The surface morphology of PBS composites was analysed using a high-resolution field emission Zeiss Ultra Plus-SEM (Carl Zeiss), which operates with an accelerating voltage of 5 kV. The samples were pasted onto the SEM stubs using carbon tape and sputtered with gold/palladium (80/20 ratio) for 15 s. EDX analysis, which is an integral characteristic of the Zeiss Ultra Plus-SEM, was used to identify the elemental composition of the sample. Point scans were performed at different areas at a working distance of 10 mm with the Energy selective Backscattered (EsB)detector.
Ultra plus sem
Manufactured by Zeiss
Sourced in Germany
The Ultra Plus SEM is a scanning electron microscope designed and manufactured by ZEISS. It provides high-resolution imaging and analytical capabilities for a wide range of applications. The Ultra Plus SEM utilizes advanced electron optics and detection systems to produce detailed images of samples at the nanoscale level.
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Lab products found in correlation
Autosamdri 815, by Tousimis (6 mentions)
Supra 55 vp sem, by Zeiss (5 mentions)
4 6 diamidino 2 phenylindole (dapi), by Thermo Fisher Scientific (2 mentions)
Dsa100, by Krüss (1 mentions)
Glutaraldehyde, by Merck Group (1 mentions)
Hyperprobe jxa 8500f, by JEOL (1 mentions)
Dimension 3100, by Budget Sensors (1 mentions)
40 n m probes, by Budget Sensors (1 mentions)
Titan transmission electron microscope, by Thermo Fisher Scientific (1 mentions)
Alpha 300r, by WITec (1 mentions)
Fe sem supra 35 vp electron microscope, by Zeiss (1 mentions)
Asap 2020, by Micromeritics (1 mentions)
Fv3000 confocal microscope, by Olympus (1 mentions)
5d mark 2, by Canon (1 mentions)
Merlin sem, by Zeiss (1 mentions)
Hcp 2 critical point drier, by Hitachi (1 mentions)
Leo 1530 sem, by Zeiss (1 mentions)
Ifs 66v s spectrometer, by Bruker (1 mentions)
S 4800 sem, by Hitachi (1 mentions)
Bl rc150vb, by Olympus (1 mentions)
29 protocols using ultra plus sem
1
Scanning Electron Microscopy of PBS Composites
2
Characterization of Functionalized Silicon Substrates
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Contact Angle: Static contact angles of NANOpure® water were measured on SAM/PDMS-OH functionalized silicon substrates at ambient temperature using a CAM101 goniometer system (KSV Instruments Ltd.). Contact angles were again measured on the opposite edges of at least three drops and averaged. Scanning Electron Microscope (SEM): SEM images were obtained by a high resolution (< 1 nm)
Field Emission Zeiss Ultra Plus-SEM with a Gemini ® column operating at an accelerating voltage of 5 kV. The SEM images were processed using ImageJ software. For FIB preparation of lamellae, an FEI Strata 235-Focused Ion Beam (FIB) tool was used. E-beam platinum was deposited at the substrate followed by the ion-beam deposited platinum. Milling and polishing of the samples were carried out at the lower aperture size and the specimen was imaged under the higher resolution Zeiss Ultra Plus-SEM.
Field Emission Zeiss Ultra Plus-SEM with a Gemini ® column operating at an accelerating voltage of 5 kV. The SEM images were processed using ImageJ software. For FIB preparation of lamellae, an FEI Strata 235-Focused Ion Beam (FIB) tool was used. E-beam platinum was deposited at the substrate followed by the ion-beam deposited platinum. Milling and polishing of the samples were carried out at the lower aperture size and the specimen was imaged under the higher resolution Zeiss Ultra Plus-SEM.
3
Surface Characterization of Thin Films
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Contact angles and surface free energy measurements were carried out using a Krüss DSA 100 (Krüss Optronic, Hamburg, Germany) goniometer. Contact angles were measured by the static sessile drop method and surface free energy was calculated from the measured contact angles of deionized water (DI), diiodomethane (DIM), and ethylene glycol (EG) using the Owens–Wendt model [44 (link)]. Film thickness (an average of five readings from different sample areas) was determined by ellipsometry (Plasmos SD2000 Ellipsometer, Filmetrics, Surrey, UK) at an incidence angle of 70°. A Varian IR660 (Agilent Technologies, Cheshire, UK) infrared spectrometer was used to record FTIR data. The measurements were performed in the spectral range of 4000–500 cm−1, with a resolution of 4 cm−1 and data averaged over 32 scans. Surface morphology and silicon nanostructures were investigated by scanning electron microscope (SEM) images, and were obtained by a high resolution (<1 nm) Field Emission Zeiss Ultra Plus-SEM (Carl Zeiss AG, Oberkochen, Germany) with a Gemini® column operating at an accelerating voltage of 5 kV. The profile images of the surfaces were also used to measure the film thicknesses which agreed well with ellipsometer data.
4
Scaffold Pore Visualization by SEM
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Scaffold pore architecture was visualized using Scanning Electron Microscopy (SEM). Scaffolds were harvested at days 1, 3, 5 and 7 days post infection were stored in 3% glutaraldehyde (Sigma-Aldrich, Wicklow, Ireland) at 4°C. Samples were processed using critical point drying (CPD). CPD is a process used to dehydrate biological samples without affecting the structure of the sample due to the lack of surface tension prior to SEM. After CPD, the samples were mounted in carbon cement for increased electrical conductivity and coated in Gold Palladium. The samples were imaged using Zeiss Ultra Plus SEM at 5KV with a SE2 detector (Zeiss, Oberkochen, Germany).
