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7 protocols using propylene glycol methyl ether acetate

1

Fabrication of PDMS Microfluidic Devices

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A two-step photolithographic process was used to fabricate the master used for casting PDMS devices. A 500-nm-thick negative photoresist (SU-8 2000.5, MicroChem) was spin-coated onto a silicon wafer. This, in turn, was soft-baked for 2 min at 95°C. The chrome mask in Fig. 1B was then placed onto the wafer, exposed under ultraviolet (UV) light to induce polymerization, and then post-baked at 95°C for 3 min. A second 25-μm-thick layer (SU-8 3025, MicroChem) was then spin-coated onto the wafer and soft-baked for 5 min 95°C. The second mask (shown in Fig. 1C) was aligned with respect to the patterns formed from the first mask. This was, in turn, exposed to UV light and post-baked for 15 min at 95°C. Last, to remove uncross-linked photoresist, the master was developed in propylene glycol methyl ether acetate (Sigma-Aldrich).
A 10:1 ratio of elastomer PDMS to curing agent (SYLGARD 184, Dow Corning, Midland, MI) was used to fabricate microfluidic devices. The mixture was cured for 3 hours at 65°C. The hardened PDMS was cut and peeled off the master, while holes of 0.75 mm were punched on the PDMS. This was then bonded onto a glass slide by treating with a plasma bonder (Diener Electronic, Ebhausen, Germany).
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2

Characterization of Colorful Electrochromic Materials

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Basic blue 7, basic blue 26, ethyl violet, lithium bis(trifluoromethanesulfonyl)imide, and lithium bis(oxalato)borate were purchased from TCI. Propylene glycol methyl ether acetate was purchased from Sigma-Aldrich. Methylene chloride, chloroform, and other chemical solvents were purchased from Samchun Pure Chemical. All chemicals were used without any additional purification. Transparent glass substrates were provided by Paul Marienfeld GmbH & Co.KG and acrylic binder was supplied by Alphachem Corporation.
Absorption and transmittance spectra were measured using a Perkin Elmer Lambda 25 UV/Vis spectrophotometer. Chromatic characteristics of the color films were analyzed on a Scinco color spectrophotometer. X-ray diffraction patterns were measured using Bruker New D8 Advance X-Ray Diffractometer. 1H and 13C Nuclear Magnetic Resonance (NMR) spectra were recorded on a Bruker Avance 500 spectrometer running at 500 MHz using chloroform-d as a solvent with TMS as an internal standard. Mass spectra were obtained using an LCQ Fleet mass spectrometer with high resolution.
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3

Two-Step Photolithographic Fabrication of Microfluidic Devices

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A two-step photolithographic process was used to fabricate the master used for casting microfluidic spray devices. Briefly, a 25-μm-thick structure was fabricated (3025, MicroChem) was spin-coated onto a silicon wafer. This was then soft-baked for 15 min at 95°C. An appropriate mask was placed onto the wafer, exposed under ultraviolet light to induce polymerization and then post-baked at 95°C. A second 50-μm-thick layer (SU-8 3050, MicroChem) was then spin-coated onto the wafer and soft-baked for 15 min at 95°C. A second mask was then aligned with respect to the structures formed from the first mask, and the same procedure was followed, i.e., exposure to ultraviolet light and post-baking for 15 min at 95°C. Last, the master was developed in propylene glycol methyl ether acetate (Sigma-Aldrich) to remove any photoresist that had not cross-linked.
A 1:10 ratio of polydimethylsiloxane (PDMS) curing agent to elastomer (SYLGARD 184, Dow Corning, Midland, MI) was used to fabricate microfluidic devices. The mixture was cured for 3 hours at 65°C. The hardened PDMS was cut and peeled off the master. The two complementary PDMS chips are then activated with O2 plasma (Diener Electronic, Ebhausen, Germany) and put in contact with each other and aligned precisely such that the gas inlet intersects with the liquid inlet to form a 3D nozzle (12 ).
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4

