Example 7
An acrylic pressure sensitive adhesive polymer was obtained by reacting butyl acrylate/methyl methacrylate/2-hydroxyethyl acrylate=62/10/28 (mass ratio). The acrylic pressure sensitive adhesive polymer was reacted with methacryloyl oxyethyl isocyanate to obtain a polymerizable high-molecular compound (B2) (polystyrene equivalent weight-average molecular weight=600,000) so that 80 mol of the methacryloyl oxyethyl isocyanate would react in terms of 100 mol of the 2-hydroxyethyl acrylate in the acrylic pressure sensitive adhesive polymer. A pressure sensitive adhesive composition B was obtained by mixing, in a solvent, 100 mass parts of the polymerizable high-molecular compound (B2), 3 mass parts of a photopolymerization initiator (α-hydroxycyclohexyl phenyl ketone (“IRGACURE 184” available from BASF SE)), 8 mass parts (solid content equivalent) of a cross-linker (polyvalent isocyanato compound (“BHS-8515” available from TOYOCHEM CO., LTD.), and 0.15 mass parts of a polymerizable branched polymer (B1) (“OD-007” available from Nissan Chemical Industries, Ltd., polystyrene equivalent weight-average molecular weight=14,000).
A semiconductor-related-member processing sheet was obtained by performing the same operation as in Example 6 except that the obtained pressure sensitive adhesive composition B was used as substitute for the pressure sensitive adhesive composition A.