Silicon wafer
Silicon wafers are thin, circular slices of high-purity silicon used as the foundation for semiconductor devices and integrated circuits. They serve as the substrate for the fabrication of electronic components, enabling the creation of microchips, transistors, and other electronic components.
Lab products found in correlation
33 protocols using silicon wafer
Synthesis and Characterization of Tartrate Derivatives
Ultrastructural Characterization of Intracellular and Isolated Inclusion Bodies
Ultrastructural morphometry (size and shape) of nanoparticles was performed and characterized at nearly native state with field emission scanning electron microscopy (FESEM). Drops of 20 µL of IBs sample were directly deposited on silicon wafers (Ted Pella Inc.) for 30 s and immediately observed without coating with a FESEM Merlin (Zeiss) operating at 1 kV and equipped with a high-resolution secondary electron detector.
Characterizing Protein Aggregates by SEM and DLS
Dynamic light scattering (DLS) was used for a quantitative determination of ZapB-GFP and Aβ42-GFP IBs size. The size of these nanoparticles was determined using a Zetasizer Nano ZS (Malvern Instruments Limited, UK) at 25 °C. Three different measures of ten runs were recorded for each sample.
Particle Lithography for Nanoholes in OTS
Visualizing Mycobacteria Emulsion Characteristics
To observe the ultrastructure of the emulsified mycobacteria in a near-native stage, a Field Emission Scanning Electron Microscope (FESEM) was used. Emulsified and non-emulsified M. brumae were fixed with 1:1 osmium tetraoxide (4%, TAAB Lab., West Berkshire, UK) at 4 °C for 30 minutes. Then, 5 μL samples were deposited in silicon wafers (Ted Pella, Redding, CA, US) over a period of 1 minute, and excess sample was blotted with Whatman paper, air dried and observed without coating using a FESEM Zeiss Merlin (Oberkochen, Germany) that was equipped with a high-resolution in-lens secondary electron detector and operated at 0.8 kV.
Cation-induced Microparticle Visualization
Synthesis and Characterization of Colloidal Nanoparticles
Ultrastructural Characterization of Protein Nanoparticles
Nanoscale Morphological Analysis of Protein Nanoconjugates
Ultrastructural Protein Morphometry
proteins at the nearly native state was assessed with two high-resolution
techniques. Sample drops (5 μL) were deposited on silicon wafers
(Ted Pella Inc.) for 2 min, air-dried, and immediately observed without
coating with a Merlin field emission scanning electron microscope
(FESEM) (Zeiss), operating at 1 kV and equipped with a high-resolution
in-lens secondary electron detector. Representative images of general
fields and nanostructure details were captured at two high magnifications
(150000× and 400000×). Drops (5 μL) of the same samples
were deposited for 2 min on 200 mesh copper grids coated with carbon,
contrasted with 2% uranyl acetate for 2 min, air-dried, and observed
with an H-7000 transmission electron microscope (TEM) (Hitachi) equipped
with a CCD Gatan ES500W Erlangshen camera (Gatan). Representative
images of general fields and nanostructure details were captured at
two high magnifications (70000× and 200000×).
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