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84 protocols using su 8 developer

1

Microfluidic Device Fabrication using SU-8 and PDMS

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Silicon wafers (4 inch) from Corning Inc. SU-8 2015 photoresist, and SU-8 developer from MicroChem Corp. and polydimethylsiloxane (PDMS RTV615) from Momentive Performance Materials Inc. were used. The microchip pattern was designed with AutoCAD software (Autodesk Inc.) and then printed out as 10-µm resolution chrome masks by Photo Science Inc. The photomask pattern was first translated into a microstructure on a 4-in silicon wafer using SU-8 2015 photoresist, which is a mold for casting PDMS materials. Briefly, the mold was prepared by spin coating SU-8 2015 photoresist onto a silicon wafer and crosslinking by UV for 180 seconds. Subsequently, the designed pattern was developed using SU-8 developer (Microchem Corp.) and cleaned with isopropyl alcohol and nitrogen gas. The holes for the inlets and outlets were punched using needles. The PDMS layer was cleaned by rinsing with isopropyl alcohol and deionized water, and dried with nitrogen gas. After treatment with oxygen plasma, the PDMS layer was bonded immediately to a 75×50-mm glass slide. Finally, the bonded device was baked for 2 h at 80°C.
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2

Multicomponent Cell Culture Protocol

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Acetone, ethanol, and IPA were purchased from Millipore. The SU-8 and SU-8 developers were purchased from MicroChem. The amorphous fluoroplastic solution was purchased from Chemours Company. Pluronic F127 was purchased from Sigma-Aldrich (Oakville, ON, USA). Silicone oil (1 Cst) was purchased from Clearco, USA. Fetal bovine serum (FBS), PBS, collagenase II, Hank’s Balanced Salt Solution (HBSS), Earle’s balanced salt solution (EBSS), DMEM/F12, Glutamax, HEPES, and 1:50 B27 were purchased from Gibco. Cis-diammineplatinum (II) dichloride, EP, Y27632, dexamethasone, penicillin/streptomycin, N-acetyl-l-cysteine, nicotinamide, insulin, hydrocortisone, cholera toxin, and hyaluronidase were purchased from Sigma. Wzb117 was purchased from Selleckchem. Recombinant human EGF, recombinant human FGF10, and recombinant human HGF were purchased from Peprotech. RBC lysis buffer, EthD-1, erythrocyte lysate, and Cell Tracker™ Green CMFDA Dye were purchased from Invitrogen. StemMACS iPS-Brew XF medium was purchased from Miltenyl Biotec (USA). Dimethyl sulfoxide, Sor, Reg, Apa, Len, and DNase I were purchased from Solarbio. Forskolin and A8301 were purchased from Tocris.
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3

Nanomaterial Synthesis and Device Fabrication

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The PLGA polymer was provided by Akina Chemicals
(West Lafayette,
IN, USA). The DSPE-PEG amine was supplied by Avanti Polar Lipids (Alabaster,
AL, USA). Lecithin (soybean, refined) was supplied by Alfa Aesar.
4% by weight aqueous ethanol, acetonitrile, and chloroform were purchased
from Sigma-Aldrich (St. Louis, MO, USA). For device fabrication, silicon
wafers were obtained from Silicon Quest International (San Jose, CA,
USA) Inc. SU-8-2035 and SU-8 developers were obtained from Microchem
Corporation (Westborough, MA, USA). Sylgard 181 Silicone Elastomer
Base was obtained from Dow Corning (Midland, Michigan, USA).
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4

