The PDMS microwell array chips were fabricated by standard soft lithography. New Si wafers were cleaned in Pirahna solution (a mix of concentrated sulfuric acid and 30% hydrogen peroxide with a ratio of 3 to 1) for 15 min, rinsed by deionized water and dried with nitrogen. The thick SU-8 molds were fabricated using SU-8 2050 (MicroChem). Briefly, a cleaned Si wafer was spin-coated with SU-8 2050 at 500 rpm for 15s and 1500 rpm for 30 s, prebaked at 65 °C for 8 min and 95 °C for 28 min, and exposed for 15 s for total exposure energy of 110 mJ cm−2. The wafer was then post-baked at 65 °C for 5 min and at 95 °C for 20 min, followed by a 5 min development and hard-baking at 150 °C for 2 h. The SU-8 molds were finally silanized with trimethylchlorosilane under vacuum for 4 h. Negative PDMS replicas were made by pouring a 10:1 mixture of PDMS base with the curing agent over the wafer, followed by curing at 70 °C overnight. Cured PDMS was then peeled off the mold and cut into individual chips. PDMS microwell chips were used without any surface treatment.
Su 8 2050
Manufactured by MicroChem
Sourced in United States
SU-8 2050 is a high-contrast, epoxy-based photoresist designed for micromachining and other microelectronic applications. It is a negative tone resist that can be used to create high aspect ratio structures with nearly vertical sidewalls. SU-8 2050 is suitable for a wide range of film thicknesses, from 2 to 50 micrometers.
Automatically generated - may contain errors
Lab products found in correlation
Sylgard 184, by Dow (19 mentions)
Su 8 developer, by MicroChem (9 mentions)
Su 8 2025, by MicroChem (3 mentions)
Oxygen plasma, by Harrick (2 mentions)
Sylgard 184 silicon elastomer kit, by Dow (2 mentions)
Su 8 2002, by MicroChem (2 mentions)
Oligomycin, by Merck Group (2 mentions)
Phosphate buffer saline (pbs), by Merck Group (2 mentions)
W w nafion perfluorinated resin, by Merck Group (2 mentions)
Paraffin oil ovoil, by Vitrolife (2 mentions)
Tween 20, by Merck Group (2 mentions)
Bovine serum albumin (bsa), by Merck Group (2 mentions)
Sodium l lactate, by Merck Group (2 mentions)
Autocad, by Autodesk (2 mentions)
19 gauge needles, by McMaster-Carr (2 mentions)
Sylgard, by Dow (1 mentions)
Standard microscope slide, by Avantor (1 mentions)
Harris uni core puncher, by Ted Pella (1 mentions)
Sylgard 184 silicon elastomer, by Dow (1 mentions)
Autocad software, by Autodesk (1 mentions)
55 protocols using su 8 2050
1
PDMS Microwell Array Chip Fabrication
2
Microfluidic Device Fabrication via Soft Lithography
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The microfluidic device was composed of three PDMS layers (two flow layers and one insertion layer) bonded to each other using an O2 plasma treatment. Individual flow layers were fabricated following standard soft lithography techniques. Briefly, Si wafers were spin-coated with photoresist (SU-8 2050, MicroChem), followed by a photolithography process that defined the channels. For the flow layers, ~70-μm-thick layers of PDMS (Sylgard, Dow Corning; 10:1 elastomer/cross-linker weight ratio) were spin-coated on the patterned Si wafer and cured in an oven at 90°C for 2 hours. The insertion layer (~4 mm thick) was fabricated by pouring PDMS on a blank Si wafer and cured in an oven at 90°C for 2 hours. Next, the PDMS layers were removed from the wafer and subjected to a plasma treatment (O2, 320 mtorr, 29.6 W, 30 s). The insertion layer was cut for port placement at either end of the flow layers. Layers were manually aligned and gently pressed together to promote bonding and mounted on cover glass (~150 μm thickness). A final 10-min bake at 90°C resulted in a multilayer device with a strong covalent bond between layers.
