Thin sections, of approximately 80 nm thickness, were cut from each sample using a Leica UC7 ultramicrotome, collected on copper mesh grids and counter stained Reynolds’ lead citrate. Sections were observed using a JEOL JEM-1400 transmission electron microscope, using an accelerating voltage of 100 kV. Digital Images were recorded using a SIS Megaview III Digital Camera (Olympus Soft Imaging Solutions, Germany) with iTEM Software V 5.1 (Olympus, Germany).
Sis megaview 3 digital camera
The SIS Megaview III Digital Camera is a high-resolution microscope camera designed for advanced imaging applications. It features a large-format CMOS sensor with a resolution of up to 16 megapixels, allowing for detailed capture of microscopic samples. The camera supports a range of image formats and can be integrated with various microscope systems.
2 protocols using sis megaview 3 digital camera
Ultrastructural Imaging of Cells and Tissues
Ultrastructural Analysis of Bacterial Cell Wall
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