Specimen of the device at its initial resistance state (IRS) was prepared in a focused ion beam (FIB) system, FEI Helios 600i. TEM and STEM imaging of IRS specimen was conducted in a 200 kV JEOL 2010F transmission electron microscope.
Helios 600i
Manufactured by Thermo Fisher Scientific
Sourced in United States
The Helios 600i is a high-resolution scanning electron microscope (SEM) designed for advanced imaging and analysis. It features a field emission electron source, high-resolution electron optics, and a range of detectors to capture detailed information about sample topography, composition, and structure.
Automatically generated - may contain errors
Lab products found in correlation
Tecnai f20, by Thermo Fisher Scientific (2 mentions)
Vertex 70, by Bruker (2 mentions)
X pert pro, by Philips (2 mentions)
D8 advance, by Bruker (2 mentions)
Quanta 200, by Thermo Fisher Scientific (1 mentions)
Autoslice and view software, by Thermo Fisher Scientific (1 mentions)
Tecnai f30 tem, by Thermo Fisher Scientific (1 mentions)
Ivas software, by Cameca (1 mentions)
Tecnai osiris, by Thermo Fisher Scientific (1 mentions)
Mfp 3d afm, by Oxford Instruments (1 mentions)
Ac240tm, by Olympus (1 mentions)
Su8020, by Hitachi (1 mentions)
Dp832, by Rigol (1 mentions)
Bx41m led, by Olympus (1 mentions)
Senterra, by Bruker (1 mentions)
Nova nanosem 450, by Thermo Fisher Scientific (1 mentions)
Asap 2020, by Micromeritics (1 mentions)
Talos f200x tem, by Thermo Fisher Scientific (1 mentions)
Mira3, by TESCAN (1 mentions)
Tecnai g2 f30, by Thermo Fisher Scientific (1 mentions)
32 protocols using helios 600i
1
Characterization of Initial Resistance State
2
Characterization of CuSe Nanostructured Films
Check if the same lab product or an alternative is used in the 5 most similar protocols
+ Expand
SEM images of the CuSe NS
films were taken on a scanning electron microscope (FEI quanta 200
and Helios 600i), operating at an accelerating voltage of 20 kV. TEM
and HR-TEM images were taken on an FEI, Tecnai F20 transition electron
microscope at an accelerating voltage of 200 kV. XRD patterns were
recorded using a Dandong Comp. TD-3500 diffractometer with Cu Kα radiation (λ = 1.54056 Å). XPS data were
acquired using a scanning X-ray microprobe (PHI 5000 Verasa). BEs
of Cu 2p and Se 3d were calibrated using the C 1s peak (BE = 284.6
eV) as a standard.
films were taken on a scanning electron microscope (FEI quanta 200
and Helios 600i), operating at an accelerating voltage of 20 kV. TEM
and HR-TEM images were taken on an FEI, Tecnai F20 transition electron
microscope at an accelerating voltage of 200 kV. XRD patterns were
recorded using a Dandong Comp. TD-3500 diffractometer with Cu Kα radiation (λ = 1.54056 Å). XPS data were
acquired using a scanning X-ray microprobe (PHI 5000 Verasa). BEs
of Cu 2p and Se 3d were calibrated using the C 1s peak (BE = 284.6
eV) as a standard.
3
Serial Ion Beam Milling and SEM Imaging
4
Focused-Ion-Beam-Induced Folding of 3D Structures
Check if the same lab product or an alternative is used in the 5 most similar protocols
+ Expand
The 3D structures were experimentally fabricated on self-supporting Au films by employing a focused-ion-beam (FIB) irradiation-induced folding technique26 (link), 30 (link). Specifically, the pre-designed patterns were firstly cut by utilizing a dual beam FIB/SEM system (FEI Helios 600i). Subsequently, the FIB was continuously scanned using the line scan mode along the bottom edge of the patterned structures, which folded the structures naturally by utilizing the ion-implantation induced stress. During fabrications, the acceleration voltage of Ga+ was set to 30 kV and an ion-beam current of 40 or 80 pA was used, with which a maximum folding angle of 90° could be achieved with an accumulated ion dose of ~3.2 × 107 ions/μm26 (link). Due to the large scale of the structure, the fabrication resolution is about 20 nm.
