Crossbeam nvision 40 system

Classical TEM cross-sections of Ne⁺ broad-beam irradiated Fe₆₀Al₄₀ films glued together in face-to-face geometry using G2 epoxy glue (Gatan), were prepared by sawing (Wire Saw WS 22, IBS GmbH), grinding (MetaServ 250, Bühler), polishing (Minimet 1000, Bühler), dimpling (Dimple Grinder 656, Gatan) and final Ar⁺ ion milling (Precision Ion Polishing System PIPS 691, Gatan). To guarantee the reference wave passing through field-free space in the holography experiment, the classically prepared specimens were divided into two parts along the glue line with only one part being actually used for analysis.
TEM lamella preparation of the Ne⁺ion beam structured Fe₆₀Al₄₀ film was done by in situ lift-out using a Zeiss Crossbeam NVision 40 system. To protect the sensitive surface of the magnetically patterned film at the area of interest, a carbon cap layer was deposited beginning with electron beam assisted precursor decomposition and subsequently followed by Ga focused ion beam (FIB) assisted precursor decomposition. Afterwards, the TEM lamella was prepared using a 30 keV Ga FIB with adapted currents. The lamella was transferred to a 3 post copper lift-out grid (Omniprobe) using a Kleindiek micromanipulator. To minimize sidewall damage, Ga⁺ ions with energy limited to 5 keV were used for the final thinning of the TEM lamella to electron transparency.