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Automatic sputter coater

Manufactured by Agar Scientific
Sourced in United Kingdom

The Automatic Sputter Coater is a laboratory equipment used to apply a thin, uniform metallic coating on samples for scanning electron microscopy (SEM) and other imaging techniques. It operates by sputtering target material onto the sample surface in a controlled vacuum environment.

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11 protocols using automatic sputter coater

1

Comprehensive Analytical Characterization

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The HPLC measurements were carried out on
an Agilent 1100 series HPLC instrument equipped with a reversed-phase
column (Phenomenex Luna C-18, 250 × 4.6 (i.d.) mm) and photodiode
array detector. FT-IR spectroscopy was performed using a NEXUS FT-IR
spectrometer (Thermo Electron Corporation, Dreieich, Germany) equipped
with an attenuated total reflection (ATR) accessory unit and ITR diamond
(smart ITR) experimental setup. Scanning electron microscopy was conducted
using an EVOLS 10 instrument from Zeiss in the high-vacuum mode and
a secondary electron detector. The accelerating voltage was 15 kV,
and the probe current was 50 pA. The working distance was 6.5–9
mm. The samples were glued to the sample stubs using Leit-C carbon
cement and covered with gold using an Agar Scientific automatic sputter
coater.
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2

Scanning Electron Microscopy of Baculovirus Occlusion Bodies

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SEM was performed on OBs extracted from baculovirus-infected TN-368 cells (at 5 MOI) at 7 dpi as previously described [45 (link)]. Purified OBs were fixed in 4% (v/v) formaldehyde in PIPES buffer for 1 hour, washed once in PIPES buffer and then dehydrated in an ascending ethanol series to 100%, for 10 minutes each. The dehydrated OBs were densely seeded onto glass coverslips and sputter-coated with gold (Automatic sputter coater, Agar Scientific, Stansted, UK). The samples were imaged using a Zeiss Merlin Compact VP SEM using an accelerating voltage of 4kV. Post-acquisition image processing was performed with Image J and analysed using GraphPad Prism 7.
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3

Topography and Cross-sectional Analysis of Coated Stents

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For topography images of the abluminal (outer) surfaces of the samples, coated stents were cut into pieces with scissors, placed horizontally on double sided adhesive carbon tape fixed on an aluminum SEM stub, and then platinum (Pt)-sputtered (thickness ~5 nm) using an automatic sputter coater (Agar Scientific Ltd, Stansted, Essex, UK). Images were acquired using a Zeiss Merlin field emission gun (FEG) scanning electron microscope (Jena, Thuringia, Germany) operating at an accelerating voltage of 2 kV. For cross-sectional imaging, the stent pieces were positioned vertically on a specially designed SEM stub and secured with a screw. Cross-sectional SEM images were recorded using a Quanta 450 FE environmental scanning electron microscope (FEI Company, Hillsboro, Oregon, USA) operating at an accelerating voltage of 2 kV and at 2.5 spot size. For each sample, film thickness measurements were recorded using ImageJ (Version 1.52a) image analysis software program (National Institutes of Health, Bethesda, MD, USA) from the cross-sectional SEM images.
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4

Scanning Electron Microscopy Preparation

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Materials for scanning electron microscopy (SEM) were prepared for observing the intact and cleaned cells in two ways. The intact morphology from the isolates was observed by filtering live cells on a 3-μm polycarbonate membrane and washed with distilled water without any oxidation. The cleaned external and internal structures after the detachment of the organic matter were observed by adding some live cells to an equal volume of H2O2 and exposing them to ultraviolet light (312 nm) for 3 h on the UV-transilluminator (WUV-L50; witeg, Wertheim, Germany) and then washing them with distilled water. The cleaned cells were filtered and dried on a 3-μm polycarbonate membrane. The dried polycarbonate membranes were attached to aluminum stubs by using carbon conductive adhesive tapes and coated with 10 nm gold in an automatic sputter coater (Agar Scientific Ltd., Essex, UK). The prepared specimens were examined using FE-SEM (JSM7600F; Jeol, Tokyo, Japan) operating at 10 kV and 8 mm working distance. Valve dimensions from the SEM photographs were measured using ImageJ 1.51 software [16 (link)]. The terminology used for the structures discussed herein follows that of Ross et al. [17 ], Round et al. [18 ] and Theriot & Serieyssol [19 ].
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5

