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Dbe 712

Manufactured by Gelest
Sourced in United States

DBE-712 is a laboratory equipment product manufactured by Gelest. It is designed for use in various scientific and research applications. The core function of DBE-712 is to perform specific tasks or procedures within a controlled laboratory environment.

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Lab products found in correlation

2 protocols using dbe 712

1

PDMS-PEG Copolymer for Microfluidic Devices

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A block copolymer with a poly(dimethylsiloxane) (PDMS) and hydrophilic poly(ethylene glycol) (PEG) blocks, PDMS-PEG, was purchased from Gelest (product code DBE-712, dimethylsiloxane-(60–70% ethylene oxide) block copolymer, MW 600, 20 cSt, specific gravity: 1.01, refractive index: 1.442, Gelest, USA) and utilized as an additive in the modification of microfluidic devices. Silicone pre-polymer and curing agent were mixed in a mass ratio of 10:1 (w/w). Desired amount of PDMS-PEG BCP was then added to the polymer base-curing agent mix to obtain a final additive concentration of 0.125%, 0.25%, 0.5% 1.0%, 1.5%, 2.0% (w/w) in the mixtures. The mixtures were blended using a glass a rod and poured onto a silicon wafer or into a petri dish for the fabrication of microfluidic devices and slabs, respectively. Trapped air bubbles were removed by keeping the mixture at +4 °C for 15 min. After removing air bubbles, the blended mixture was cured at 70 °C for 24 h. All devices and slabs (~2 mm thick) were rinsed with isopropyl alcohol (IPA) for 24 h and dried at room temperature (RT). Steam sterilization was applied to microfluidic devices before performing experiments.
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2

Polishing Composition with Colloidal Silica Abrasives

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Example 1

Abrasive grains (sulfonic acid-immobilized colloidal silica, Average Secondary Particle Size: 20 nm), DBE-712 (manufactured by Gelest, Inc., side-chain type polyoxyalkylene-modified silicone oil, Content of Ethylene Oxide: 70 mass %, Weight Average Molecular Weight: 600) as the selection ratio improver, and a maleic acid as an acid were stirred and mixed in a dispersing medium (pure water) such that the concentration of the abrasive grains was 1.5 mass % and such that pH was 1.5, and thus, a polishing composition was prepared (Mixing Temperature: approximately 25° C., Mixing Time: approximately 10 minutes).

Note that, the average secondary particle size of the abrasive grains was measured by a laser diffraction scattering method. In addition, the pH of the polishing composition (Liquid Temperature: 25° C.) was checked by a pH meter (manufactured by HORIBA, Ltd., Model Number: LAQUA).

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