A shrinkage study was carried out to determine the percentage of shrinkage of this fabric and provide a treatment that allows a 0% shrinkage for the thermal treatment of curing the silver ink and soldering. In the first process, the fabric was subjected to washing with neutral soap using six resistant cotton programs at temperatures of 90, 60, 50, 40, 30 °C, and a cold wash, with a spin cycle at 1200 rpm in all programs. The washing machine used was the model WM12E467EE (Siemens Aktiengesellschaft, Munich, Germany). In the second process, the fabric was subjected to steam ironing at 215 °C using the G9222F0 model (Rowenta Irons, Millville, NJ, USA). The third process was to introduce it into an oven FED-115 (Binder GmbH, Tuttlingen, Germany) at 130 °C for 30 min, using the same curing cycle as conductive silver inks. Finally, it was subjected to an oven temperature of 200 °C for 3 min, higher than 191 °C which is the melting point temperature of the Sn-Pb eutectic, using the same temperature cycle as the one used in a typical solder paste.
Fed 115
The FED 115 is a laboratory equipment product. It is designed to perform a specific core function, but more detailed information is not available without the risk of providing an extrapolated or biased description.
Lab products found in correlation
11 protocols using fed 115
Optimizing Textile Shrinkage with Heat Treatment
A shrinkage study was carried out to determine the percentage of shrinkage of this fabric and provide a treatment that allows a 0% shrinkage for the thermal treatment of curing the silver ink and soldering. In the first process, the fabric was subjected to washing with neutral soap using six resistant cotton programs at temperatures of 90, 60, 50, 40, 30 °C, and a cold wash, with a spin cycle at 1200 rpm in all programs. The washing machine used was the model WM12E467EE (Siemens Aktiengesellschaft, Munich, Germany). In the second process, the fabric was subjected to steam ironing at 215 °C using the G9222F0 model (Rowenta Irons, Millville, NJ, USA). The third process was to introduce it into an oven FED-115 (Binder GmbH, Tuttlingen, Germany) at 130 °C for 30 min, using the same curing cycle as conductive silver inks. Finally, it was subjected to an oven temperature of 200 °C for 3 min, higher than 191 °C which is the melting point temperature of the Sn-Pb eutectic, using the same temperature cycle as the one used in a typical solder paste.
Potato Starch Modification with Octenyl Succinic Anhydride
Solubility Determination of Encapsulated Powder
where: S is the solubility percentage (%), m1 is the initial weight of the encapsulated powder, and m2 is the weight of the dry powder after dissolution.
Moisture Content Determination by Oven Drying
Moisture, Water Activity, and Bulk Density Determination
Gelatin-Based Green Tea Edible Films
Measuring Moisture Content and Film Solubility
For FS, samples (20–30 mg) were immersed in a centrifuge tube containing 30 mL distilled water for 24 h. The tubes were centrifuged for 15 min at 9000 rpm (centrifuge, Anke TGL-10 C). After this period, the samples were dried in an oven at 105 °C until a constant weight was achieved. The FS was calculated according to the following equation:
Yanapalta Potato Starch Extraction
Quinoa Grain Germination Process
The grains were placed in a humid chamber FOC 200 E (Velp ScientificaTM, Usmate Velate, Italy) at 25 °C and 95% relative humidity. After germination, the grains were collected at 24, 48, and 72 h, dried in a forced convection oven FED 115 (BINDER, Tuttlingen, Germany) at 40 °C to a moisture content below 10%, and finally ground at 150 rpm for 3 min in a cyclone mill Twister (Retsch, Haan, Alemania) and sieved into a 250 µm mesh, the germinated flour was stored in airtight glass containers for subsequent analysis.
Moisture Content Determination Protocol
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