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Sylgard 184 silicone elastomer base and curing agent

Manufactured by Dow
Sourced in United States

Sylgard 184 is a two-component silicone elastomer kit consisting of a base and a curing agent. The base and curing agent are mixed together to form a flexible, durable silicone material. The core function of Sylgard 184 is to provide a versatile silicone solution for a variety of applications that require a reliable, customizable elastomeric material.

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9 protocols using sylgard 184 silicone elastomer base and curing agent

1

Fabrication of LiNbO3-based microfluidic device

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In this study, Y+128° X-propagation lithium niobate (LiNbO3) was used as piezoelectric substrate. The IDT design was patterned by photolithography using a MA/BA6 mask aligner (SUSS MicroTec., Germany). After that, 50 Å of Cr was deposited as an adhesive layer, followed by a 500 Å gold layer for electrode fabrication. The deposition was conducted with an e-beam evaporator (Semicore Corp, USA). Finally, the metal layer was removed with photoresist and IDTs were formed by a lift-off process.
The PDMS/glass hybrid channel was fabricated by a standard soft lithography process, as shown in Figure S1 (Supporting Information). A thin layer of SU8 100 photoresist (MicroChem, USA) was spin-coated and patterned by ultraviolet (UV) exposure on a silicon wafer. A glass slide was placed on the SU8 mold at the designed position where standing acoustic filed was formed. The glass slide was made from micro cover glass (VWR, USA), and was cut to 800 μm × 5 mm by laser cutting. Sylgard 184 Silicone Elastomer Curing Agent and Base (Dow Corning, USA) were mixed at 1:10 and poured on the mold. After setting at room temperature overnight, the PDMS channel was peeled from the mold and bonded to the LiNbO3 substrate. Before bonding, the surface of the LiNbO3 substrate and the PDMS channel were treated with oxygen plasma.
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2

PDMS Microchannel Fabrication by Soft Lithography

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A PDMS microchannel with a height of 70 μm and a width of 200 μm was fabricated by standard soft lithography using SU-8 2035 (Kayaku) negative photoresist for the master mold. The Sylgard 184 Silicone Elastomer Curing Agent and Base (Dow Corning) were mixed at a 1:10 weight ratio, and then cast on top of the SU-8 mold. Air bubbles were removed by placing the dish inside a vacuum chamber for 1 h. The PDMS was then cured at 50 °C for 3 h. To bond a cut piece of PDMS negative stamp forming the cap with the MAWA chip, both pieces are placed inside an ozone plasma chamber for 3 min and manually aligned and bonded under the microscope.
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3

Microfluidic Device Fabrication from Microvascular Networks

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Previously,
our group has developed
a methodology for digitization and fabrication of microfluidic devices
based on in vivo microvascular networks.19 (link) A modified Geographic Information System (GIS) approach was used
to digitize the microvascular networks. The largest tissue area from
the network was selected, and the vascular wall adjacent to the area
was modified in AutoCAD to include a 3 μm pore size, the most
common and optimum for studying leukocyte migration.20 (link)−22 Briefly, the fabrication of the microfluidic devices starts with
lithographically patterning SU-8 photoresist on Si wafers. To achieve
the multiple heights associated with the vascular channels, barrier,
and tissue compartment area, multiple layers of SU-8 are spin-coated
and patterned. Microfabricated pillars (10 μm diameter) were
used to fabricate the 3 μm pores with a width of 100 μm
connecting the vascular and tissue compartments. Once the SU-8 microfluidic
features were patterned, the 1:10 w/w ratio of Sylgard 184 silicone
elastomer base and curing agent (Dow Corning, Midland, MI) was poured
over the master and cured. Subsequently, the cured polydimethylsiloxane
(PDMS) was peeled from the SU-8 master, followed by punching of inlet/outlet
ports, and plasma bonded to a glass slide cleaned to remove organic
species. The schematic of the device used in this study is shown in
Figure 1A.
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4

Silicon Wafer Mold Fabrication Protocol

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For silicon wafer mold fabrication, SU-8 2025 permanent epoxy negative photoresist and SU-8 developer were purchased from MicroChem (Newton, MA). Four-inch silicon wafers were purchased from University Wafer (Boston, MA). Custom laminated masks for patterning of photoresist were designed in AutoCad and sent for printing from CAD/Art Services, Inc. (Bandon, OR). Sylgard 184 silicone elastomer base and curing agent (Dow Corning, Midland, MI) were purchased from Krayden Inc. (Denver, CO). Extra dry acetone, sodium chloride, potassium chloride, sodium phosphate dibasic, potassium phosphate monobasic, Rhodamine B (RB), and Toluidine Blue (TB) were purchased from Sigma Aldrich (St. Louis, MO). Glass slides and cuvettes were purchased from Fisher Scientific. 2-[Methoxy(polyethyleneoxy)propyl]trimethoxysilane (PEG-silane) was purchased from Gelest (Morrisville, PA). Phosphate buffered saline (PBS), pH 7.4, containing 138 mM NaCl, 2.7 mM KCl, 10 mM sodium phosphate, and 100 mM EDTA was used for all experiments.
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5

