Multipak v8.1c software
MultiPak v8.1c software is a data acquisition and analysis tool designed for use with Physical Electronics' analytical instrumentation. The software provides a platform for collecting, processing, and managing data generated by various lab equipment. Its core function is to enable users to control, acquire, and analyze data from Physical Electronics' instruments in a standardized and efficient manner.
7 protocols using multipak v8.1c software
XPS Analysis of Polymer Surface Changes
XPS Analysis of Coated Polymer Foils
The photoelectrons were detected with a hemispherical analyzer located at a take-off angle of 45° with respect to the normal sample surface. Survey-scan spectra were acquired at a pass energy of 187.85 eV, while, for C 1s, individual high-resolution spectra were taken at a pass energy of 29.35 eV with a 0.125-eV energy step. An additional electron gun was used for charge neutralization. All spectra were referenced to the main C 1s peak of the carbon atoms, which was assigned a value of 284.8 eV. The spectra were analyzed using MultiPak v8.1c software (Ulvac-Phi Inc., Kanagawa, Japan, 2006) from Physical Electronics, which was supplied with the spectrometer.
XPS Characterization of Material Surfaces
XPS Analysis of Plasma-Treated Polymers
Surface Morphology and Composition Analysis
The chemical composition of the samples was analyzed by X-ray photoelectron spectroscopy (XPS). The characterization was performed by using an XPS (TFA XPS Physical Electronics, Münich, Germany). The samples were excited with monochromatic Al Kα1,2 radiation at 1486.6 eV over an area with a diameter of 400 µm. Photoelectrons were detected with a hemispherical analyzer positioned at an angle of 45° with respect to the normal of the sample surface. Survey spectra were measured to determine the surface composition—i.e., the presence of any other elements except carbon. The survey spectra were measured at a pass energy of 187 eV with an energy step of 0.4 eV. The measured spectra were analyzed using MultiPak v8.1c software (Ulvac-Phi Inc., Kanagawa, Japan, 2006) from Physical Electronics, which was supplied with the spectrometer. Standard sensitivity factors were used for the calculation of the surface composition.
XPS Characterization of Plasma-Treated Polystyrene
XPS Characterization of Material Composition
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