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S 3400n scanning microscope

Manufactured by Hitachi
Sourced in Japan

The S-3400N is a scanning electron microscope (SEM) produced by Hitachi. It is designed to provide high-resolution imaging and analysis of a wide range of materials and samples. The S-3400N utilizes an electron beam to scan the surface of a sample, generating detailed images that reveal the microstructure and surface features of the specimen.

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Lab products found in correlation

3 protocols using s 3400n scanning microscope

1

Cassava Starch Granule Morphology

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Morphological observation under light microscopy of SC205, SC8 and W14 was conducted as previously described in An et al. (2014) [6 (link)]. Structural changes of cassava starch granules, extracted from storage roots between SC205, SC8 and W14, were observed under scanning electron microscopy (SEM). The samples (dried starch powder) were mounted on SEM stubs with double-sided adhesive tape and coated with gold. Scanning electron micrographs were taken using an S-3400N scanning microscope (Hitachi) in Jiangsu University, China [20 ].
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2

Vascular Patch Surface Coating

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Specimens of vascular patches with a size of 0.25 сm2 were sprayed with Ag-Pd using an EM ACE200 system (Leica Microsystems GmbH, Austria) to obtain 15-nm thick coating. Structural features of the matrix surface were studied using an S-3400N scanning microscope (Hitachi, Japan) under high vacuum conditions at an accelerating voltage of 10 kV.
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3

Quantitative Microstructural Analysis of Porous Samples

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The X-ray testing usedX5000 industrial CT X-ray inspection system (North Star Imaging, Rogers, MN, USA). From the highest porosity areas shown in the simulation, samples were cut for microstructure studies. Metallographic specimens used a typical procedure. The research used an Olympus GX71 optical microscope (Olympus, Tokyo, Japan) and a Hitachi S3400N scanning microscope (Tokyo, Japan). Meanwhile, the quantitative porosity analysis used the image analysis software AnalySIS Pro (AnalySIS Pro® ver. 5.0 Olympus, Tokyo, Japan) (Figure 3).
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