The surface morphology of ATO-ZnO MP and ZnO NW-loaded ATO-ZnO MP was investigated using field-emission scanning electron microscopy (FE-SEM, Hitachi, S-4300). Field emission transmission electron microscopy (FE-TEM, JEOL, JEM-2100F) with energy dispersive X-ray (EDX) spectroscopy was used to analyze the crystallinity and atomic distribution of hierarchical ZnO NW-loaded ATO-ZnO MP. The TEM sample of the ZnO NW-loaded ATO-ZnO MP was prepared using a dual-beam focused ion beam (FIB, FEI Nova 600) method. The crystal structures of the ATO-ZnO MP and hierarchical ZnO NW-loaded ATO-ZnO MP were analyzed with X-ray diffraction (XRD, Rigaku D/MAX-2500V/PC) based on Cu Kα radiation (λ = 1.54 Å). The bonding state and chemical composition of the main elements were investigated using X-ray photoelectron spectroscopy (XPS, Sigma Probe, Thermo VG Scientific) with Al Kα radiation.
Nova 600
Manufactured by Thermo Fisher Scientific
Sourced in Germany, Netherlands
The Nova 600 is a compact and versatile laboratory instrument designed for precise measurement and analysis. It is capable of performing a variety of analytical tasks, including the determination of physical and chemical properties of samples. The Nova 600 utilizes advanced technology to provide accurate and reliable results, making it a valuable tool for researchers and scientists.
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Lab products found in correlation
Orius 833 ccd camera, by Ametek (2 mentions)
Jem 2100f, by Ametek (2 mentions)
S 4300, by Hitachi (1 mentions)
Jem 2100f, by JEOL (1 mentions)
Sigma probe, by Thermo Fisher Scientific (1 mentions)
D max 2500v pc, by Rigaku (1 mentions)
Arm 200, by JEOL (1 mentions)
Slactive, by Straumann (1 mentions)
Su3500, by Hitachi (1 mentions)
Grand arm, by JEOL (1 mentions)
Talos f200x, by Thermo Fisher Scientific (1 mentions)
Ultima 4, by Rigaku (1 mentions)
Inspect f, by Thermo Fisher Scientific (1 mentions)
Su8010 cold field emission sem, by Hitachi (1 mentions)
Smartlab diffractometer, by Rigaku (1 mentions)
Jem arm200f, by JEOL (1 mentions)
Supra 40vp, by Zeiss (1 mentions)
Nexion 2000, by PerkinElmer (1 mentions)
Titan tem, by Thermo Fisher Scientific (1 mentions)
Quanta 3d, by Thermo Fisher Scientific (1 mentions)
17 protocols using nova 600
1
Characterization of Hierarchical ZnO Nanostructures
2
Epitaxial BFO Film Growth and Characterization
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BFO film was grown epitaxially on a (100) KTO substrate using ultra high vacuum (<2 × 10−6 Pa) r.f. magnetron sputtering at 550 °C. Cross sectional TEM samples were prepared using FEI Nova 600 dual beam focused ion beam. Ga ion energy was gradually decreased from 30 to 2 keV with to minimize ion beam induced damage. TEM analysis was performed using (1) JEOL JEM-2100F equipped with Gatan Orius 833 CCD camera specifically designed for precise electron diffraction analysis with electron beam damage resistant scintillator, and (2) JEOL ARM 200 equipped with a probe corrector for atomic resolution scanning TEM (STEM) imaging. For XRD analysis, Bruker D8 discover four circle x-ray diffractometer was used with Cu Kα radiation. RSM was recorded using two dimensional area detector (Hi-STAR).
3
Titanium Surface Modification Protocols
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The Ti disks used in the current study were prepared as Ø6.25 × 2.00 mm turned blanks, via a turning process, using the RxD alloy (Institut Straumann AG). Two‐thirds of the disks were then further modified to produce the SLA surface and the SLActive surface (Institut Straumann AG), using standard manufacturing processing parameters. Subsequently, the Ti‐Sr‐O surface was implemented to both turned and SLA‐modified blanks using previously described process and methods of characterization (Andersen et al., 2013 (link); Sillassen et al., 2014 ). In short, samples were mounted in an industrial‐scale magnetron sputtering setup (CemeCon AG, Wuerselen, Germany). The coating process was allowed to run until a 1.8 µm thick coating had been deposited. Subsequently, process control was performed (data not shown) by assessing coating thickness and morphology by Scanning Electron Microscopy (SEM, Nova 600; FEI Company); Sr release was assessed through washout and analysis using the method of Inductively Coupled Plasma Optical Emission Spectroscopy (ICP‐OES, (AMETEK Spectro Arcos, AMETEK). Thus, three types of surface modifications were tested in the current study: The Ti‐Sr‐O surface applied to either a (I) turned surface (turned + Ti‐Sr‐O) or (II) to an SLA surface (SLA + Ti‐Sr‐O) and (III) the SLActive surface acting as the control (SLActive).
4
Fluorescence and SEM Imaging Protocols
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Fluorescence imaging was performed using a Leica DMI 6000 widefield fluorescence microscope. Scanning electron micrographs were taken using FEI Nova 600 and 200 dual beam systems.
5
High-Resolution SEM and TEM Imaging
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SEM images were obtained with a field-emission SEM instrument (SU-3500, Hitachi). Transmission electron microscope (TEM) samples were prepared by using a focused ion beam (FIB) machine (Nova 600, FEI). After cleaning, we took the high-angle annular dark-field (HAADF) image by using aberration-corrected high-resolution scanning TEM (Grand ARM, JEOL, 300 kV).
