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Helios nanolab g3

Manufactured by Thermo Fisher Scientific
Sourced in United States

The Helios Nanolab G3 is a focused ion beam (FIB) scanning electron microscope (SEM) system designed for high-resolution imaging and nanoscale sample preparation. It combines a high-performance SEM with a precise FIB column to enable advanced materials characterization and site-specific sample preparation.

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5 protocols using helios nanolab g3

1

SEM Imaging of Ti-PP Mesh Surfaces

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FEI Helios Nanolab G3 (FEI Company, USA) and Helios G4 DualBeam (ThermoFisher Scientific, USA) microscopes were employed for surface morphology observations of both explanted Ti‐PP mesh samples. In contrast to common SEM analysis practice, samples were not previously treated with a conductive coating by deposition. This approach was selected to aid in the visualization of the Ti coating present on the Ti‐PP meshes. An accelerating voltage of 1–2 keV at typical chamber vacuum pressures in the range of 10−6 mbar and a working distance of 4 mm were chosen to avoid sample damage through surface charging. An Everhart–Thornley Detector (ETD) was selected for low magnification of SE images and a Through Lens Detector (TLD) for high magnification SE images.
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2

Elemental Analysis of Ti-PP Mesh

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FEI Helios Nanolab G3 (FEI Company, USA) SEM equipped with an Energy Dispersive X‐ray Spectroscopy (EDS) detector (Oxford Instruments, UK) was used to capture EDS spectra. EDS spectra were taken from the center of each Ti‐PP mesh filament to mitigate any effects associated with fiber orientation. The spectra were obtained with a 10 keV accelerating voltage using a 13 nA probe current at a working distance of 5 mm. Data analysis was automated by the application of Aztec EDS analysis software (Oxford Instruments, UK).
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3

Morphology of Spirulina and Conductive Micro-Helices

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The morphology of Spirulina platensis in its natural form was observed using an optical microscope (SMARTR, Chongqing Ott optical instruments Co., Ltd., Chongqing, China). The morphologies of the PPy micro-helix, PANI micro-helix, and PEDOT micro-helix were observed using a field emission scanning electron microscope (FESEM) (Helios NanoLab G3, FEI Company, Brno, Czech Republic and Nova Nano SEM 450, FEI Company, Eindhoven, The Netherlands) with the accelerating voltages of 2 and 10 kV.
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4

Characterization of Bismuth Thin Films

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The morphology and grain size of the Bi films were characterized by a scanning electron microscope (SEM, FEI Helios NanoLab G3, FEI, Hillsboro, OR, USA). The thickness of the films was measured by a Bruker DektakXT (Bruker, Karlsruhe, Germany) step profile. The XRD pattern of Bi films was achieved by a Panalytical X’Pert PRO MPD diffractometer (Cu λ = 1.541874 Å, Malvern Panalytical Ltd., Malvern, United Kingdom) with the incidence angle fixed at 0.5°, and from 10° to 90° with a 2θ scanning speed of 0.5° per step. The sheet resistance was tested by mapping measurements with a CDE ResMap 178 system (Creative Design Engineering Inc., Cupertino, CA, USA) based on the van der Pauw method. The elements analysis was characterized by an X-ray photoelectron spectroscopy (XPS, ESCALAB 250Xi, Thermo Fisher Scientific, Waltham, MA, USA). The RRR was measured in a liquid Helium system with a probe and a source meter. The absorptivity of the electroplated Bi films with different thicknesses for 10 keV and 15.6 keV X-ray radiation were evaluated using a home-made single-energy X-ray source system based on crystal diffraction.
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5

Comprehensive Coating Characterization Protocol

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The coatings were characterised using various analytical techniques:
• Coating phase composition and texture analyses were carried out by high angle XRD using Malvern PANanalytical Empyrean, Malvern, UK diffractometer with Co source, whereas low angle XRD was employed to define the superlattice period, Δ (bilayer thickness) of the coating. • FEI Nova-NanoSEM 200 scanning electron microscope was used to image microstructure and surface morphology of the coatings. • The hardness and Young's modulus were measured in a nano indentation tester (CSM Instruments SA) using Berkovich indenter.
The nano hardness value, Hp was calculated using the Oliver-Pharr method under an applied normal a load of 10 mN. This value was averaged after producing 20 indentations. The same instrument was used to produce the loading and unloading curves for different indentation loads in the range of 10 mN-300 mN. • Coating behaviour (crack formation) under a concentrated load applied by nanoindentation was investigated by focused ion beam cross-sections (FIB) using the FEI Helios Nanolab G3 with a Ga + ion source operated at 30 kV instrument. • Cross-sectional transmission electron microscopy (XTEM) was employed to image the nanoscale multilayer coating architecture.
The FIB sections were examined using a cold field emission gun (c-FEG) JEOL F200 TEM.
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