For thin-section analysis, after the ethanol dehydration steps, the cells were embedded in EMbed 812 epoxy resin and cut into thin sections (90 nm, using a diamond knife on a Reichert Ultracut S ultramicrotome). The sections were supported on copper grids and coated with carbon. TEM specimen holders were cleaned by plasma prior to TEM analysis to minimize contamination. Samples were examined with a high-resolution Philips CM 200 transmission electron microscope at an acceleration voltage of 200 kV under standard operating conditions with the liquid nitrogen anticontaminator in place.
Orius sc600a
The Orius SC600A is a high-performance charge-coupled device (CCD) camera designed for use in electron microscopy. It provides high-resolution imaging capability with a 2048 x 2048 pixel sensor and a 14-bit digitization depth. The camera is designed to work with a variety of electron microscopes, including scanning electron microscopes (SEMs) and transmission electron microscopes (TEMs).
2 protocols using orius sc600a
Transmission Electron Microscopy Analysis of Selenite-Amended Cells
For thin-section analysis, after the ethanol dehydration steps, the cells were embedded in EMbed 812 epoxy resin and cut into thin sections (90 nm, using a diamond knife on a Reichert Ultracut S ultramicrotome). The sections were supported on copper grids and coated with carbon. TEM specimen holders were cleaned by plasma prior to TEM analysis to minimize contamination. Samples were examined with a high-resolution Philips CM 200 transmission electron microscope at an acceleration voltage of 200 kV under standard operating conditions with the liquid nitrogen anticontaminator in place.
Anaerobic TEM Imaging of Reactive Samples
HR-TEM imaging, selected area electron diffraction and energy dispersive X-ray (EDX) spot analysis were acquired using a Field-Emission-Gun-Transmission-Electron microscope (FEI Tecnai TF20) fitted with a CCD Camera (Gatan Orius SC600A) and an EDX spectrometer (Oxford Instruments 80 mm2 X-max). The microscope was operated at 200 kV. To avoid beam damage, the exposure for image collection was limited to maximum 0.25 s. Images were analyzed using the ImageJ software37 (link). Atomic plane distances were calculated from the fast FFT analyses of several particles from the each acquired high-resolution image and from different areas in each image. The lattice planar distances were then calculated from the reciprocal values of the distance from the spots to the center (Supplementary Table
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