Sensor Fabrication and Storage Protocol

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Bromphenol blue, bromocresol green, thymol blue, methyl red, nitrazine yellow, methyltriethoxysilane, triethoxy(octyl)silane, 2-methoxyethanol, propylene glycol methyl ether acetate, polyethylene glycol tert-octylphenyl ether, pararosaniline base, N,N-dimethyl-4,4’-azodianiline, p-toluenesulfonic acid and sulfuric acid were purchased from Sigma-Aldrich (Arklow, Co. Wicklow, Ireland). Analytical standards were also purchased from Sigma-Aldrich, Ireland. Substrates (Polygram® CEL 300) were obtained from Machery-Nagel GmbH (Düren, Germany). Water used was high purity Milli-Q water (Millipore >18 MΩcm). A vacuum sealer (iLmyh, model number ZS-11W2) and vacuum sealer bags (Culivac, B16025S) were used for sensor storage and shipment.
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5

Microfluidic Device Fabrication with Photolithography

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All microfluidic
devices used were designed with AutoCAD software and fabricated by
combining standard photolithography and soft lithography steps. Specifically,
a 25 μm layer of a negative photoresist (SU-8 3025, MicroChem,
Westborough, MA) was applied by spin coating and then soft baked for
15 min at 95 °C. A photomask was placed onto the wafer and then
exposed to a UV lamp source for 60 s. After postbaking for 5 min,
the unexposed photoresist was removed using propylene glycol methyl
ether acetate (Sigma-Aldrich).
Specifically, a master
mold was made by spin coating a 25 μm
layer of a negative photoresist (SU-8 302, MicroChem, Westborough,
MA) and soft baking for 15 min at 95 °C. First, a mixture of
10:1 prepolymer PDMS to a curing agent (Sylgard 184, DowCorning, Midland,
MI) was poured onto the master. Bubbles were removed under vacuum,
and PDMS was cured at 65 °C for at least 1 h. The devices were
cut out, and inlet and outlet holes were punched. After treatment
in a plasma oven for 30 s at 40 W (Diener Electronic), the device
was bonded to a glass slide, which forms the bottom of the channels.
Finally, the devices were coated with a polystyrene solution (Aquapel)
to create hydrophobic surfaces.
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6

SU-8 Microfabrication for Silicon Wafer Structures

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Microstructures on silicon wafers were fabricated using standard SU-8 microfabrication [28 (link)]. Briefly, SU-8 2075 (Kayaku Advanced Materials, Inc., Berlin, Germany) was spin coated onto a 150 mm silicon wafer (Siegert Wafer, Aachen, Germany) at 1750 rpm final speed for 34 s and soft baked for 5 min at 65 °C, subsequently heated up to 95 °C, and baked for 15 min. Microstructures were designed using CorelCAD software, and the required photomask was purchased from an external provider (KOPP-desktopmedia, Nufringen, Germany). The SU-8 layer was patterned by exposing the sample through the photomask to ultraviolet (UV) light (ABM Series 60 Exposure Systems; ABM, Inc., New York City, NY, USA), at 21 mW/cm² for 5 s. The post exposure bake was performed at 65 °C for 5 min followed by a similar temperature ramp as the pre-exposure bake and then baked for an additional 9 min at 95 °C. The structures were developed in propylene glycol methyl ether acetate (Sigma-Aldrich, St. Louis, MI, USA) for 12 min and hard baked at 150 °C for 30 min.
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7

Fabrication of Microfluidic Spray Devices

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A two-step photolithographic process was used to fabricate the master used for casting microfluidic spray devices. In brief, a 25 μm thick structure was fabricated (3025, MicroChem) was spin-coated onto a silicon wafer. This, was then soft-baked for 15 min at 95 °C. An appropriate mask was placed onto the wafer, exposed under ultraviolet light to induce polymerization, and then post-baked at 95 °C. A second 50 μm thick layer (SU-8 3050, MicroChem) was then spin-coated onto the wafer and soft-baked for 15 min at 95 °C. A second mask was then aligned with respect to the structures formed from the first mask, and the same procedure was followed, i.e., exposure to UV light and post-baking for 15 min at 95 °C. Finally, the master was developed in propylene glycol methyl ether acetate (Sigma-Aldrich) to remove any photoresist which had not cross-linked.
A 1:10 ratio of PDMS curing agent to elastomer (SYLGARD 184, Dow Corning, Midland, MI) was used to fabricate microfluidic devices. The mixture was cured for 3 h at 65 °C. The hardened PDMS was cut and peeled off the master. The two complementary PDMS chips are then activated with O2 plasma (Diener Electronic, Ebhausen, Germany) and put in contact with each other and aligned precisely such that the gas inlet intersects with the liquid inlet to form a 3D nozzle13 .
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