5
Adsorption Process Sample Analysis
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The surface of samples before and after adsorption processes were analyzed with the combination of Zeiss Ultra Plus SEM (Carl Zeiss NTS, Jena, Germany) and XFlash Quad 5060F EDX (Bruker Nano GmbH, Berlin, Germany).
6
Microscopy Analysis of Spinels
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Transmitted and reflected light microscopy on thin sections was performed on Leitz polarisation microscopes at German Research Centre for Geoscience (GFZ, Potsdam) and Karlsruhe Institute of Technology (KIT). Scanning electron microscopy (SEM), back-scatter electron (BSE) imaging with acceleration voltage of 20 kV (ZEISS Ultra Plus SEM), and initial mineral characterization by energydispersive X-ray (EDX) analysis and electron microprobe analysis (JEOL Hyperprobe JXA-8500F with 15 kV) were done at GFZ. For the latter, well-characterized natural and synthetic standards were used for calibration: chromia (Cr), diopside (Si, Mg), ferric oxide (Fe), gahnite (Al), ilmenite (Ti), nickel monoxide (Ni), rhodonite (Mn), and tugtupite (Na). Further investigations at KIT included BSE imaging (FEI Quanta FEG with 10 kV). Spinel formulae were calculated from cation and Fe 2 O 3 content assuming stoichiometric composition in relation to anions (cation/anion = 3/4).
7
Multi-Technique Analysis of Nanomaterial Characterization
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Raman spectroscopy and PL measurements were performed using a Witec alpha 300R with a 532 nm excitation laser and a laser power of <1 mW, in order to minimize sample damage. AFM measurements were carried out using a Veeco Dimension 3100 in tapping mode, with 40 N/m probes from Budget Sensors. SEM images were acquired using a Zeiss Ultra Plus SEM at an accelerating voltage of 1 kV. XPS was performed under ultra-high vacuum conditions (<5 × 10−10 mbar), using monochromated Al Kα X-rays (1486.6 eV) from an Omicron XM1000 MkII X-ray source and an Omicron EA125 energy analyzer. An Omicron CN10 electron flood gun was used for charge compensation and the binding energy scale was referenced to the adventitious carbon 1s core-level at 284.8 eV. The analyzer pass energy was set to 100 eV for the survey spectrum, and 15 eV for the Mo 3d and S 2p core-level spectrum. HRTEM analysis was performed in an FEI Titan transmission electron microscope at an acceleration voltage of 300 kV.
8
Microstructure and Elemental Analysis of N-rGO, N-rGONRs, and N-pEAO
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Microstructure characterization of N-rGO and N-rGONRs and N-pEAO was performed by a scanning field emission electron microscope, Zeiss ULTRA plus SEM – Jena, Germany. Samples were adhered to the conductive carbon tape placed on an aluminum SEM holder. SEM images were taken at 2 kV using an SE2 detector at WD 5.5 mm. Further, elemental analysis of the samples was done inside SEM using EDS analysis with an Oxford X-Max SDD detector - High – Wycombe, UK, with working surface area of 50 mm2, processed with INCA software - Wycombe. EDS analysis was done at 20 kV.
For visualization of membranes’ microstructure, the field emission (FE)-SEM analysis was performed using a Carl Zeiss FE-SEM SUPRA 35 VP electron microscope. Imaging was performed at 1 kV accelerating voltage at an approximately 4.5 mm working distance. The membranes were attached to aluminum sample holders via conductive carbon adhesive tape. Prior to analysis, a layer of palladium was sputtered on the surface of membrane samples.
For visualization of membranes’ microstructure, the field emission (FE)-SEM analysis was performed using a Carl Zeiss FE-SEM SUPRA 35 VP electron microscope. Imaging was performed at 1 kV accelerating voltage at an approximately 4.5 mm working distance. The membranes were attached to aluminum sample holders via conductive carbon adhesive tape. Prior to analysis, a layer of palladium was sputtered on the surface of membrane samples.
9
Comprehensive VOCs Analysis Using GC-FID
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The equipment referred in this research for the analysis of all target VOCs consisted of a gas chromatography-flame ionization detector (GC-FID) system (Agilent 7890A, USA). The target VOCs were separated on a HP-5 column (0.32 mm × 30 m × 0.25 μm). A high-voltage power supply (Dongwen high voltage power supply Co., Ltd., Tianjin, China) and syringe pump (Zhejiang Smith medical instrument Co., Ltd) were used for electrospinning. The nanofibers were examined using a field emission scanning electron microscope (Ultra plus SEM, Zeiss, Germany) and a specific surface and porosity analyzer (Micromeritics ASAP2020, USA). A headspace sampler (Zhongdingshichuang technology Co., Ltd, Beijing, China) was used for thermal desorption.
10
Multifunctional Microneedle Patch Fabrication
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HAMA hydrogel (0.1 g mL−1), HMPP (1%, v/v), and PDA NPs (80 µg) were mixed in aqueous solution to make the outer layer of the tips. After drying overnight and solidifying the tips through UV irradiation for 60 s, HA (0.3 g mL−1) and Fe‐MSC‐NVs (50 µg) were entirely filled into the quadrangular pyramid microcavities of the mold to prepare the tip solution and dried for 12 h. The backing layer solution (0.3 g mL−1 HA hydrogel) was then filled and dried for 12 h. The resultant MN patch was obtained by demolding. The optical images of MN array were obtained through a Canon 5D Mark II digital camera. SEM photos were taken by a Zeiss Ultra Plus SEM. The CLSM images were taken by an Olympus FV3000 confocal microscope using fluorescent dyes as a demonstration, with red‐microspheres (≈50 nm) in the outer HAMA layer and DiO‐labeled Fe‐MSC‐NVs loaded in the inner HA layer.
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