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Silver paste

Manufactured by Ted Pella

Silver paste is a conductive adhesive material used in various laboratory applications. It consists of a suspension of silver particles in a binder or vehicle. The primary function of silver paste is to provide an electrically conductive bond or interface between components or surfaces.

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6 protocols using silver paste

1

Fabrication of Responsive Nanocomposite Structures

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Lithium fluoride (LiF, Sigma-Aldrich, BioUltra, ≥99.0%), hydrochloric acid (HCl, Sigma-Aldrich, ACS reagent, 37%), Ti3AlC2 MAX powders (MAX, Tongrun Info Technology Co. Ltd, China), single-walled carbon nanotubes (SWNTs, Timesnano Co. Ltd, China), sodium dodecyl sulfate (SDS, Sigma-Aldrich, >99.9%), poly(vinyl alcohol) (PVA) (Mw 67,000, Sigma-Aldrich), ethanol (Thermo Fisher, >99.5%), and DCM (J.T. Baker; 99.9%) were used as received without further purification. Biaxial PS shrink films were purchased from Grafix. Thermally responsive shrink films (with uniaxial contraction mode) were produced by EVERGREEN SCIENTIFICS. VHBTM Tape 4910 (1 inch × 36 yards) was purchased from 3 M. Silver paste was purchased from Ted Pella Inc. Commercial standard resistors were purchased from TELESKY. Deionized (DI) water (18.2 MΩ) was obtained from a Milli-Q water purification system (Merck Millipore) and used as the water source throughout the work.
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2

Preparation of CNS Electrode for Electrochemical Measurements

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Example 2

To prepare the electrode from CNS grown on Si wafer, the surface of CNS was gently scratched at the edge of a piece of cleaved 1.0×1.5 cm2 CNS-coated wafer, and a small piece of indium metal (Alfa Aesar, >99.99%) was pressed on the scratch to produce an ohmic contact. Then, silver paste (Ted Pella) was used as conductive glue between a copper wire and the indium pad. The edges and backside of the samples were protected by epoxy to isolate them from contacting the electrolyte.

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3

Boron-doped Ultrananocrystalline Diamond Electrodes

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Boron-doped ultrananocrystalline
diamond (BD-UNCD) films (thickness ∼2 μm) on SiOx/Si (500 μm) with geometric areas between
0.5–1.5 cm2 were cleaved from a 4 in. UL25 wafer
purchased from Advanced Diamond Technologies (Romeoville, IL). Cleaved
pieces from this wafer were then electrically connected to a thin
copper wire using silver paste (Ted Pella, PN#16031). The contact
was left to dry at room temperature for several hours. The copper
wire and paste were then isolated from the electrolyte using a glass
tube and nonconductive epoxy (Loctite EA 9462 Hysol).
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4

MXene Membrane Charge Carrier Characterization

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Carrier concentration and Hall
mobility of the MXene membranes were measured by a Hall-effect measurement
system (7700A, Lake Shore) using the van der Pauw technique for 1
× 1 cm2 samples at RT under a magnetic field range
of ±5 to ±20 KG by linear sweep with field reversal mode.
Ohmic contact was achieved by fast-drying silver paste (Ted Pella)
at the four corners of the sample with lead wires from a printed circuit
board for the measurement.
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5

Fabrication of Flexible Conductive Devices

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Single-walled carbon nanotubes (SWNT, Timesnano Co. Ltd, China), sodium dodecyl sulfate (SDS, Sigma-Aldrich, >99.9), ethanol (Thermo Fisher, >99.5%), silver nanowire (Sigma-Aldrich), and ethyl acetate (J.T. Baker; 99.9%) were used as received without further purification. Polyvinylidene fluoride (PVDF) membrane (diameter 3.8 cm, 0.22 µm pore, Merck Millipore) were purchased from Durapore. Biaxial polystyrene shrink films were purchased from Grafix. EcoflexTM and Dragon Skin were purchased from Smooth-On, Inc. Silver paste was purchased from Ted Pella Inc. Deionized (DI) water (18.2 MΩ) was obtained from a Milli-Q water purification system (Merck Millipore) and used as the water source throughout the work.
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6

Electrode Fabrication from CNS on Si Wafer

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To prepare the electrode from CNS grown on Si wafer, we gently scratched the surface of CNS at the edge of a piece of cleaved 1.0-cm × 1.5-cm CNS-coated wafer, and a small piece of indium metal (>99.99%; Alfa Aesar) was pressed on the scratch to produce an ohmic contact. Then, silver paste (Ted Pella) was used as conductive glue between a copper wire and the indium pad. The edges and backside of the samples were protected by epoxy to isolate them from contacting the electrolyte.
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