The influence of regeneration on the thermooxidative stability of humics products was assessed by thermogravimetry. Prior to the analysis, the samples were dried for two weeks over sodium hydroxide, and then analyzed with a Q5000 IR TGA instrument (TA Instruments Inc., New Castle, DE, U.S.A.). The 100-μL platinum pans of the apparatus were used as sample holders, and the analysis was carried out using a 10°C∙min–1 temperature ramp from room temperature (RT) to 650°C, under a 50 mL∙min–1 flux of dry air.
Q5000 ir tga instrument
Manufactured by TA Instruments
Sourced in United Kingdom
The Q5000-IR TGA instrument is a thermogravimetric analyzer manufactured by TA Instruments. It is designed to measure the weight changes of a sample as a function of temperature or time under a controlled atmosphere. The instrument can provide quantitative information about physical and chemical changes that involve mass loss or gain.
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Lab products found in correlation
5 protocols using q5000 ir tga instrument
1
Thermooxidative Stability of Humics
2
Wafer Moisture Content Determination
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The residual moisture content of the wafers was determined by thermogravimetric analysis (TGA) using a Q5000-IR TGA instrument (TA Instruments, Crawley, UK). About 1.0–1.5 mg of sample was loaded and analyzed with dynamic heating from room temperature (~25 °C) to 300 °C at a heating rate of 10 °C/min under inert nitrogen (N2) gas at a flow rate of 50 mL/min. The percentage water loss was calculated at 175 °C using TA Instruments Universal Analysis 2000 software program.
3
Thermal Analysis of Biomaterials
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Tests were carried out on the starting materials [(SA, GLY), recombinant GST-GFP, GST and GFP (proteins) and the blank and protein loaded films. Analysis was carried out using a Q5000-IR TGA instrument (TA Instruments, Crawley, UK) by loading about 8.0 -10.0mg (SA, GLY), 9.5-10.0mg (proteins) and 3.0-3.6mg (film). The analysis was performed under inert nitrogen (N2) gas at a flow rate of 50mL/minute and dynamic heating from ambient (~25°C) to 600°C at a heating rate of 10°C/minute.
4
Thermogravimetric Analysis of Residual Moisture Content
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The residual moisture content was analysed using thermogravimetric analysis (TGA) by employing a Q5000-IR TGA instrument (TA Instruments, Crawley, UK). The film sample (1.0 -1.5mg) was loaded and analysed by heating from 25ºC -300ºC at 10ºC/min under constant stream of nitrogen gas flowing a 50 mL/min. The residual moisture content was determined at 100ºC by calculating the percentage weight change at that temperature with the help of the TA Instruments Universal Analysis 2000 software.
5
Thermogravimetric Analysis of Wafer Moisture
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The residual moisture content of wafers was determined by thermogravimetric analysis (TGA) using a Q5000-IR TGA instrument (TA Instruments, Crawley, UK). About 1.0 -1.5mg of sample was accurately weighed, loaded and analyzed with dynamic heating from room temperature (∼25ºC) to 300ºC at a heating rate of 10ºC/min under inert nitrogen (N2) gas at a flow rate of 50 mL/min. The percentage water content was calculated at 100ºC using TA Instruments Universal Analysis 2000 software program.
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