Fabricating PDMS Microfluidic Devices

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A master mold of SU8 on a silicon wafer was prepared using soft photolithography. The microdevice was created by casting polydimethylsiloxane (PDMS), prepared by mixing Sylgard® 184 silicone elastomer base and curing agent (Dow Corning, Midland, MI) in 10:1 ratio, on the SU-8 master molds. The molded-PDMS was peeled off of the master mold after heat treatment at 60 °C overnight, and then bonded to a flat PDMS sheet using air plasma. The device bonding was cured briefly at 120 °C. The device design consisted of simple straight rectangular microfluidic channels with a range of cross sections (100 μm × 100 μm, 200 μm × 100 μm, or 400 μm × 100 μm (width × height) and lengths (10 mm or 100 mm).
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6

Fabrication of PDMS Films for AJP

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Films of PDMS (10:1 ratio of base elastomer to curing agent, Sylgard 184 silicone elastomer base and curing agent, Dow Corning Corp.) were cast into a glass petri dish to a thickness of approximately 2 mm, cured at T = 95 °C for 60 min in an oven, and cut in the desired dimension. A subsequent air plasma treatment (PE-25 Plasma System) was applied for 60 s immediately prior the AJP deposition.
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7

Microfabrication of PDMS Microdevices

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The process of microfabrication is described in detail elsewhere [16 (link)]. In short, a master mold of SU8 on a silicon wafer was prepared using photolithography, and then leaching the excess material. The microdevice was created by casting polydimethylsiloxane (PDMS), which was prepared by mixing Sylgard® 184 silicone elastomer base and curing agent (both Dow Corning, Midland, MI) in 10:1 ratio, on the SU-8 master molds. The device design engraved PDMS block was peeled off of the master mold after heat treatment at 60 °C overnight, and then bonded to a flat PDMS sheet using air plasma. The device bonding was cured briefly at 120 °C, and devices were autoclaved prior to use in experiments.
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8

Microfluidic Device Fabrication by Soft Lithography

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The microfluidic channels were patterned by soft lithography. First, SU-8-100 photoresist (MicroChem, USA) was spin-coated onto a silicon wafer, which was then baked at 95 °C for 1 hour. The coated photoresist was selectively exposed to UV light through a mask bearing the microfluidic pattern, after which the exposed photoresist was developed in propylene glycol monomethyl ether acetate (PGMEA) photoresist developer (MicroChem, USA). Poly (dimethylsiloxane) (PDMS) solution containing Sylgard 184 silicone elastomer base and curing agent (weight ratio, 10:1; Dow Corning, USA) was cured on the patterned wafer at 80 °C for 1 hour in a dry oven. Inlet and outlet ports of all channels, including an EC channel, two side channels, and four ECM channels, were then opened with a biopsy punch. After autoclaving this patterned PDMS (upper part) and a glass coverslip (bottom part; Paul Marienfeld, Germany), the channel side of the upper part was irreversibly bonded to the bottom part by oxygen plasma treatment (CUTE; Femtoscience, South Korea). Next, a 1-mg/mL poly-D-lysine (PDL; MW: 30,000–70,000; Sigma-Aldrich, USA) solution in distilled deionized water (DDW) was immediately pipetted into the bonded device, after which the device was placed in a humidified 37 °C incubator for 4 hours. After washing away the excess PDL, the device was dried at 80 °C in an oven for more than 24 hours.
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9

Microdevice Fabrication via Photolithography

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The process of microfabrication is described in detail else-where.18 (link) In short, a master mold of SU8 on a silicon wafer was prepared using photolithography in a dust free clean room. The microdevice was created by casting polydimethylsiloxane (PDMS), which was prepared by mixing Sylgard® 184 silicone elastomer base and curing agent (both Dow Corning, Midland, MI) in a 10:1 ratio, on the SU-8 master molds. The device was peeled off of the master mold after heat treatment at 60 °C overnight, and then bonded to a flat PDMS sheet using air plasma. The device bonding was cured briefly at 120 °C, and devices were sterilized using UV prior to use in experiments.
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