Silver paste
Silver paste is a conductive adhesive material used in various laboratory applications. It consists of a suspension of silver particles in a binder or vehicle. The primary function of silver paste is to provide an electrically conductive bond or interface between components or surfaces.
Lab products found in correlation
6 protocols using silver paste
Fabrication of Responsive Nanocomposite Structures
Preparation of CNS Electrode for Electrochemical Measurements
Example 2
To prepare the electrode from CNS grown on Si wafer, the surface of CNS was gently scratched at the edge of a piece of cleaved 1.0×1.5 cm2 CNS-coated wafer, and a small piece of indium metal (Alfa Aesar, >99.99%) was pressed on the scratch to produce an ohmic contact. Then, silver paste (Ted Pella) was used as conductive glue between a copper wire and the indium pad. The edges and backside of the samples were protected by epoxy to isolate them from contacting the electrolyte.
Boron-doped Ultrananocrystalline Diamond Electrodes
diamond (BD-UNCD) films (thickness ∼2 μm) on SiOx/Si (500 μm) with geometric areas between
0.5–1.5 cm2 were cleaved from a 4 in. UL25 wafer
purchased from Advanced Diamond Technologies (Romeoville, IL). Cleaved
pieces from this wafer were then electrically connected to a thin
copper wire using silver paste (Ted Pella, PN#16031). The contact
was left to dry at room temperature for several hours. The copper
wire and paste were then isolated from the electrolyte using a glass
tube and nonconductive epoxy (Loctite EA 9462 Hysol).
MXene Membrane Charge Carrier Characterization
mobility of the MXene membranes were measured by a Hall-effect measurement
system (7700A, Lake Shore) using the van der Pauw technique for 1
× 1 cm2 samples at RT under a magnetic field range
of ±5 to ±20 KG by linear sweep with field reversal mode.
Ohmic contact was achieved by fast-drying silver paste (Ted Pella)
at the four corners of the sample with lead wires from a printed circuit
board for the measurement.
Fabrication of Flexible Conductive Devices
Electrode Fabrication from CNS on Si Wafer
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