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Dma q800 dynamic mechanical analyzer

Manufactured by TA Instruments
Sourced in United States

The DMA Q800 is a dynamic mechanical analyzer (DMA) manufactured by TA Instruments. It is a laboratory instrument used to measure the viscoelastic properties of materials, such as their stiffness, damping, and glass transition temperature, under various temperature, frequency, and strain conditions.

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8 protocols using dma q800 dynamic mechanical analyzer

1

Thermal Post-Cure Effects on UHMWPE Composites

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Dynamic mechanical properties of UHMWPE/poly(3BOP-daC12) composites were measured using a DMA Q800 dynamic mechanical analyzer (TA Instruments, New Castle, DE, USA). Five composite specimens with nominal dimensions of 60 × 12 mm were cut from a 254 × 254 × 1.5 mm composite plate sample that had been polymerized using a standard two-hour polymerization cycle. Four of the specimens were further subjected to post-cure heat treatments ranging from 2 to 8 h.
Heat treating was carried out in a laboratory convection oven that was pre-heated to 120 °C. One specimen was removed from the oven every two hours; yielding specimens with heat-treatment times of 2, 4, 6, and 8 h. Each specimen was constrained between two flat aluminum plates to prevent warping during heat-treatment and cooling.
DMA specimens were tested in isostrain mode at a constant strain amplitude of 0.1% and a frequency of 1 Hz. Load was applied using a dual cantilever fixture. Temperature was ramped from room temperature to 140 °C at a heating rate of 5 °C/min.
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2

Thermal-Mechanical Characterization of PLA/PBAT Blends

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Characterization of thermal mechanical properties of pure PLA, pure PBAT, and PLA/PBAT-MDI blends were performed with TA Instruments' DMA Q800 Dynamic Mechanical Analyzer (USA) using a 10 mm × 4 mm × 1 mm sample. The experiment was carried out in tension mode at a constant heating rate of 3 °C min−1, from −60 to 120 °C. The deformation amplitude and frequency were set at 15 μm and 1 Hz, respectively.
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3

Characterization of SiCWPU Membranes

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Fourier-transformed infrared (FTIR) spectra were collected using a Nicolet 560 FTIR spectrometer (Nicolet, Waltham, MA). The sizes of SiCWPU dispersions were measured via dynamic light scattering (DLS). The static contact angle of water was measured on the surfaces of films using a DSA30 contact angle system (KRUSS Co.). Dynamic mechanical analysis (DMA) was carried out using a DMA Q-800 dynamic mechanical analyzer (TA Instruments). X-ray photoelectronic spectroscopy (XPS) was performed using an XSAM 800 spectrometer (Kratos, UK). Scanning electronic microscopy (SEM) data from the SiCWPU membranes were measured with a JSM-7500F microscope (model JEOL). The mechanical properties of the SiCWPU films were measured with a material testing machine (5967, Instron, USA).
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4

Dynamic Mechanical Analysis of Adhesives

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Example 3

Comparative Adhesive A, Adhesive 1-20 and Adhesive 1-40 of Table 1 were casted as 5 mil films and the dried. The adhesive samples were measured by TA Instruments DMA Q-800 Dynamic Mechanical Analyzer and the modulus was measured over −50° C. to 180° C. FIG. 1 shows that adhesives with the microspheres had higher strength (higher modulus) at elevated temperatures of about 5° C. to about 175° C. than the adhesive without any microspheres. Moreover, adhesive with highest volume of microspheres had the highest strength.

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5

Dynamic Mechanical Analysis of Adhesives

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Example 3

Comparative Adhesive A, Adhesive 1-20 and Adhesive 1-40 of Table 1 were casted as 5 mil films and the dried. The adhesive samples were measured by TA Instruments DMA Q-800 Dynamic Mechanical Analyzer and the modulus was measured over −50° C. to 180° C. FIG. 1 shows that adhesives with the microspheres had higher strength (higher modulus) at elevated temperatures of about 5° C. to about 175° C. than the adhesive without any microspheres. Moreover, adhesive with highest volume of microspheres had the highest strength.

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6

Compression Testing of Composite Materials

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A compression test was performed by using the submersion compression clamp on the DMA Q800 dynamic mechanical analyzer (TA Instrument). Seven square-shaped samples (16 × 16 mm2) with a thickness of 6 mm were tested for each type of composite. During the measurement samples were immersed in distilled water. The following testing conditions were applied in a quasi-static compression test: a compressive ramp of up to 60% strain and a strain rate of 10% per min, a preload of 0.05 N was used. In a cyclic loading/unloading test 10 cycles were continuously repeated. A relaxation time of 10 min was used in between each loading/unloading cycle.
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7

Mechanical Properties of Silk Fibers

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Mechanical testing was conducted using single silk fiber spun by the bimolters and the control trimolters. The cocoons were harvested and degummed as described in Section 2.6. The degummed silks were used as samples for characterization of the mechanical properties of the silk fibers. In this case, two fibroin brins were completely separated [23 (link),25 (link),34 (link)]. A single brin was used to test the mechanical properties. To ensure the accuracy of the data, we also used the remainder of the same brin for SEM to calculate the diameter for mechanical testing. A minimum of 25 tensile deformation tests were performed for each silk type on fibers from five separate cocoons. The tensile properties of individual brins were measured using a DMA-Q800 dynamic mechanical analyzer (TA, New Castle, DE, USA). Mechanical tests were performed according to a previously reported method [9 (link)]. For each tensile test, the fiber diameter was measured using JCM-5000 SEM (JEOL, Shoshima, Japan). The experimental data obtained relating to the mechanical properties were analyzed using the TA Universal Analysis software. Subsequently, the raw data were used to calculate the mechanical performance parameters using the ORIGIN8.0 software (OriginLab, Northampton, MA, USA).
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8

Compression Stress-Strain Characterization of Photocured Polymers

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The compressive stress-strain measurements were performed on cylindrical bulk discs of 300 μL of volume (diameter 8mm, height 6mm). Two solutions of PF (5 mg/mL or 8 mg/mL supplemented with 1% of PEG-DA) were cross-linked using a UV light at 365 nm (intensity 4–5 mW/cm2) for 5 min. Compression tests were performed with a DMA Q800 Dynamic Mechanical Analyzer (TA Instruments, New Castle, DE, USA) in the strain rate mode. All tests were performed at 25 °C with the following parameters: 0.003 N preloaded force, 5% min—1 strain rate and final deformation was set at 30%. Young’s modulus was calculated from the initial linear regions (0–5% of strain) of obtained stress-strain curves. Each measurement was performed in triplicate and results are reported as the mean ± standard deviation.
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