5
Microstructural Investigation of FDSC Alloys
Check if the same lab product or an alternative is used in the 5 most similar protocols
+ Expand
Microstructural investigation of the samples was performed using a Hitachi SU-70 SEM and an FEI Tecnai F30 TEM, operated at 300 kV accelerating voltage. The microstructure of the FDSC samples was observed on the as-cast surface and also confirmed by investigations performed on the surface cleaned by focused ion beam (FIB). TEM lamellae were extracted from the as-cast alloy and FDSC samples using the same FIB system (FEI Helios 600i). Phase compositions were determined using energy dispersive X-ray spectroscopy elemental analyses via both SEM and TEM. XRD characterization of the FDSC samples (with a volume of about 30 × 100 × 100 µm3) was performed using the spinning mode of an Xcalibur Oxford Diffraction X-ray diffractometer with a Mo Kα radiation source. XRD analyses of large samples (conventional DSC and as-cast, and to verify the glassy as-cast structure) were performed using a Phillips MRD instrument fitted with a 0.5-mm microcapillary tube and a Cu Kα radiation source.
6
Nanowire Electrical Resistance Measurement
Check if the same lab product or an alternative is used in the 5 most similar protocols
+ Expand
Four gold electrodes with thickness of about 100 nm are deposited onto a thermal oxide silicon substrate with a 5 nm thick Cr film as an adhesion layer. The inner two electrodes are connected with four terminals, denoting as T2+ , T2−,T3+ and T3− (Fig. 1a and b ), and the gaps between the two electrodes are of about 5 μm, and 15 μm, respectively. The reactive ion etching (DRIE) is used to trench the gap to a depth of about 1 μm. A probe station is used to manipulate a homogenous nanowire and bridge it across the two electrodes. The platinum/C is deposited to make stable electrical contacts between the electrodes and nanowire (FEI Helios 600i).
In the 2-P configuration, a small direct electrical current (100 nA) is imposed on the T2+ and T3+ terminals, while the voltage drop between the T2− and T3− terminals is recorded by a digital multimeter (Agilent 3458 A) with input impedance of over 10 GΩ, so the T2− and T3− terminals draw little current. For the same silver nanowire, the electrical current is switched to the T1 and T4 terminals to perform the 4-P experiment. Obviously, in the 4-P configuration, the electrical contact resistances between nanowire and electrodes, denoting as Rc1 and Rc2 in Fig.1d , would be excluded in the detected electrical resistance of the nanowire.
In the 2-P configuration, a small direct electrical current (100 nA) is imposed on the T2+ and T3+ terminals, while the voltage drop between the T2− and T3− terminals is recorded by a digital multimeter (Agilent 3458 A) with input impedance of over 10 GΩ, so the T2− and T3− terminals draw little current. For the same silver nanowire, the electrical current is switched to the T1 and T4 terminals to perform the 4-P experiment. Obviously, in the 4-P configuration, the electrical contact resistances between nanowire and electrodes, denoting as Rc1 and Rc2 in Fig.
7
Isotopically Resolved 3D Nanoscale Characterization by APT
Check if the same lab product or an alternative is used in the 5 most similar protocols
+ Expand
APT is a 3D nanoscale characterization method in which field evaporated ions from a sharpened needle specimen are analyzed by a position-sensitive single-particle detector, in order to provide an isotopically resolved three-dimensional representation of the real-space specimen elemental distribution59 (link). The field evaporation of non-conductive samples is achieved using a pulsed laser focused on the needle specimen apex.
A FIB-SEM based lift-out procedure was used to prepare needle-shaped APT specimens using FEI Helios 600i at the University of Oregon CAMCOR facility, and a Helios Dual Beam Nanolab 600 FIB-SEM housed at Environmental Molecular Sciences Laboratory, PNNL.
