Spi module sputter coater
The SPI-Module Sputter Coater is a laboratory equipment used for depositing thin films of materials onto substrates through the process of sputtering. It is designed to provide a controlled and consistent deposition of materials such as metals, semiconductors, and dielectrics onto a variety of surfaces.
Lab products found in correlation
19 protocols using spi module sputter coater
Scanning Electron Microscopy Analysis of Bonded Tooth Interfaces
Scaffold Preparation for SEM Analysis
Isolating Sclerotized Hooks from Parasites
SEM Failure Mode Analysis of Dental Adhesives
Topographical Analysis of CpTi and Y-TZP
Quantifying Bacterial Adhesion on Y-TZP
Morphological Examination of Powder V2 by SEM
The sample was analyzed at a pressure of 60 Pa, in low vacuum mode, while the acceleration voltage of the electrons in the electronic cannon was 15 kV. The powder was fixed on an aluminum tube with the help of a carbon double adhesive tape. The samples were coated with a 7 nm thick layer of gold using an SPI-Module Sputter Coater (SPI Supplies, West Chester, PA, USA) with an intensity of 18 mA to increase the conductivity. SEM images were collected at different magnifications between 200 and 10.000X to highlight the microstructures or morphological changes in the powder.
SEM Sample Preparation for Hydrogel Matrices
Plant Material Preparation for SEM
Scanning Electron Microscopy of Microspheres
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