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Scios fib sem

Manufactured by Thermo Fisher Scientific

The Scios FIB.SEM is a focused ion beam scanning electron microscope (FIB-SEM) system designed for advanced materials characterization and nanofabrication. It combines high-resolution imaging capabilities of a scanning electron microscope (SEM) with the precision milling and site-specific sample preparation capabilities of a focused ion beam (FIB). The system provides users with the tools to perform cross-sectioning, material deposition, and precise sample preparation for further analysis.

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4 protocols using scios fib sem

1

Cellular Ultrastructure Imaging via FIB-SEM

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A Scios FIB.SEM (ThermoFisher) was used. It included an Everhart–Thornley Detector (ETD), an in-lens detector of backscattered electrons (BSE), and an in-the-column detector of secondary electrons (SE). The ETD was used for imaging of sample surfaces. The BSE detector was used for imaging cellular ultrastructure in 3D. The in-the-column SE detector was used to enhance fiducial marker contrast. The FIB was equipped with a Ga-ion source; for the 3D acquisition, a current of 0.4 nA and an acceleration voltage of 30 kV were used. The 3D acquisition in the FIB.SEM was controlled by the Slice&View software version 3 (Thermo Fischer).
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2

Characterization of Space-Weathered Grains

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Observation and sample preparation at Kyoto University are as follows. Surface morphology of about 300 grains was observed by a JEOL JSM-7001F FE–SEM. We observed them 15 pA current and 2 kV acceleration voltage. FIB sections were prepared using a Thermo Fisher Helios FIB–SEM. Selected areas were cut out with a 30 kV Ga+ ion beam. Before the extraction, the target areas were Pt-C coated by a 2 kV electron beam. Then, Pt-C was deposited on the target areas by 16 or 30 kV Ga+ ion beams. The sections mounted on the TEM grids were thinned to a thickness of 50 to 200 nm on the 12 or 16 kV Ga+ ion beams. The damaged layers were removed using a 2 kV Ga+ ion beam. About 70 FIB sections were prepared and investigated by the team. In parallel with the above work, we also performed FIB and (scanning) transmission electron microscopy under air-free conditions using an air-tight FIB–SEM sample transfer holder and a double tilt LN2 Atmos Defend Holder (Mel-Build Corporation) at Kyushu University. Another air-tight sample holder was used to transfer the samples. An Ar-filled glove box was used for sample handling. A Thermo Fisher Scios FIB–SEM was used for the observation of about 500 grains and for FIB processing of space-weathered grains. The conditions of the FIB psrocessing are similar to those at Kyoto University.
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3

Biofilm Imaging Procedure for SEM

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Biofilms were grown as described above but on 12 mm round poly-L-lysin-coated glass coverslip (Corning). Coverslips were washed 1× with PBS and fixed for 24 hr at room temperature with 2% (v/v) formaldehyde, 0.5% (v/v) glutaraldehyde, and 0.15% (w/v) Ruthenium Red in 0.1 M phosphate buffer (pH 7.4). Coverslips were then rinsed two times with phosphate buffer and post-fixed for 2 hr at 4°C with 1% osmium tetroxide and 1.5% (w/v), potassium ferricyanide (K3[Fe(CN)6]) in 0.065 M phosphate buffer (pH 7.4). Coverslips were rinsed once in distilled water followed by a stepwise dehydration with ethanol (i.e., 50%, 70%, 80%, 95%, 2 × 100%). Samples were then treated stepwise with hexamethyldisilizane (i.e., 50% HMDS/ethanol, 2 × 100% HMDS) and air-dried overnight. The next day samples were mounted on 12 mm aluminum stubs for SEM using carbon adhesive discs (Agar Scientific), and additional conductive carbon tape (Agar Scientific) was placed over part of the sample to establish a conductive path to reduce charging effects. To further improve conductivity, the surface of the samples was coated with a 6 nm layer of Au using a Quorum Q150R S sputter coater. Samples were imaged with a Scios FIB-SEM (Thermo Scientific) under high-vacuum conditions at an acceleration voltage of 20 kV and a current of 0.40 nA.
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4

3D Ultrastructure Imaging via FIB-SEM

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A Scios FIB.SEM (ThermoFisher) was used. It included an Everhard-Thorley Detector (ETD), an in-lens detector of Back Scattered Electrons (BSE), and an in-the-column detector of Secondary Electrons (SE). The ETD was used for imaging of sample surfaces. The BSE detector was used for the imaging cellular ultrastructure in 3D. The in-the-column SE detector was used to enhance fiducial marker contrast. The FIB was equipped with a Ga-ion source; for the 3D acquisition a current of 0.4 nA and an acceleration voltage of 30 kV were used. The 3D acquisition in the FIB.SEM was controlled by the Slice&View software version 3 (ThermomFischer).
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