Vk x1050

The thickness profiles of a polygonal QD microarray film were measured by using a laser scanning confocal microscope (VK‐X1050, Keyence, Japan) which can provide a maximum 5 nm height‐resolution with a high magnification in Figure 1g. Through image stitching technique, a scanning area (600 × 600 mm²) was set and its height profiles were measured with a 10× magnification.

For the evaluation of mechanical stability, a nanoindentation test was conducted using iMicro equipment (KLA). To perform the nano-indentation test, first, epoxy siloxane polymer was spin-coated onto a Si wafer to a thickness of 50 μm. For comparison, 50-μm-thick SU-8 (SU-8 2000, MicroChem) coated on a Si wafer was used. The maximum testing load was 50 mN, and the test was conducted more than 16 times for each sample to ensure accuracy. Representative data from each sample are displayed in the fig. S3. After the test, the surfaces of the epoxy siloxane polymer, SU-8, and the Si wafer itself were specifically inspected using a 3D optical-confocal microscope (VK-X1050, Keyence) and an SEM (SU-5000, Hitachi) to estimate the depth profile.

Five solid specimens for each group were printed to measure the surface roughness parameters using a 3D laser scanning microscope (VK-X-1050, magnification 50×, Keyence, Osaka, Japan). Three sites of 200 μm × 200 μm per scaffold were obtained, and after surface shape correction and height cuts, a 0.8 μm Gaussian S-filter was applied. The arithmetical mean height (Sa) and the maximum height of surface (Sz) were extracted using the multi-file analyser software (Version 2.1.3.89). The pore size of porous scaffolds (n = 3) was determined by considering 30 pores for each scaffold using a 3D laser scanning microscope [9 (link)]. The porosity of the scaffolds was obtained following the equation: porosity (%) = 1-scaffold density/arithmetic mean density. The scaffold density was defined as the weight of the scaffold divided by the volume of the scaffold. The mean densities of PCL and HA were 1.146 g/cm³ and 3.16 g/cm³, respectively [36 (link)].

Continuous pressure was applied under different temperature conditions using a universal testing machine (Instron 5969, Instron, USA) for full loading-unloading cycles of the SEBS film. To measure the T_g temperature of SEBS, a DSC (Q90, TA Instruments Inc., USA) was used. The tensile strain was applied in a customized linear stage. The electrical characteristics of the EGaIn-CP electrode was examined using a source meter (Keithley 2400, Tektronix, USA) with Kelvin (four-wire) resistance measurement. The morphology of the EGaIn-CP electrode channel was captured using a confocal laser microscope (VK-X1050, Keyence, Japan).

Specimens were subjected to fracture load testing directly after chewing simulation and inspection. Using a universal testing machine (Z020, Zwick/Roell, Ulm, Germany), load was applied for all specimens on the occlusal surface of the cantilever in an axial direction (Figure 2c) with a crosshead speed of 1 mm/s until fracture occurred.
Fractured specimens were examined using a 3D scanning laser microscope (VK-X1050, Keyence, Osaka, Japan) and a light microscope (Wild M7A, Leica Heerbrugg, Switzerland). Fractures were classified as Type 1: failure within the ICFDP, or Type 2: failure of the implant. The fracture origin was analyzed with scanning electron microscopy (SEM; ESEM XL-30, Philips, Eindhoven, The Netherlands) at 15 kV for selected fractures using secondary electron (SE) and backscattered electron (BSE) modes.