Oudrasperse wb 3001

Example 2

A pine wafer (southern yellow pine, 4 cm×2 cm×0.5 cm) is held at the bottom of a Parr reactor by a weight (here a ring is used). The reactor pressure is set to vacuum for 30 minutes. An aqueous polymer dispersion is prepared comprising 20 percent by weight PRIMACOR™ 5980 (60% DoN with MEA, 8.4 pH, particle size of 74 nm) and 80 percent by weight water. An epoxy dispersion (OUDRASperse™ WB 3001 manufactured by The Dow Chemical Company) is prepared comprising 60 percent by weight dispersion solid and 40 percent by weight water. 80 ml of a dispersion comprising 67 percent by weight aqueous polymer dispersion and 33 percent by weight epoxy dispersion is introduced to the reactor. The reactor pressure is then set to 1.03 MPa for 60 minutes under nitrogen. The wafer is then placed in an oven and air dried at 60° C. for 48 hours, thereby providing a treated wafer. The treated wafer and the control wafer are each processed according to the E4-11 procedure. The percent swelling for the treated wafer is 1.1%; the WRE of the treated wafer is 76%. The hardness of the treated wafer is measured as 62.5 using a Type D Durometer.

Example 1

A pine wafer (southern yellow pine, 4 cm×2 cm×0.5 cm) is held at the bottom of a Parr reactor by a weight (here a ring is used). The reactor pressure is set to vacuum for 30 minutes. An aqueous polymer dispersion is prepared comprising 20 percent by weight PRIMACOR™ 5980 (60% DoN with MEA, 8.4 pH, particle size of 74 nm) and 80 percent by weight water. An epoxy dispersion (OUDRASperse™ WB 3001 manufactured by The Dow Chemical Company) is prepared comprising 60 percent by weight dispersion solid and 40 percent by weight water. 80 ml of a dispersion comprising 50 percent by weight aqueous polymer dispersion and 50 percent by weight epoxy dispersion is introduced to the reactor. The reactor pressure is then set to 1.03 MPa for 60 minutes under nitrogen. The wafer is then placed in an oven and air dried at 60° C. for 2 weeks, thereby providing a treated wafer. The treated wafer and the control wafer are each processed according to the E4-11 procedure. The percent swelling for the treated wafer is 1.6%; the WRE of the treated wafer is 65%. The hardness of the treated wafer is measured as 56 using a Type D Durometer.

Example 1

A pine wafer (southern yellow pine, 4 cm×2 cm×0.5 cm) is held at the bottom of a Parr reactor by a weight (here a ring is used). The reactor pressure is set to vacuum for 30 minutes. An aqueous polymer dispersion is prepared comprising 20 percent by weight PRIMACOR™ 5980 (60% DoN with MEA, 8.4 pH, particle size of 74 nm) and 80 percent by weight water. An epoxy dispersion (OUDRASperse™ WB 3001 manufactured by The Dow Chemical Company) is prepared comprising 60 percent by weight dispersion solid and 40 percent by weight water. 80 ml of a dispersion comprising 50 percent by weight aqueous polymer dispersion and 50 percent by weight epoxy dispersion is introduced to the reactor. The reactor pressure is then set to 1.03 MPa for 60 minutes under nitrogen. The wafer is then placed in an oven and air dried at 60° C. for 2 weeks, thereby providing a treated wafer. The treated wafer and the control wafer are each processed according to the E4-11 procedure. The percent swelling for the treated wafer is 1.6%; the WRE of the treated wafer is 65%. The hardness of the treated wafer is measured as 56 using a Type D Durometer.

Example 2

A pine wafer (southern yellow pine, 4 cm×2 cm×0.5 cm) is held at the bottom of a Parr reactor by a weight (here a ring is used). The reactor pressure is set to vacuum for 30 minutes. 80 ml of a dispersion comprising 30 percent by weight (solid concentration) OudraSperse™ WB 3001 waterborne epoxy dispersion (available from The Dow Chemical Company) and 70 percent by weight water is introduced to the reactor. The reactor pressure is then set to 1.03 MPa for 60 minutes under nitrogen. The wafer is then placed in an oven and dried in air at 80° C. for 1 week. The treated wafer and a control wafer are each processed according to the E4-11 procedure. The percent swelling for the treated wafer is 1.47%; the WRE of the treated wafer is 68.7%. The hardness of the treated wafer is measured as 45 using a Type D Durometer.