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Tds 2012b

Manufactured by Tektronix

The TDS 2012B is a digital storage oscilloscope manufactured by Tektronix. It features a 100 MHz bandwidth, 2 analog input channels, and a sample rate of up to 1 GS/s. The oscilloscope provides basic waveform acquisition and display capabilities for general-purpose lab and troubleshooting applications.

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8 protocols using tds 2012b

1

AuNPs Decorated Graphene/SiNWs Photodetector

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To fabricate the AuNPs decorated graphene/SiNWs Schottky junction photodetector, 5/50 nm Ti/Au electrode, which served as the electrical contact for graphene, was first deposited on the SiO2/Si substrate using electron-beam evaporator. Then the PMMA-supported multilayer graphene films were directly transferred onto the top of SiNWs. After drying at 100°C for 10 min, the residual PMMA on graphene film was removed by acetone. Indium-gallium (In-Ga) alloy was then pasted on the rear side of Si subatrate to achieve ohmic contact. AuNPs on graphene was obtained by spin-coating of AuCl3 (10 mM in nitromethane) onto the substrate at 2000 rpm for 1 min. The device characteristics of graphene/SiNWs were measured using a Keithley 4200 semiconductor characterization system. To determine the spectral response and time response of the Schottky junction devices, a home-built system composed of a light source (LE-SP-LS-XE), a monochromator (LE-SP-M300), an oscilloscope (Tektronix, TDS2012B), and an optical chopper (LE-oc120) was used.
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2

Characterization of High-Quality WS2 Domains

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The AFM measurements were performed in air using a Bruker Dimension Icon atomic force microscope (Bruker, Germany). The X-ray photoelectron spectroscopy (XPS) was performed on an ESCA-LAB 250 photoelectron spectrometer equipped with X-ray source in Al k α (1486.7 eV). The atomic structure of high-quality single-crystal WS2 domain was carried out by TEM on an FEI Titan Themis Cube with an X-FEG electron gun operating at 100 kV. Raman spectra was recorded with a JY HR-800 LabRam Infinity Spectrophotometer with a 488 nm semiconductor laser. The X-ray diffraction (XRD) measurements were conducted using Dmax-2500X (Rigaku, Japan). All the electrical measurements were performed with a source meter (2636A, Keithley), an arbitrary function generator (3390, Keithley), and an oscilloscope (TDS 2012B, Tektronix), and the testing environment was maintained under temperature of ∼25°C and relative humidity of ∼30%.
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3

Memristive Properties Characterization

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Memristive properties were measured using a self-built test system comprising a sourcemeter (2636A, Keithley), arbitrary function generator (3390, Keithley), oscilloscope (TDS 2012B, Tektronix), and probe station (TTPX, Lake Shore). The positive direction of the bias voltage was defined such that the current flowed from the top to the bottom electrode. To measure the EPSC, the memristor was connected with a load resistor Rload of 1 MΩ in series, and the voltage drop across the Rload was monitored by an oscilloscope. Then, the monitored voltage was converted to the current flowing through the memristor. To implement pair- or triplet-STDP, each pre- or postsynaptic spike applied to the top or bottom electrode was composed of a pair of pulses with amplitude V+/V = 2 V/–2 V and a width of 50 ms. The initial and final conductance states of the device (Gi and Gfinal) were readout using a small pulse [0.2 V, 50 ms] before and after applying the programmable pulses, and the conductance change was defined as ΔGc = Gfinal − Gi. For the experienced G0, ΔGc = Gfinal − G0. Both the writing and reading of the memristor were performed in pulse mode.
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4

Electrical Characterization of Ferroelectric Plasma Cells

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A reference capacitor Cref = 10 nF (Digi-Key, 399-12395-ND) is placed in series of the plasma cell. The applied voltage Uext and the reference capacitor voltage drop Uref are monitored using two high voltage probes (Tektronix, P6015A) with a digital oscilloscope (Tektronix, TDS 2012B). The surface charge on the ferroelectric electrode is equal to that on the reference capacitor which was obtained by its capacitance times its voltage drop. The total current through the plasma and the unavoidable parallel parasitic components is monitored with the current monitor (Pearson 6585). The equivalent circuit of the system is shown in Fig. 6a.Experiments schematics.

a Equivalent circuit of the electrical measurement. b Electric field-induced second harmonic generation (i.e., EFISH) for electric field measurement. L1: plano-convex lens with a focal length of 400 mm; F1: longpass filter with a cut-on wavelength of 650 nm; P: dispersive prism; L2: collimating lens with a focal length of 750 mm; M: dichroic mirror that transmits 800 nm and reflects 400 nm; F2: bandpass filter with a bandwidth of 10 nm centered at 400 nm.

