method employing an external weight in combination with thermal and
vacuum conditions was used to effectively seal the two-layer fluidic
chip. Prior to bonding, the two layers were cleaned using an ultrasonic
bath to remove debris and residues left over from the micromilling
and swarf build-up within the channels or through holes of the chip.
Thermal/vacuum bonding of the two-layer PMMA chips was performed under
optimized conditions (see
Information) using a vacuum oven (Gallenkamp vacuum oven) set at the
glass transition temperature of this particular PMMA (∼165
°C)27 and a vacuum of 200 mbar. A
220 g brass weight (A) was placed on top of two glass compression
plates (B) with the two aligned layers of the PMMA fluidic chip (C)
positioned between these plates (see
the adhesion of the two layers and optical windows occurs under these
conditions for a period of 20 min.