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Multiphysics v 5.3a

Manufactured by Comsol
Sourced in Sweden

COMSOL Multiphysics v.5.3a is a software package for the modeling and simulation of physics-based problems. It provides a unified workflow for all steps in the modeling process: defining the geometry, specifying the physics, meshing, solving, and post-processing. The software supports a wide range of application areas, including electromagnetics, structural mechanics, acoustics, fluid flow, heat transfer, and chemical reactions.

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5 protocols using multiphysics v 5.3a

1

Fluidic Barrier and Diode Simulations

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All FEA simulations were performed using the commercial software, COMSOL Multiphysics v.5.3a (COMSOL Inc., Sweden). Initially, 3D models of the components of interest (e.g., barrier walls, microfluidic diodes) were created using SolidWorks (Dassault Systemes). The 3D CAD models were then imported into the COMSOL Multiphysics software. For the fluidic barrier walls, static solid mechanics simulations were performed while fixing the lateral surfaces of the barrier (which would be connected to the luminal surface of the microchannel) and increasing the applied pressure on one side of the barrier wall from 0 to 75 kPa. Von Mises stress profiles were outputted for analysis. For the microfluidic diode, FSI simulations were performed with the stokes flow physical model and quasi-static structural transient behavior. The structure material (IP-L 780) was modeled with material properties E = 1.75 GPa and ν = 0.4961 . The input pressure conditions were designed to ensure simulation termination upon mesh intersection (e.g., the surface of the sealing disc interacting with either the bottom orifice or the intermediary structure the source output channel) in order to avoid topological changes. IPA (ρ = 0.783 kg/m3; η = 2.04 mPa s) was modeled as the input fluid.
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2

Terahertz Grating Modeling Using FEM

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The fabricated structure was modelled using the commercial FEM software. COMSOL Multiphysics® v.5.3a (COMSOL Inc., Burlington, MA, USA). The structure can be assumed to be infinite in the longitudinal direction; thus, the problem can be reduced to a 2D model. The distance from both ports to the metasurface is much longer than the wavelength. The FEM model is shown in Figure 2.
In the plane wave approximation, we used periodic boundary conditions to replicate one spatial period and took into account the ellipsoidal shapes for the substrate grooves (see Figure 3 for SEM images at different magnifications). Table 1 summarizes the geometrical characteristics of the THz grating we used in the FEM model.
The relative permittivity of the SiO2 substrate and PMMA layers is set to εs = 3.8 [25 (link)] and εp = 2.6 [26 (link)], respectively. According to the literature data, both materials have insignificant absorption in the considered frequency range ([25 (link),26 (link)] for SiO2 and PMMA, respectively); therefore, their loss tangent is set to zero.
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3

Optical Trapping and Fluid Dynamics Modeling

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COMSOL Multiphysics® software was used to perform the modeling of the optical trapping force, electroosmotic, and electrophoretic flows (Ref. COMSOL Multiphysics® v. 5.3a. www.comsol.com. COMSOL AB, Stockholm, Sweden). 3D models were constructed to solve the optical trapping, electromagnetic heating, and fluid dynamics problems. The optical trapping force was obtained by integrating Maxwell’s stress tensor over the particle surface. Perfectly matched layers were used over the whole domain to prevent backscatter from the boundaries. A Gaussian beam was illuminated from the top side. The refractive index and thermal conductivity of gold, silicon, and aluminum oxides were taken from the COMSOL library, and the refractive index of the fluid was set to 1.33. The electroosmotic and electrophoretic flows were obtained by solving the Poisson–Nernst–Planck equations. The electrical conductivity, relative permittivity, density, and dynamic viscosity of the fluid were 1.5 S m–1, 79, 1000 kg m–3, and 0.8 mPa s, respectively. The ζ of the hole and particle surfaces were –20 mV and no-slip boundary conditions were applied to the remaining surfaces.
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4

Fluidic Transistor Simulation Protocol

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Theoretical simulations of the fluidic transistors were performed using the commercial FEA software COMSOL Multiphysics v.5.3a (COMSOL Inc., Sweden) via methods similar to those reported in our previous work (57 ). Initially, the complete 3D CAD model (i.e., including both materials fully assembled) corresponding to each fluidic transistor was imported into the FEA software, and then the distinct material properties were set for the compliant and rigid components. Specifically, the compliant components were modeled as Agilus30 (E = 0.09 GPa; ρ = 1.125 × 103 kg/m3; ν = 0.4), while the rigid components were modeled as MED610 (E = 2.6 GPa; ρ = 1.175 × 103 kg/m3; ν = 0.7). Simulations were performed using the COSMOL Multiphysics “Solid Mechanics” module. The PG input was modeled as a boundary load on the internal surface of the gate region diaphragm, while the source-to-drain region diaphragm components were assigned as free boundaries. For all of the fluidic transistor designs modeled, the PG input was incrementally increased up to the point of physical contact between the top surface of the sealing O-ring and the surface adjacent to the source orifice. All simulations were computed using the stationary (time-independent) solver and a parametric sweep function for applied loads.
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5

3D Modeling of Ernietta Fossil

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A 3D digital model of Ernietta was constructed in COMSOL Multiphysics v. 5.3a through box modeling. The model was built from multiple cylindrical elements, which were iteratively added, moved, rotated, and scaled to approximate the modular shape of the organism (fig. S2). The model was scaled on the basis of measurements reported for published fossil material (14 ) and incomplete specimens collected during fieldwork from Namibia (fig. S3). To avoid adding additional interpretive biases, the model was based solely off fossil material and not previous artistic reconstructions. Hence, some smaller features, such as specialized feeding structures, are likely missed because of taphonomic overprint. Surface area and volume measurements were obtained using VGStudio Max 2.2.
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