Synthesis and Characterization of InP/ZnS Quantum Dots

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InP/ZnS QDs in toluene (5 mg/mL, emission wavelength 610 nm) were purchased from Mesolight (People’s Republic of China). Polystyrene/divinyl benzene beads (diameter 30 µm) were purchased from GE Healthcare (Seoul, South Korea). SU-8 2050 and SU-8 developers were purchased from Micro Chem (Newton, MA, USA). PDMS (Sylgard 184) and a curing agent were purchased from Dow Corning (Midland, MI, USA). MPA, MUA, l-dopamine hydrochloride, adenosine, EDC, NHS, ZnSO4, and n-hexane were purchased from Sigma-Aldrich (St Louis, MO, USA). Ethanol was purchased from Duksan Pure Chemicals.
Fluorescence emission spectra of the QDs were obtained using a fluoroluminescence spectrometer (Quanta Master, Photon Technology International, NJ, USA) equipped with a xenon lamp (Arc Lamp Housing, A-1010B™), monochromator, and power supply (Brytexbox). Fourier-transform infrared (FTIR) spectra were recorded using a Bruker Vortex 70 FTIR spectrometer. Sonication was performed using a Branson 8510 sonicator. Fluorescence images were obtained using a fluorescence microscope (Nikon, Melville, NY, USA). O2 plasma treatment was performed using plasma cleaner (Harrick Scientific Co., Germany).
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5

Soft Lithography Microfluidic Fabrication

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All devices used in this paper were designed and fabricated via standard soft lithography protocols72 (link). Briefly, microfluidic molding masters were created by (1) coating 4” test-grade silicon wafers (University Wafer, South Boston, MA) with a single layer of SU-8 2050 negative photoresist, (2) soft baking, (3) exposing this SU-8 layer to UV light passing through a printed transparency mask (designed in AutoCAD (Autodesk); printed at 50,000 dpi by Fineline Imaging), (4) postexposure baking, and (5) developing away uncured photoresist using SU-8 developer (Microchem Corp, Newton, MA) according to standard manufacturer instructions. These molding masters were then used to cast single-layer droplet generators composed of a 1:5 ratio of poly(dimethylsiloxane) crosslinker:base (PDMS, RTV 615, Momentive Performance Materials, Albany, NY), and these resultant devices were assembled as described in the Supplemental Methods. All holes were punched by a catheter punch (SYNEO, 0.025” ID × 0.035” OD, Part No: CR0350255N20R4) to fit the outer diameters of PEEK tubing (ZEUS, 0.010” ID × 0.020” OD) and steel blunt pins (New England Small Tube, Part No: NE-1310-02). All design files and detailed protocols for the molding master and device fabrication are available as Supplementary Files and in an associated OSF repository (https://osf.io/jvnpc/).
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6

3D Micro-Rocket Fabrication via Direct Laser Writing

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The 3D micro-rocket was printed based on the direct laser writing technique by the Photonic Professional GT system (Nanoscribe GmbH). With a spin-coated 50-μm-thick photoresist (SU-8 50, MicroChem Corp.) on transparent glass and utilization of the pre-bake and soft-bake processes, a 780-nm laser was focused in the photoresist, and the structure was printed with 0.4-μm slicing and 0.4-μm filling. After the microprinting and post-bake processes, the sample was developed in an SU-8 developer (MicroChem Corp.) and rinsed with isopropyl alcohol. After air drying, hundreds of micro-rockets were obtained from the substrate. To realize near-infrared light actuation, a 100-nm-thick gold layer was coated on the micro-rocket surface.
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7

Fabrication of Microfluidic DEP Devices

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To fabricate the DEP devices, photoresist SU-8 2025 (MicroChem) was spin-coated on the surface of a 4-inch silicon wafer, and soft baked first at 65 °C for 3 min and then 95 °C for 7 min. The thickness of the photoresist was 50 μm. The photoresist was exposed to ultra violet (UV) through a mask with the designed microchannel (Figure 1), baked first at 65 °C for 1 min and then at 95 °C for 6 min, and further developed using the SU-8 developer (MicroChem) for ~5 min. The photoresist mold was then obtained by hard baking at 150 °C for 5 min. PDMS (Dow Corning) pre-polymer was fully mixed with its crosslinking agent at a 10:1 mass ratio. The mixture was poured over the photoresist mold and cured at 72 °C for 3 h. The crosslinked PDMS layer imprinted with the designed microfluidic channel was then peeled off the photoresist mold and punched with 2 mm holes at the inlets and exits of the microchannel using a puncher. Finally, the PDMS layer was bonded to a glass slide after oxygen plasma treatment for 1 min. Before use, the device was filled with 1% BSA in deionized water overnight at 4 °C to make the surface of the microfluidic channel in the PDMS layer more hydrophilic.
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8