Morphological Analysis of P and PP NPs

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Morphological investigation on P and PP NPs with or without DPH were performed using a Field Emission Scanning Electron Microscope (SEM) equipped with an Energy Dispersive Spectrometer (FESEM/EDS; Zeiss Merlin VP Compact coupled with Oxford Instruments Microanalysis Unit; Carl-Zeiss Strasse, Oberkochen, Germany). Samples were glued by a carbon tape film on a sample holder and then gold-metalized, using an automatic sputter coater (Agar Scientific ltd-Parsonage Lane, Stansed-Essex, UK), with an automatically controlled complete sequence of flush, leak, coat, and vent.
The INCA (Oberkochen, Germany) X-stream pulse processor and the INCA Energy software 5.05 were used to obtain datasets. Operative conditions were reported on each acquisition and were chosen to be consistent with the performed measurement.
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6

Scanning Electron Microscopy of Fabricated Materials

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The morphology of
the fabricated materials was investigated using a large chamber scanning
electron microscope (Model S-3700 N, Hitachi, Tokyo, Japan). An accelerating
voltage of 15 kV was used. Prior to SEM, the samples were mounted
onto aluminum stubs using carbon tabs and Au coating (Automatic sputter
coater, Agar Scientific, Stansted, UK) at a current of 40 mA for 20
s.
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7

Scanning Electron Microscopy of Implant Biofilms

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To assess the presence of biofilm‐like structures, nine representative samples were also investigated by scanning electron microscopy. Three parts of removed plates or screws of each patient were prepared for the scanning electron microscopy. The remaining parts of the implants were used for microbiological investigations. For scanning electron microscopy, the implants were immersed in 2 ml of glutaraldehyde 2.5% for fixation. After fixating for 24 hr at 4°C, the implants were dehydrated with an ascending alcohol series (50%–70%–80%–99.9% ethanol). Each step lasted 5 min. After the last step, the implants were placed in an incubator for drying. The dried samples were glued on aluminum pins with Leit‐C (Plano GmbH, Wetzlar, Germany). The pins were sputtered with Au using an automatic sputter coater (Agar Scientific Ltd, Stansted, Great Britain) for 1 min and analyzed by scanning electron microscopy (SEM, JSM‐6010LV, JEOL GmbH, Freising, Germany).
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8

Fabrication of Flexible CCR Array

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A CCR array was purchased from the JunAN (SL150-18, China) and used as a mold during embossing processing. Silicone elastomer base and curing agent (SYLGARD 184, 1.1KG) chemicals were purchased from Farnell, UK and used as a soft polymer embossing medium. Automatic sputter coater was purchased from the Agar Scientific, UK to make thin Au coating over flexible CCR array. COMSOL Multiphysics 5.2, MATLAB (Math Works, R2013) was used for the numerical simulations and data processing.
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9

Scanning Electron Microscopy of Curcumin Scaffolds

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The surface morphology of pure curcumin powder, the blank, and curcumin-loaded (7% w/w) scaffolds was studied with a MERLIN™ Scanning Electron Microscope (Jena, Thuringia, Germany). The samples were coated with platinum by sputter-coating before analysis with an automatic sputter coater (Agar Scientific Ltd., Stansted, Essex, UK). An accelerating voltage of 2 kV was used to obtain SEM images.
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10

Characterization of Nanoparticle Morphology

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Unmodified and pGL3-PEI-coated HSA nanoparticles, as well as pGL3-PEI complexes were diluted with purified water (1∶10). An aliquot was placed on an aluminium sample plate and air-dried at room temperature over-night. In order to obtain electrical conductibility for electron microscopy analysis, the sample plates were sputtered with gold for 45 s under argon gas atmosphere (Automatic sputter coater, Agar Scientific, Essex, United Kingdom). Samples were analysed with a field emission electron microscope with upper detector (EM Hitachi S-45000, Hitachi High-Technologies Europe GmbH, Krefeld, Germany) at 15–25 kV.
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