3
Microfluidic Channel Fabrication via PDMS and Glass Bonding
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For the fabrication process, the microfluidic separation channel was fabricated by bonding the patterned polydimethylsiloxane (PDMS) and a transparent slide glass after treating oxygen plasma. Firstly, a 100-µm-thick layer of SU-8 photoresist (SU-8 2050, MicroChem Corp., Westborough, MA, USA) was spin-coated on a smooth silicon wafer, and photolithography was conducted to pattern the microfluidic separation channel. Then, the PDMS was poured onto the patterned SU-8 mold and cured at 65 °C for 2 h. The PDMS was detached from the SU-8 mold to form the pattern of the microfluidic separation channel on the PDMS. Finally, the patterned PDMS layer was bonded with the glass substrate after treating the surface with oxygen plasma (Plasma cleaner PDC-32G, Harrick Plasma Inc., Ithaca, NY, USA) for 2 min. The detailed dimensions and the picture of the fabricated microfluidic separation channel with the three inlets and three outlets were shown in Figure 3 .
4
Microfluidic Device Fabrication Protocol
5
Fabrication of Microfluidic Devices with Sidewall Microgrooves
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Microfluidic devices with sidewall microgrooves were fabricated using the photolithography technique that has been previously developed [21 (link)24 (link, link, link)] (Figure 1 ). The silicon master mould was made using a negative photoresist (SU-8 2050, Microchem, MA). To make sidewall microgroove patterns of 80 μm thickness, SU-8 2050 was spin-coated at 1,500 rpm for 60 sec, baked for 8 min and 25 min at 65 °C and 95 °C, respectively, and exposed to UV for 3 min. After UV exposure, the photoresist-patterned silicon master was post-baked for 1 min and 8 min at 65 °C and 95 °C, respectively. The negative replica of the microfluidic channel was moulded in poly (dimethylsiloxane) (PDMS) (Sylgard 184 Silicon elastomer, Dow Corning, MI). The PDMS prepolymer mixed with silicone elastomer and curing agent (10:1) was poured on the master and cured at 70 °C for two hours. PDMS moulds were removed from the photoresist-patterned master. An inlet and outlet of the microfluidic channel were punched by sharp punchers for cell seeding and medium perfusion. The sidewall microgroove-containing channel and the bottom PDMS substrate were irreversibly bonded using oxygen plasma (5 min at 30 W, Harrick Scientific, NY). Sidewall microgrooves in the microchannels were placed perpendicular to the fluidic flow direction in the microfluidic device.
6
Fabrication of PDMS Microfluidic Devices
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Example 3
First, the silicon master was fabricated using the photolithography technique. To begin with, the flat silicon wafer was washed and dried. Then, a photoresist (SU-8 2050, MicroChem Corporation) was spin-coated (100 μm thickness) onto the wafer to reach desired thickness. Next, the substrate underwent soft bake, UV exposure, and post-exposure bake. During the UV exposure step, a photo mask with the designed pattern was placed on the wafer to cure only the area of interests. After the curing process, the excess uncured photoresist was washed out. The master was silanized by treatment with a vapor of trichloro (1H,1H,2H,2H-perfluorooctyl)silane, Sigma-Aldrich) to create a hydrophobic surface. Second, PDMS pre-polymer (SYLGARD 184 Silicon Elastomer Kit, Dow Corning) and its curing agent were thoroughly mixed in the 1:10 mass ratio. After degassing, the pre-polymer solution was cast onto the silicon master with the desired feature on it. Then, it was cured at 60° C. for 2 hr. The cured PDMS with the desired pattern was gently peeled off from the master. The fabrication of the flat PDMS followed the same procedure. The only difference was that the pre-polymer solution was poured on the flat silicon wafer.
