IP-S photoresist was purchased from Nanoscribe GmbH (Germany); SU-8 developer, from Microchem (USA); Novec 1720, from 3 M (USA); isopropyl alcohol, from VWR Analytical (USA); epoxy (#04001) from Hardman Inc. (USA); perfluorodecalin (PFD), from Sigma-Aldrich (USA); 1H,1H,2H,2H-perfluorooctanol (PFO), from Alfa Aesar Co. Inc. (USA); KDO8PS genes, from GenScript Inc. (USA); E. Coli, from New England Biolabs (USA); Sigma Fast tablets, β-mercaptoethanol, Tris, HCl, ethylenediaminetetraacetic acid (EDTA), protamine sulfate, KCl, and protease inhibitor cocktail, from Sigma-Aldrich (USA); and poly(ethylene glycol) 5000 methyl ether (PEG5000 MME), from Hampton Research (USA). Fused silica capillaries were obtained from Molex LLC (USA); tubing and capillary union connectors, from IDEX Health and Science LLC (USA); PicoClear unions, from New Objective, Inc. (USA); PEEK tubing, from Zeus (USA); double sided tape, from 3 M (USA); and 10 kDa cutoff filters, from Centricon, Millipore (USA).
Ip s photoresist
Manufactured by Nanoscribe
Sourced in Germany
IP-S photoresist is a high-performance negative-tone photoresist developed by Nanoscribe for use in its 3D printing systems. It is designed for the fabrication of high-resolution structures and features using the company's direct laser writing technology.
Automatically generated - may contain errors
Lab products found in correlation
Su 8 developer, by MicroChem (3 mentions)
Photonic professional system, by Nanoscribe (2 mentions)
Novec 1720, by 3M (1 mentions)
E coli, by New England Biolabs (1 mentions)
Sigmafast tablet, by Merck Group (1 mentions)
Protease inhibitor cocktail, by Merck Group (1 mentions)
Potassium chloride (kcl), by Merck Group (1 mentions)
β mercaptoethanol, by Merck Group (1 mentions)
Double sided tape, by 3M (1 mentions)
Matlab, by MathWorks (1 mentions)
Solidworks, by Dassault Systèmes (1 mentions)
3 protocols using ip s photoresist
1
Microfluidic Protein Purification Protocol
2
Bioinspired Hierarchical Surface Fabrication
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2.1 Surface Modelling. The simulation method of bi-Gaussian stratified morphology (see Section S1) was implemented in Matlab (Mathworks Inc, USA) to generate the pillar-height matrix according to the prescribed bi-Gaussian stratified indexes (see Table S1). Mushroom-pillar structures were modelled in SolidWorks (Dassault Systemes, France) whose heights were set as the above matrix. The resulting 3D model of the plateau-inspired surface was output at a stereolithography format. This approach was also adopted to model the other four plateau-inspired surfaces with emulated mechanical damage.
2.2 Surface Fabrication. On Photonic Professional System (NanoScribe GmbH, Germany), the IP-S photoresist (NanoScribe GmbH, Germany) was exposed to a 780-nm femtosecond laser through an oil-immersion objective at a speed of 100 mms -1 with a power of 110 mW so as to be fabricated on an ITO coated fused silica. The laser was commanded to write 0.5 m beneath the interface between the photoresist and the substrate, thus ensuring a strong adhesion between the printed structures and the glass substrate. The fabrication was then developed for 20 minutes in SU-8 Developer (MicroChem Corp, USA) and rinsed in isopropyl alcohol and deionized water.
2.2 Surface Fabrication. On Photonic Professional System (NanoScribe GmbH, Germany), the IP-S photoresist (NanoScribe GmbH, Germany) was exposed to a 780-nm femtosecond laser through an oil-immersion objective at a speed of 100 mms -1 with a power of 110 mW so as to be fabricated on an ITO coated fused silica. The laser was commanded to write 0.5 m beneath the interface between the photoresist and the substrate, thus ensuring a strong adhesion between the printed structures and the glass substrate. The fabrication was then developed for 20 minutes in SU-8 Developer (MicroChem Corp, USA) and rinsed in isopropyl alcohol and deionized water.
3
Nanoscale 3D Microstructure Fabrication
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Using Photonic Professional System (Nanoscribe GmbH, Germany), commercially available IP-S photoresist (Nanoscribe GmbH, Germany) was exposed to a 780-nm femtosecond laser at a speed of 100 mm·s−1 with a power of 110 mW. The laser was written 0.5 μm beneath the interface between the photoresist and the ITO-coated fused silica substrate so as to construct a strong adhesion between the structures and the substrate. The resulting fabrication was developed for 20 min in SU-8 Developer (MicroChem Corp., USA) and rinsed in isopropyl alcohol and deionized water.
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