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The Ultra 45° is a high-performance electron microscope designed for advanced imaging and analysis. It features a 45-degree inclined optical column that allows for enhanced sample observation and characterization. The Ultra 45° delivers high-resolution imaging capabilities and supports a range of analytical techniques for materials science, nanotechnology, and other research applications.

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4 protocols using ultra 45

1

Transmission Electron Microscopy Protocol

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For ultrastructural examination, representative or interesting areas were selected based on light-microscopical assessment. Ultrathin (60–90 nm) sections were cut with a diamond knife (Ultra 45°, DiATOME) on an Ultrotome III (LKB) and collected upon Pioloform-coated, single-slot copper grids. The sections were contrast-stained with 7% uranyl acetate in 70% methanol and Reynolds’ lead citrate solution and examined in a FEI Tecnai 12 transmission electron microscope (operating at 80 kV) equipped with a Veleta 4-megapixel side-mount CCD camera (Olympus Soft Imaging Solutions GmbH).
Digital images were acquired with TIA software (TEM Imaging & Analysis, version 4.7 SP3; FEI). Alternatively, sets of serial digital images with 10% overlap (at an original magnification of ×30,000) were acquired with the automated EM data acquisition software package SerialEM133 (link) (https://bio3d.colorado.edu/SerialEM). Final alignment (stitching) of the sets of overlapping images and montage blending were done using the reconstruction and modeling software package IMOD123 (link) (https://bio3d.colorado.edu/imod) operating under the Unix toolkit Cygwin. Montages or single images were finally saved as TIFF and imported into Fiji ImageJ for further image processing, examination and selection of interesting areas. Images were assembled into figures using Adobe Photoshop.
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2

Transmission Electron Microscopy Protocol

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For ultrastructural examination, representative or interesting areas were selected based on light-microscopical assessment. Ultrathin (60–90 nm) sections were cut with a diamond knife (Ultra 45°, DiATOME) on an Ultrotome III (LKB) and collected upon Pioloform-coated, single-slot copper grids. The sections were contrast-stained with 7% uranyl acetate in 70% methanol and Reynolds’ lead citrate solution and examined in a FEI Tecnai 12 transmission electron microscope (operating at 80 kV) equipped with a Veleta 4-megapixel side-mount CCD camera (Olympus Soft Imaging Solutions GmbH).
Digital images were acquired with TIA software (TEM Imaging & Analysis, version 4.7 SP3; FEI). Alternatively, sets of serial digital images with 10% overlap (at an original magnification of ×30,000) were acquired with the automated EM data acquisition software package SerialEM133 (link) (https://bio3d.colorado.edu/SerialEM). Final alignment (stitching) of the sets of overlapping images and montage blending were done using the reconstruction and modeling software package IMOD123 (link) (https://bio3d.colorado.edu/imod) operating under the Unix toolkit Cygwin. Montages or single images were finally saved as TIFF and imported into Fiji ImageJ for further image processing, examination and selection of interesting areas. Images were assembled into figures using Adobe Photoshop.
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3

Transmission Electron Microscopy of Resin-Embedded Tissues

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Resin embedded tissues were trimmed around the ME and semi thick slices were cut to create sections that only contained the ME. Then, 70nm ultrathin sections were sliced on an ultramicrotome (Reichert-Jung - Ultra-cut 701701 Ultra Microtome) with a diamond knife (Diatome - Ultra 45). Sections were placed on mesh copper grids (size 300) and were post stained with aqueous uranyl acetate for 6 min then lead citrate for 2 min.
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4

Sample Preparation for TEM and SEM

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For TEM, a Reichert-Jung Ultracut E microtome was used to cut 100 nm thick sections with a diamond knife (Ultra 45º, Diatome, Hatfield, PA) which were collected onto fomvar film coated Copper/Rhodium slot grids. Sections were post stained with 2% uranyl acetate and Reynold's lead citrate.
For SEM, 60 nm sections were cut using a diamond knife (Ultra 45º, Diatome) and collected using an automated tape-collecting ultramicrotome. The tape was transferred to silicon wafers and carbon coated (Baena et al., 2019) .
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