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Silicon wafers

Manufactured by MicroChemicals
Sourced in Germany

Silicon wafers are thin, circular slices of crystalline silicon material used as the foundation for semiconductor devices and integrated circuits. They serve as the primary substrate for the fabrication of electronic components, providing a platform for the deposition, doping, and patterning of various materials to create the desired electronic structures.

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3 protocols using silicon wafers

1

Fabrication of Nanostructured Surfaces

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Silicon wafers were purchased from Microchemicals GmbH (Ulm, Germany), Si-Masters were from Amo GmbH (Aachen, Germany), Trichloro(1H,1H,2H,2H-perfluorooctyl)silane, Tetrachloroaurate trihydrate (HAuCl4·3H2O), trisodium citrate (Na3C6H5O7), poly(ethylene glycol) diacrylate (PEGDA, Mw 575) and 2-hydroxy-4′-(2-hydroxyethoxy)-2-methylpropiophenone (photoinitiator-PI Irgacure 2959) were purchased from Sigma-Aldrich Chemie GmbH (Steinheim, Germany). (3-Aminopropyl)trimethoxysilane (APTMS) was bought from ABCR GmbH & Co. KG (Karlsruhe, Germany). Poly(dimethylsiloxane) (PDMS) and the curing agent are from Dow Corning GmbH (Wiesbaden, Germany). All the chemicals were used without further purification.
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2

Fabrication of Gold Nanoparticle-Functionalized PEG Hydrogels

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Poly(ethylene glycol)diacrylate
(PEG, Mw 575) and 2-hydroxy-4′-(2-hydroxyethoxy)-2-methylpropiophenone
(photo-initiator—Irgacure 2959), octadecyl-trichlorosilane
(octadecyl-silane), trichloro(1H,1H,2H,2H-perfluorooctyl)silane (perfluoro-silane),
tetrachloroaurate trihydrate (HAuCl4·3H2O), and trisodium citrate (Na3C6H5O7) were purchased from Sigma-Aldrich Chemie GmbH (Steinheim,
Germany). Eight-arm PEG was purchased from Jenkem technology (Plano,
TX, USA). Silicon wafers were purchased from Microchemicals GmbH (Ulm,
Germany). Isopropanol, acetone, ammonia (25%), hydrogen peroxide (H2O2 30%), concentrated sulfuric acid (H2SO4 98%), and toluene were purchased from Carl Roth (Karlsruhe,
Germany). (3-Aminopropyl)trimethoxysilane (amino-silane) was from
abcr GmbH (Karlsruhe, Germany), and PDMS and the curing agent were
from Dow Corning GmbH (Wiesbaden, Germany). All chemicals were used
without further purification.
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3

Glass-Silicon-Glass Microfluidic Device

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The glass–silicon–glass (SiG) microfluidic device comprises three layers, where an etched silicon wafer was sandwiched between two glass layers. The device was fabricated from borosilicate glass (referred to in the article as glass) and silicon wafers, purchased from MicroChemicals, Germany. Capillaries made of fused silica of 75 μm inner diameter (ID) and 150 μm outer diameter (OD) were purchased from Polymicro Technologies (Sweden). Polytetrafluoroethylene (PTFE) tubing of 1/16′′ OD and 1/32′′ ID was purchased from Elveflow, France. UV curable adhesive NOA81 (Norland Products, APM Technica, Germany) was used to bond together the silica capillaries with the SiG chip.
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