WT-MSCs and MD-MSCs were detached with trypsin-EDTA and digested in a mixture of 2 ml 65 % HNO3 (J.T. Baker®, PA, USA), and 7 ml deionized water. Prepared samples were further digested in the Microwave Digestion System (Milestone Inc., CT, USA) for 4 h at 150 °C. Then, copper concentration was analyzed by inductively coupled plasma (ICP) mass spectrometry (Agilent Technologies, CA, USA).
Icp mass spectrometry
Manufactured by Agilent Technologies
Sourced in United States, Germany
ICP-MS (Inductively Coupled Plasma Mass Spectrometry) is an analytical technique used for the detection and quantification of trace elements in various types of samples. It combines an inductively coupled plasma (ICP) as the ion source with a mass spectrometer (MS) for the separation and detection of the ionized elements. ICP-MS provides high sensitivity, accuracy, and multi-element analysis capabilities, making it a widely used tool in fields such as environmental monitoring, material science, and life sciences.
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Lab products found in correlation
2 protocols using icp mass spectrometry
1
Copper Quantification in Mesenchymal Stem Cells
2
Comprehensive Characterization of NCM622 Cathode Materials
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The morphology, microstructure, and
chemical composition of NCM622 cathode materials were characterized
by field emission SEM (Zeiss Merlin, Germany) with EDX, TEM (FEI,
Titan300 KV) equipped with high-angle annular dark-field scanning
TEM , and ICP–mass spectrometry (Agilent), respectively. Powder
XRD data were collected over the 2θ range 10°–80°
on a Bruker D8 ADVANCE diffractometer with Cu Kα radiation (λ
= 1.5406 Å, 40 kV/40 mA). The refinement of the XRD data was
performed using the Fullprof software. XPS analyses were carried out
on a Kratos Supra spectrometer using an Al Kα monochromatic
irradiation (1486.6 eV) at a working pressure smaller than 7 ×
10–8 bar. Depth profiling was carried out using
Ar ion beam sputtering with 500 eV. The sputtering rate was equivalent
to 0.26 nm/s on Ta2O5.
chemical composition of NCM622 cathode materials were characterized
by field emission SEM (Zeiss Merlin, Germany) with EDX, TEM (FEI,
Titan300 KV) equipped with high-angle annular dark-field scanning
TEM , and ICP–mass spectrometry (Agilent), respectively. Powder
XRD data were collected over the 2θ range 10°–80°
on a Bruker D8 ADVANCE diffractometer with Cu Kα radiation (λ
= 1.5406 Å, 40 kV/40 mA). The refinement of the XRD data was
performed using the Fullprof software. XPS analyses were carried out
on a Kratos Supra spectrometer using an Al Kα monochromatic
irradiation (1486.6 eV) at a working pressure smaller than 7 ×
10–8 bar. Depth profiling was carried out using
Ar ion beam sputtering with 500 eV. The sputtering rate was equivalent
to 0.26 nm/s on Ta2O5.
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