7
Fabrication of PDMS Microfluidic Devices
8
Microfluidic Device Fabrication for Cell Trapping
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For our experiments, we used two types of microchambers and trap arrays dimensions, detailed in the Additional file 1 . The devices were made of PDMS (polydimethylsiloxane), using standard soft lithography techniques [27 (link)]. In brief, we fabricated SU-8 masters (SU-8 2050, Microchem) on silicon wafers using a Karl-Süss MJB4 mask aligner and a laser printed photomask (Selba, Switzerland). We then proceeded to PDMS molding (1:10 ratio, RTV 615, Momentive Performance Materials) and thermal curing at 70 °C for two hours. After cutting PDMS pieces and punching out inlets and outlets with a biopsy puncher, PDMS devices were bonded to a glass bottom Petri dishes (WPI Fluorodish P35-100) using an oxygen plasma (Cute Plasma, Korea). After sealing, microfluidic chambers were washed with a solution of 0.2 wt% Pluronic F127 in water and let overnight à 4 °C to make the microchannel surfaces hydrophilic.
9
Fabrication of PLGA Microfibrous Membranes
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To repeatedly fabricate microfibrous membranes, we created a polydimethylsiloxane (PDMS) master mold by sequential photolithography and PDMS casting. We then used the PDMS master mold for PLGA casting to repeatedly produce microfibers.
Figure 2 shows the PLGA microfibrous membrane fabrication procedure. First, we spin-coated SU-8 2050 (Micro Chem, Westborough, MA, USA) negative photoresist to a suitable thickness on a cleaned silicon wafer substrate. After exposure to a mask with a designed pattern and developing, we obtained a replica mold of solid SU-8 2025. We then dripped a PDMS (Dow Corning, Midland, MI, USA) solution onto the SU-8 2025 replica mold, and placed it in a vacuum oven at 50°C for 12 h. We then detached the PDMS film from the replica mold and obtained a PDMS master mold with two line widths (20 and 30 μm), line spacing of 135 μm, thickness of 140 μm, and length of 9.5 mm. Next, we prepared a PLGA 85/15 (Green Square, Taoyuan, Taiwan) solution by dissolving PLGA powder in acetone (ECHO Chemical, Miaoli, Taiwan) in a 1:5 w/w ratio, gently spread it onto the PDMS replica mold, and placed the mold in a vacuum oven at 60°C for 2 min. We then scraped off any excess PLGA on the mold surface. After acetone volatilization, we performed demolding to obtain a PLGA microfiber membrane, which we then rolled into a bundle with a diameter of around 1.5–2.0 mm.
10
Microfluidic Device for Viscoelastic Sorting
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The design of the microfluidic device consists of four main elements: two inlets for separately introducing the viscoelastic sheath and sample fluids, a straight rectangular channel with a width of 20 μm and three different lengths (10, 15, and 20 mm), an expansion region (with an opening angle of 60°, a total length of 0.9 mm, and a maximum width of 0.6 mm), and seven outlets with customized fluidic resistors. The microchannel is uniform with a height of 50 μm. The master mold made of the negative photoresist SU-8 2050 (MicroChem, Newton, MA, USA) was patterned on a silicon substrate using a laser direct writer (MicroWriter ML3, Durham Magneto Optics, Durham, UK). Degassed poly(dimethyl siloxane) (PDMS; Sylgard 184, Dow Corning, Midland, MI, USA) in liquid form was prepared by mixing the PDMS base with the curing agent in a weight ratio of 10:1, casting over the SU-8 mold, and baking in an oven at 60 °C for at least 2 h. The PDMS slab containing a negative replica of the microchannels was then peeled off of the mold, and the openings for the inlets and outlets were punched. The PDMS slab and a glass substrate were treated with a plasma cleaner (PX 250, March Instruments, Concord, CA, USA) and assembled. To enhance bonding, the assembled microdevice was placed on a hotplate at 95 °C for 2 min.
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