 Hz) experiments were conducted at 0.35% strain at four temperatures (45 °C, 40 °C, 35 °C, and 30 °C) and the ITF data were acquired.
Power law equations (Equations (1) and (2)) were employed to describe the frequency dependence of E′ and E″ [16 (link)]:
where f (Hz) denotes the frequency; E′ (MPa) and E″ (MPa) represent the storage modulus and loss modulus, respectively; n′ (dimensionless) and n″ (dimensionless) denote the frequency exponents; and K′ (MPa·sn) and K″ (MPa·sn) denote the proportionality constants and reflect the elasticity and viscous property, respectively.
Power law equations (Equations (1) and (2)) were employed to describe the frequency dependence of E′ and E″ [16 (link)]:
where f (Hz) denotes the frequency; E′ (MPa) and E″ (MPa) represent the storage modulus and loss modulus, respectively; n′ (dimensionless) and n″ (dimensionless) denote the frequency exponents; and K′ (MPa·sn) and K″ (MPa·sn) denote the proportionality constants and reflect the elasticity and viscous property, respectively.
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