The APT analysis was carried out using a CAMECA LEAP (local electrode atom probe) 4000X HR system equipped with a 355 nm wavelength picosecond pulsed UV laser. A 30 K sample base temperature and a 100 or 200 kHz laser pulse repetition rate was used. Atom probe data reconstruction and analysis was performed using Cameca IVAS software.
A FIB-SEM based lift-out procedure was used to prepare needle-shaped APT specimens using FEI Helios 600i at the University of Oregon CAMCOR facility, and a Helios Dual Beam Nanolab 600 FIB-SEM housed at Environmental Molecular Sciences Laboratory, PNNL.
The APT analysis was carried out using a CAMECA LEAP (local electrode atom probe) 4000X HR system equipped with a 355 nm wavelength picosecond pulsed UV laser. A 30 K sample base temperature and a 100 or 200 kHz laser pulse repetition rate was used. Atom probe data reconstruction and analysis was performed using Cameca IVAS software.
8
Focused Ion Beam Specimen Preparation for High-Resolution TEM
Check if the same lab product or an alternative is used in the 5 most similar protocols
+ Expand
The cross-sectional TEM specimen was prepared by focused ion beam (FIB, FEI Helios 600i) milling. To avoid sample damage by the Ga-ion beam, a 2 µm thick Pt layer was deposited above the region of interest. The main thinning process was carried out using a 30 kV Ga-ion beam until the thickness was reduced to below 100 nm, followed by sweeping surface amorphous with a 2 kV Ga-ion beam. The high-resolution TEM image, HAADF-STEM images and EELS spectra were carried out using the Titan ETEM G2 scanning/transmission electron microscope. The optimal energy resolution of EELS was ~0.25 eV, as judged by the full-width at half-maximum of the zero-loss peak. FFT and EELS were filtered using Digital Micrograph software.
9
Fabrication of 3D Nanofins via Electron Beam Lithography
Check if the same lab product or an alternative is used in the 5 most similar protocols
+ Expand
In this work, quartz cleaned in acetone, isopropanol (IPA), and deionized water in sequency is used to hold the 3D nanofins. Secondly, the polymethyl methacrylate (PMMA) resist is spun on a clean quartz plate to obtain a thick enough photoresist film and baked at 180 °C for 1 min. Successively, the patterns are exposed using electron beam lithography system (6300FS, JEOL), and then the patterns are obtained by developing in a mixture of MIBK and IPA (1:3). Next, the ALD process of TiO2 is carried out in a home-built system. H2O is the source of O, and tetrakis (dimethylamino) titanium (TDMAT) precursor is used as the Ti source without chlorine contamination and achieved the required vapor pressure by heating the chamber. Meanwhile, the continuous flow of Ar carried gas throughout the development. After ALD process, a dry etching process is executed in the ICP-RIE system (Plasmalab System 100 ICP180, Oxford) with a mixed reactive gas of CHF3 to remove the TiO2 film on the top of the resist. Finally, another dry etching process with Oxygen plasma is applied to remove the residual resist. A scanning electron microscope (SEM) (Helios 600i, FEI) is used to characterize the morphology of the samples.
10
Resistance State Analysis of Device Cells
Check if the same lab product or an alternative is used in the 5 most similar protocols
+ Expand
Specimens of the device cells at the initial resistance state (IRS), after switched to the low resistance state (LRS), and after switched back to the high resistance state (HRS) were respectively prepared in a focused ion beam (FIB) system, FEI Helios 600i. STEM imaging and EDS analysis of these specimens were conducted in a 200 kV FEI Tecnai Osiris transmission electron microscope.
About PubCompare
Our mission is to provide scientists with the largest repository of trustworthy protocols and intelligent analytical tools, thereby offering them extensive information to design robust protocols aimed at minimizing the risk of failures.
We believe that the most crucial aspect is to grant scientists access to a wide range of reliable sources and new useful tools that surpass human capabilities.
However, we trust in allowing scientists to determine how to construct their own protocols based on this information, as they are the experts in their field.
Ready to get started?
Sign up for free.
Registration takes 20 seconds.
Available from any computer
No download required
Revolutionizing how scientists
search and build protocols!