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Q500 system

Manufactured by TA Instruments
Sourced in United States

The Q500 is a thermal analysis system designed for measuring the physical and chemical properties of materials. It provides precise and reliable measurements of properties such as weight change, heat flow, and temperature over a wide range of temperatures. The Q500 is a versatile instrument suitable for a variety of applications in research, development, and quality control.

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5 protocols using q500 system

1

Multimodal Characterization of Novel Materials

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XPS were measured by an Escalab 250 (Thermo Fisher Scientific, USA) instrument that employs Al Kα radiation. FTIR were conducted on a Nicolet iS10 system (Thermo Fisher Scientific, USA) in the range of 4000–700 cm−1. TGA was characterized by a Q500 system (TA Instruments, USA) under nitrogen atmosphere with a heating rate of 10 °C min−1. DSC measurement was carried out on a Q2000 instrument (TA Instruments, USA) under nitrogen atmosphere using a heating rate of 10 °C min−1. Elemental analysis measurement was conducted using a Vario Micro Cube (Elementar, Germany). UV–Vis spectrum analysis was done using a Lambda 750 spectrophotometer (Perkin Elmer, USA). The magnetic property was tested using VSM on a Squid-VSM system (Quantum Design, USA) at 80 °C. Cross-sectional membrane samples for TEM (Tecnai G2 F20 field emission TEM, FEI, USA) were embedded in epoxy resin and solidified at 100 °C for 2 h, and then cut on an EMUC6 ultramicrotome (Leica, Germany). Elements W, Fe, and S were detected and mapped by an Enfinium 977 EELS spectrometer (Gatan, USA), and the mapping time was 2 s. The particle size of PWA was estimated by DLS technique on a Zetasizer nano ZS90 apparatus (Malvern Instruments, UK). Cross-sectional membrane samples for SEM (SU8010 field emission SEM, Hitachi, Japan) were freeze-fractured in liquid nitrogen and vacuum sputtered with a thin layer of gold.
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2

Characterization of Poly(4-Vinylguaiacol) Polymers

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1H NMR spectra were recorded on a JEOL ECS-400 spectrometer (JEOL, Tokyo, Japan) operated at 400 MHz. The number-average molecular weights (Mn) and molecular weight distributions (Mw/Mn) of the product polymers were determined via size-exclusion chromatography (SEC) in DMF containing 100 mM LiCl at 40 °C on two hydrophilic polymer gel columns [Tosoh α-M + α-3000 (7.8 mm i.d. × 30 cm) (Tosoh Corporation, Tokyo, Japan); flow rate of 1.0 mL/min] (for poly(4VG)) connected to a JASCO PU-2080 precision pump and a JASCO RI-2031 detector (JASCO, Tokyo, Japan). The columns were calibrated against standard polystyrene samples (Agilent Technologies, Santa Clara, CA, USA; Mp = 580–3,053,000, Mw/Mn = 1.02–1.23). The glass transition temperature (Tg) of the polymers was recorded on a Q200 differential-scanning calorimeter (TA Instruments, Inc., New Castle, DE, USA), and the Tg values were obtained from the second scan after removing the thermal history. The samples were first heated to 210 °C at 10 °C/min, equilibrated at this temperature for 10 min, and cooled to −60 °C at 5 °C/min. After holding at this temperature for 5 min, the samples were then reheated to 210 or 260 °C at 10 °C/min. The thermogravimetric analyses (TGA) were performed on a Q500 system (TA Instruments Inc.) at 5 °C/min under a N2 gas flow.
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3

Structural and Thermal Analysis of Materials

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X-ray diffraction (XRD) measurements were performed using a Philips
X’Pert-Pro diffractometer using monochromatic Cu Kα radiation
(40 mA, 40 kV) with a step width of 0.013° (2θ). JCPDS
cards were used to identify the crystalline phases. Transmission electron
microscopy (TEM) images of composite samples were recorded using a
TEM/STEM JEOL JEM 2200 fs microscope operating at 200 kV. Prior to
TEM analysis, powders of the sample were prepared and dispersed in
water and a drop of the finely dispersed sample was put on a Lacey
Carbon film copper TEM grid. The TEM grid with the sample droplet
was dried overnight in an oven at 40 °C. Fifty particles at random
locations were analyzed by Image J to determine the particle size
and distribution. HRTEM images were used to determine the lattice
plane distance using the Image J software. Thermogravimetric analysis
(TGA) was carried out to study the thermal behavior of the prepared
materials using a Q500 system from TA Instrument (New Castle, DE);
the samples were heated from 50 to 700 °C at 10 °C/min in
nitrogen or air (gas flow of 60 mL/min). The tests were performed
by placing about 10 mg of the sample in open alumina pans.
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4

Comprehensive Material Characterization

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The X-ray diffraction
(XRD) pattern was recorded with a New D8 Advance X-ray diffractometer
(Bruker, USA) using Cu Kα radiation. Fourier-transform infrared
(FT-IR) spectra were acquired on a Nicolet iS10 IR spectrophotometer
(Thermo Fisher Scientific, USA) with the sample in potassium bromide
pellets. Thermogravimetric analysis (TGA) was conducted using a Q500
system (TA Instruments, USA) at a scan rate of 5 °C min–1 under an air atmosphere. The nitrogen adsorption–desorption
isotherm was obtained using a 3Flex surface characterization analyzer
(Micromeritics, USA) at −196 °C. The sample was vacuum-dried
at 100 °C overnight prior to analysis. Field-emission scanning
electron microscopy (FE-SEM) photographs were obtained on a SUPRA
55VP field-emission scanning electron microscope (Zeiss, Germany).
Zeta potential was evaluated using a Z-1000 electrophoretic light
scattering spectrophotometer (ELS, Otsuka Electronics, Japan).
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5

Characterizing Photovoltaic Materials using XRD, TGA, and SEM

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The X-ray diffraction (XRD) spectra were recorded using a diffractometer (Bruker AXS, D8-Discover, Middlesex County, MA, USA) with a Cu X-ray tube in the 10–60° 2θ range. The photovoltaic characteristics were measured under air mass 1.5 G illumination (solar simulator, Model Sol2A, Oriel, Irvine, CA, USA) at 25 °C. Thermogravimetric analysis (TGA) was performed using a Q500 system (TA Instruments, New Castle, DE, USA) with an electronic scale during target combustion up to 600 °C. The surface profiles were characterized using a scanning electron microscope (SU8220, Hitachi, Tokyo, Japan).
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