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5

Characterization of Nanostructure Materials

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The AFM measurements were performed in air with a Bruker Dimension Icon atomic force microscope (Bruker, Germany). The absorption spectra of the samples were recorded with a UH4150 spectrophotometer. A JEOLJEM 2100F transmission electron microscope was used to characterize the morphology of the NCQDs. A JY HR-800 LabRam Infinity spectrophotometer was used to measure the Raman spectra. The cross-sectional image of the device was recorded by SEM (Nova Nano SEM 450). The X-ray photoelectron Ag spectra were recorded with a Thermo ESCALAB 250 instrument. All of the electrical measurements were performed with a source meter (2636A, Keithley), an arbitrary function generator (3390, Keithley), and an oscilloscope (TDS 2012B, Tektronix). Positive bias voltage was defined as the voltage that produced current flow from the top electrode to the bottom electrode.
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6

Memristive Characterization via Self-Built System

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Memristive properties were measured using a self‐built test system comprising a sourcemeter (2636A, Keithley), arbitrary function generator (3390, Keithley), oscilloscope (TDS 2012B, Tektronix), and probe station (TTPX, Lake Shore). A bias voltage was applied on the W top electrode and W bottom electrode was grounded. The positive direction of the bias voltage was defined such that the current flowed from the top to the bottom electrode. To measure the EPSC, the memristor was connected with a load resistor Rload of 1 MΩ in series, and the voltage drop across the Rload was monitored by an oscilloscope. Then, the monitored voltage was converted to the current flowing through the memristor. To implement pair‐ or triplet‐STDP, each pre‐ or postsynaptic spike applied to the top or bottom electrode was composed of a single spike with amplitude V+/V− = 1 V/−1 V and a width of 50 ms. The initial and final conductance states of the device (G0 and Gfinal) were readout using a small pulse (0.1 V, 50 ms) before and after applying the programmable pulses, and the conductance change was defined as ΔG = GfinalG0. Both the writing and reading of the memristor were performed in pulse mode.
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7

Electrical Characterization of Photovoltaic Devices

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The Voc and Isc values of preprocessing data were recorded in excel form using digital storage oscilloscope (Tektronix TDS2012B), semiconductor parameter analyzer (4200‐SCS), and current preamplifier (ITHACO, 1211) instruments. The originlab software was used to plat all the graphs and Figures S6 and S9 in the Supporting Information denoted the average output voltage value lines were calculated through microsoft excel. Finally, all displayed figures were allegiantly drawn by adobe illustrator.
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8

Microfluidic Dielectrophoretic Capture and Impedance Sensing

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A custom-made
chip holder based on pogo-pins (Mill-Max Corp.) was employed to electrically
connect our microfluidic device to all measurement equipment. A set
of switches in the holder allowed us to control the signal applied
to each electrode. The flow of spores in the solution within the microfluidic
channel was generated and controlled using a syringe pump (New Era
Pump Systems Inc. NE-4000). During DEP experiments, sinusoidal signals
were applied to the electrodes via the chip holder using a function
generator (Rigol DG822) through a bipolar 10× amplifier (Tabor
Electronics 9250). An oscilloscope (Tektronix TDS 2012B) was also
used to monitor the applied signal. During the process of DEP capture,
our device was placed on the viewing stage of an upright fluorescence
microscope (Amscope FM820TMF143) integrated with a CCD camera (Sony
ICX825ALA) for imaging and video recording. nF-EIS measurements were
performed using a high-precision impedance analyzer (Zurich Instruments
MFIA) controlled by the software LabOne.
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