6
Comprehensive Characterization of Zn@L-ZMF Electrodes
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The thickness and surface morphologies of Zn@L-ZMF electrodes were investigated using field-emission scanning electron microscope (FE-SEM, Inspect F, FEI). The chemical composition of the surface and bulk of the Zn metal were demonstrated by X-ray photoelectron spectroscopy (XPS, PHI 5000 VersaProbe, Ulvac-PHI). Cross-sectional samples were obtained using a focused ion beam milling system (Nova 600, FEI) with a Ga ion source. Field-emission-transmission electron microscope (FE-TEM, Talos F200X, FEI) coupled with energy-dispersive X-ray spectroscopy (EDS) was used to obtain the high-resolution TEM (HR-TEM) images, fast Fourier transform (FFT) patterns, and elemental maps. The contact angle between the Zn metal and aqueous electrolyte was measured using a contact angle goniometer system (L2004A1, Ossila). Crystallographic information was obtained using X-ray diffraction (XRD, Rigaku, Ultima IV) with a monochromatic Cu Kα source at a scan rate of 2° min−1.
7
Fabrication of 3D-Tapered Nanocavities
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Single-side polished silicon wafers with thermally grown SiO2 (thickness: 1 µm) were purchased from University Wafers, Boston, USA. E-beam evaporation was used to deposit 50 nm gold (Au) on the wafers. 3D-tapered nanocavity patterns were milled through the gold and silica using a FEI Nova 600 dual beam system as shown in Fig. 1 . Au (50 nm) was deposited again using e-beam deposition. Second round of milling was performed using Nova 600 to remove gold from the bottom of the substrates, exposing the silica and to mill the tip.
8
Nanoscale Lamella Preparation and TiO2 Analysis
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A protective platinum layer (~100 nm) was deposited on top of the hybrid blocking layer prior to the treatment with a focused ion beam (FEI Nova 600). Gallium ions with an energy of 30 keV were used to cut the lamella and reduce its diameter below 100 nm. TEM imaging and a titanium dioxide mapping by ESI of the lamella were conducted on a Tecnai F20, FEI, with an acceleration voltage of 200 kV.
9
Nanomaterial Characterization Methods
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A Hitachi Su8010 cold field emission
SEM was used to record SEM images at an acceleration voltage of 15
kV. For atomic force microscopy (AFM) investigation, a Bruker Dimension
Icon (300) microscope was operated in the peak force tapping mode
with Si cantilevers. A 300 kV JEOL 3000F transmission electron microscope
was used to characterize the sample using high-angle annular dark
field. The transmission electron microscopy (TEM) specimens were prepared
with an FEI Nova 600 dual-beam FIB/SEM system. Optical properties
were characterized with micro-PL and cathodoluminescence (CL) at RT.
A 375 nm UV laser was used for PL measurements, and the CL characterization
was conducted with an acceleration voltage of 5 kV and a probe current
of 20 pA. Time-resolved PL was measured in a backscattering configuration.
A frequency-doubled Ti:Sa laser line having 100 fs pulses was used
for excitation at 370 nm. PL decay was measured using a streak camera
having a temporal resolution of around 2 ps.
SEM was used to record SEM images at an acceleration voltage of 15
kV. For atomic force microscopy (AFM) investigation, a Bruker Dimension
Icon (300) microscope was operated in the peak force tapping mode
with Si cantilevers. A 300 kV JEOL 3000F transmission electron microscope
was used to characterize the sample using high-angle annular dark
field. The transmission electron microscopy (TEM) specimens were prepared
with an FEI Nova 600 dual-beam FIB/SEM system. Optical properties
were characterized with micro-PL and cathodoluminescence (CL) at RT.
A 375 nm UV laser was used for PL measurements, and the CL characterization
was conducted with an acceleration voltage of 5 kV and a probe current
of 20 pA. Time-resolved PL was measured in a backscattering configuration.
A frequency-doubled Ti:Sa laser line having 100 fs pulses was used
for excitation at 370 nm. PL decay was measured using a streak camera
having a temporal resolution of around 2 ps.
10
Characterization of BFO Thin Films on LSMO/STO and YAO Substrates
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The BFO thin films were grown on a LSMO buffered (100) STO and a (100) YAO substrates using ultra-high vacuum (<2 × 10−6 Pa) r.f. magnetron sputtering (ULVAC Co. Ltd.) at 550 °C. The detail about the deposition of the LSMO bottom electrode layer on STO substrate is given elsewhere38 (link). The cross-sectional TEM samples were prepared by the focused ion beam technique, FEI Nova 600, with Ga ion beam. ~1 μm-thick Pt thin film was deposited on the surface of the sample to prevent the possible surface damage and re-deposition during the milling process. Then, the Ga ion beam energy gradually decreased from 30 to 1 keV to minimize ion beam induced damage. For atomic resolution HAADF- STEM analysis, a Cs-corrected TEM of JEOL JEM-ARM200F operated at 200 keV was used. For BF and NBED, a 200 keV JEOL JEM-2100F was used together with a Gatan Orius 833 CCD camera specifically designed with electron beam damage resistant scintillator. XRSM was performed using Rigaku SmartLab diffractometer with CuKα radiation.
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