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Op s suspension

Manufactured by Struers
Sourced in United States

OP-S suspension is a colloidal silica-based polishing suspension developed by Struers. It is designed for the final polishing stage of a variety of materials, including metals, ceramics, and hard materials. The suspension provides a high-quality surface finish and is suitable for use in various metallographic and material characterization applications.

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6 protocols using op s suspension

1

Microstructural Analysis of As-Fabricated Parts

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For phase analysis, samples were cut from different locations along the building direction of the as-fabricated parts and were mechanically polished using Struers OP-S suspension containing 20 vol % of H2O2 for 30 min without any chemical etching. The microstructure was characterized in backscattered electron (BSE) mode using an FEI Scios Dual Beam system (Thermo Fisher Scientific Inc., USA) equipped with a concentric backscattered (CBS) detector under 3 kV accelerating voltage, 1.6 nA probe current, and 5.5 mm working distance. For SEM-EDS mapping of as-fabricated parts, the samples prepared for phase analysis were then characterized by using an SEM (JEOL JSM-6610, Japan).
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2

Preparation of CpTi G4 Substrates for CaP Coatings

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CpTi G4 was used as a substrate for the ECAD of CaP coatings. Composition limits followed the specifications defined in standards ASTM F67-13 [12 ] and ISO 5832-2 [13 ]. Five-mm-high disc-shaped specimens were cut from a 10-mm diameter bar (Bibus Metals, Dąbrowa, Poland). CpTi G4 specimens were subjected to mechanical polishing with 600 to 5000 # grit silicon carbide paper and colloidal silica suspension for finishing polishing with a grain size of 0.04 mm (OP-S suspension, Struers, Cleveland, OH, USA). Polished specimens with a mirror surface were sonicated twice for 20 min, first in acetone and then in ultra-pure water with a resistivity of 18.2 MΩ cm at 25 °C produced by the Milli-Q Advantage A10 Water Purification System (Millipore SAS, Molsheim, France). The CpTi G4 specimens prepared in this way were sandblasted using white Al2O3 of FEPA Grit F220 [43 ]. A pressure of 0.6 MPa was used. The sandblasting time was 15 s. The distance of the sand nozzle from the titanium surface was about 1.5 cm. CpTi G4 specimens were washed in an ultrasonic cleaner for 20 min, successively in acetone, and then in ultrapure water to remove corundum residues from sandblasted surfaces. In the next stage, the sandblasted specimens were sterilized in distilled steam at 134 °C under a pressure of 2.2 bar for 90 min using a Zealway Model GR60 DA autoclave (Xiamen, China).
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3

Surface Preparation of CpTi G4 Discs

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A CpTi G4 rod with a diameter of 10 mm (Bibus Metals, Dąbrowa, Poland) was cut into disk-shaped samples which were 5 mm high. CpTi G4 disks were mechanically pre-polished on 600 to 5000 # grit SiC papers. A colloidal silica suspension with a grain size of 0.04 µm (OP-S suspension, Struers, Cleveland, OH, USA) was used in the final step of the mechanical polishing. Samples with a mirror surface were cleaned in an ultrasonic cleaner for 20 min in acetone, and then in ultrapure water with a resistivity of 18.2 MΩ cm at 25 °C, produced with a Milli-Q® Advantage A10 Water Purification System (Millipore SAS, Molsheim, France). The polished CpTi G4 samples were sandblasted with a white Al2O3 FEPA Grit F220 abrasive [27 ]. Next, they were sonicated again. After drying, the samples were autoclaved using the Zealway Model GR60 DA (Xiamen, China). A detailed description of the conditions of the sandblasting and autoclaving process is given in the earlier work [28 (link)].
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4

Detailed Surface Characterization of Metal Coupons

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For the purposes of characterisation, an extra polishing step was performed. After being ground to P2500 grit, a finer 3 μm diamond paper was used with the final polishing step being performed using an MD-Chem polishing cloth using an OP-S suspension (Struers, Denmark). Once completed, the samples were acid treated as described above in order to remove MnO from within the porous component of the coupons and examined using scanning electron microscopy (SEM, Carl Zeiss FE-SEM, Merlin Gemini II column, Germany) and EDS (AMETEK EDAX detector, USA). Although weight percent for carbon, nitrogen and oxygen were included in the measurement, one must note that the EDS technique is not appropriate for accurate measurement of light elements therefore such results must only be considered as a qualitative indication. Phase analysis of the fully prepared samples was performed using an XRD Bruker D8 Advance (USA) with a copper source (Cu-Kα, λ = 0.141 nm), equipped with a graphite monochromator. The analysis was conducted at 2θ between 30° and 100° at a rate of 0.02°/step while the sample was angularly rotating at 15°/min.
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5

EBSD Characterization of Metallic Materials

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Samples for EBSD characterization were ground and mechanically polished using Struers OP-S suspension containing 20 vol % H2O2 for 30 min. Final electropolishing was carried out at room temperature using a voltage of 20 V for 240 s in Struers electrolyte A3. EBSD characterization was performed on a SEM (JEOL JSM-7800F, Japan) with a step size of 0.3 μm. The EBSD data was analysed using OIM Analysis 7.3 software. The prior-β grain structure was reconstructed using the ARPGE software package51 (link).
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6

Metallurgical Microstructure Analysis Protocol

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Metallurgical microsections were prepared for the produced samples. A resin (PolyFast, Struers, Cleveland, OH, USA) was used to enable SEM imaging. The samples were embedded in such way that it was possible to image longitudinal and transverse sections. Abrasive papers with gradations of 120, 320, 600, 800, and 1200 were used for grinding. The samples were polished with OP-S SUSPENSION (Struers, Cleveland, OH, USA) and etched in 8% HF acid. The photos of the structures were taken using a scanning microscope (TESCAN VEGA, SE detector, Brno, Czech Republic). The structure was assessed in accordance with ISO 20160.
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