The strength tests were conducted using an electrohydraulic servo pressure test machine under microcomputer control manufactured by Changchun New Testing Machine Co., LTD. (Changchun, China) The main technical parameters included (i) high vacuum mode at resolutions of 1.0 nm-15 kV (TLD-SE, FEI company, Hillsboro, OR, USA), 1.4 nm-1 kV (TLD-SE); (ii) low vacuum mode at resolutions of 1.5 nm-10 kV (HelixTM detector, FEI company, Hillsboro, OR, USA), 1.8 nm-3 kV (HelixTM detector), and (iii) landing voltage of 50~30 kV. The morphological observation was made using the Nova NanoSEM50 series of ultra-high resolution scanning electron microscopy produced by FEI company (Hillsboro, OR, USA). X-ray diffraction (XRD) analyses were performed with CuKα radiation under 40 kV and 100 mA and a scanning speed at 8°/min.
Nova nanosem 50
The Nova NanoSEM 50 is a compact and versatile scanning electron microscope (SEM) designed for high-resolution imaging and analysis of a wide range of samples. It features a field emission gun (FEG) source, providing high-brightness electron beam for enhanced resolution and contrast. The system is equipped with a range of detectors, including secondary electron (SE), backscattered electron (BSE), and energy-dispersive X-ray (EDX) detectors, enabling comprehensive characterization of sample surfaces and compositions.
Lab products found in correlation
4 protocols using nova nanosem 50
Cement Mortar Strength Testing Protocol
The strength tests were conducted using an electrohydraulic servo pressure test machine under microcomputer control manufactured by Changchun New Testing Machine Co., LTD. (Changchun, China) The main technical parameters included (i) high vacuum mode at resolutions of 1.0 nm-15 kV (TLD-SE, FEI company, Hillsboro, OR, USA), 1.4 nm-1 kV (TLD-SE); (ii) low vacuum mode at resolutions of 1.5 nm-10 kV (HelixTM detector, FEI company, Hillsboro, OR, USA), 1.8 nm-3 kV (HelixTM detector), and (iii) landing voltage of 50~30 kV. The morphological observation was made using the Nova NanoSEM50 series of ultra-high resolution scanning electron microscopy produced by FEI company (Hillsboro, OR, USA). X-ray diffraction (XRD) analyses were performed with CuKα radiation under 40 kV and 100 mA and a scanning speed at 8°/min.
Comprehensive Materials Characterization Protocol
Morphology and Composition Analysis of Samples
Microstructural Analysis of Hydration Products
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