Fabrication of PDMS Microfluidic Devices

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Fabrication of PDMS microfluidic devices followed standard rapid prototyping procedures as previously described (18 (link)). The patterns on a silicon wafer for microchannels (4 μm high and 100 μm wide) and nanoslit (450 nm high and 40 μm wide overlayed with 4 μm high and 80 μm wide microchannels were fabricated using soft lithography. The Cr mask was obtained from Amed Inc. (Seoul, Korea). SU-8 2005 photoresist (Microchem, Newton, MA, USA) was spin-coated onto the silicon wafer to make 4 μm high photoresist layer. After spin coating, the baked wafer was exposed under 350 nm irradiation. The patterned wafer was baked again and developed using a SU-8 developer (Microchem). The height was measured by a profilameter (Dektak XT, Bruker). The PDMS pre-polymer mixed with curing agent (10:1 weight ratio) was cast on the patterned wafer and cured at 65° C for 4 h or longer. Cured PDMS was peeled off from the patterned wafer and then PDMS devices were treated in an air plasma generator for 30 s with 100W (Femto Science Cute Basic, Korea) to make PDMS surface hydrophilic. PDMS devices were stored in water and air-dried before use.
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9

Generation of Immune Cell Cultures

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Phorbol-12-myristate 13-acetate (PMA) was purchased from Cayman Chemical (Ann Arbor, MI, USA). Dulbecco’s phosphate-buffered saline (DPBS), RPMI-1640 culture medium, and fetal bovine serum (FBS) were purchased from Welgene, Inc. (Daegu, Republic of Korea). Dopamine hydrochloride, RGD, and dexamethasone (Dex) were purchased from Sigma-Aldrich (St. Louis, MO, USA). SU-8 3005 and SU-8 developer were purchased from MicroChem (Round Rock, TX, USA). PDMS prepolymer (Sylgard 184) and a curing agent were purchased from Dow Corning (Midland, MI, USA). Norland Optical Adhesive (NOA) 63 was purchased from Norland Products (Jamesburg, NJ, USA). Tris-HCl was purchased from Biosesang (Seongnam, Republic of Korea). Ethylenediaminetetraacetic acid (EDTA) was purchased from Amresco Inc. (Solon, OH, USA). Granulocyte-macrophage colony-stimulating factor (GM-CSF) and interferon (IFN)-γ were purchased from R&D Systems (Minneapolis, MN, USA). Pluronic F-127 solution and antibiotic–antimycotic solution were purchased from Invitrogen Corp. (Waltham, MA, USA). 1,25-dihydroxy vitamin D3 (VitD3) was purchased from Toronto Research Chemicals Inc. (Toronto, ON, Canada).
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10

Fabrication of Gold Electrodes

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Two gold electrodes with gap size of about 50.0 μm were fabricated using UV-lithography process. SU8 photoresist was deposited onto Si wafer of dimensions (1.0 cm × 1.0 cm) after cleaning using standard RCA method. Spin coating was carried-out at a speed of 2000 rpm for 1 minute. In the next step, UV light was exposed through the designed mask via the lithography process. Post Exposure Bake (PEB) at 95°C was followed by the develop process using MicroChem’s SU-8 developer. Au deposition onto the sample was achieved using thermal evaporation with thickness of about 100 nm. The resulting thin film of Au was then annealed for 30 minutes at 200°C.
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