Adhesives used are shown in Table 1 . A three-step etch-and-rinse adhesive, OptiBond FL (Kerr, Orange, CA, USA), a two-step E&R adhesive, Prime&Bond NT (Dentsply Sirona, Charlotte, NC, USA), a two-step self-etch adhesive, Clearfil SE Bond 2, a two-step universal adhesive, G2-BOND Universal (GC), and a one-step universal adhesive, Scotchbond Universal Plus (3M Oral Care, St. Paul, MN, USA) were used to bond a resin composite (Filtek Supreme Ultra, 3M Oral Care) to both enamel and dentin. In addition, phosphoric acid etchant (UltraEtch, Ultradent Products, South Jordan, UT, USA) was used. Adhesives, except for the universal adhesives, were applied in either etch-and-rinse or self-etch mode and universal adhesives were used in both modes based on the manufacturers’ instructions in this laboratory study.
Clearfil se bond 2
Manufactured by 3M
Sourced in United States
Clearfil SE Bond 2 is a self-etching, dual-cure dental adhesive system. It is designed to bond dental restorative materials to tooth structures.
Automatically generated - may contain errors
Lab products found in correlation
Ultra etch, by Ultradent (2 mentions)
Prime bond nt, by Dentsply (1 mentions)
Filtek supreme ultra, by 3M (1 mentions)
Scotchbond universal plus, by 3M (1 mentions)
Adhese universal, by Ivoclar Vivadent (1 mentions)
Scotchbond universal, by 3M (1 mentions)
Z100 restorative, by 3M (1 mentions)
Clearfil universal bond, by Kuraray (1 mentions)
2 protocols using clearfil se bond 2
1
Adhesive Performance on Enamel and Dentin
2
Adhesive Bonding Performance Evaluation
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Six adhesives were used in this study (Table 1): four universal adhesives [1) Adhese Universal (AU, Ivoclar Vivadent, Schaan, Liechtenstein), 2) Clearfil Universal Bond (CU, Kuraray Noritake Dental), 3) G-Premio Bond (GP, GC, Tokyo, Japan), and 4) Scotchbond Universal (SU, 3M ESPE, St. Paul, MN, USA)], and three two-step self-etch adhesives [1) Clearfil SE Bond (CS), 2) Clearfil SE Bond 2 (CS2), and 3) OptiBond XTR (OX)]. Ultra-Etch (Ultradent Products, South Jordan, UT, USA) was used as a 35% phosphoric acid etching agent, and Z100 Restorative (3M ESPE) was used as the resin composite for the bonding procedures.
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