Five types of GRMs were assessed including two types of GNP: GNP-1 (Cheaptubes, USA) and GNP-2 (XG Science, USA), two types of GO: GO-1 (Cheaptubes, USA) and GO-2 and one type of reduced GO (rGO). GO-2 and rGO were provided by Université Paul Sabatier, CNRS, Toulouse, France. The epoxy and hardener used were diglycidyl ether of bisphenol A, DGEBA (Araldite GY 250, Huntsman, USA) and Jeffamine D-230 (Huntsman, USA), respectively. In order to manufacture the epoxy/GRM composites, epoxy resin and 1 wt% GRMs were mixed manually and homogenized using a high speed mixer at 2000 rpm for 5 min. Then GRMs were evenly dispersed in the epoxy matrix using a three-roll-mill (SDY 200, Bühler AG, Switzerland). After addition of the hardener, mixing and degassing, the mixture was poured into a metal mold and cured at 80 °C for 12 h and post-cured at 120 °C for 4 h. The fabricated composites were cut to the desired size for an abrasion process.
Jeffamine d 230
Manufactured by Huntsman
Sourced in United States
Jeffamine D-230 is a polyether diamine product manufactured by Huntsman. It has a molecular weight of approximately 230 g/mol and is a clear, viscous liquid. Jeffamine D-230 is primarily used as a raw material in the production of various chemical formulations.
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7 protocols using jeffamine d 230
1
Fabrication of Epoxy/Graphene Composite
2
Resin Coated Sand Preparation Protocol
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Example 5
One kg of 40/70 Minnesota fracturing sand is heated to 210° F. in a laboratory mixer at which point the following components are added in the sequence and timing as given below in Tables 9 and 10. The weight ratio of the poly-MDI to the aminated polyalkyleneglycol (JEFFAMINE D230 from Huntsman Corporation) is 63/37.
The resin coated sand from the example above tested at 2.84% coating level from the mixer. When subjected to a three day 250° F. autoclave test, the coating level was measured again at 2.63% reflecting the good resistance to hot water removal of the coating.
3
DGEBA Epoxy-Based Shape Memory Polymer
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DGEBA epoxy monomer (EPON 826, Momentive, Inc., Waterford, NY, USA) [75 ] was used as an epoxy resin for the SMP. Poly (propylene glycol) bis (2-aminopropyl) ether (Jeffamine D230, Huntsman, Rotterdam, The Netherlands) [76 ] was used as a crosslinker agent. N-Phenylaminopropyl POSS® (AM0281, Hybrid Plastics) [77 ] containing eight amine groups (denoted herein as AM-POSS) and Glycidyl POSS® (EP0409, Hybrid Plastics) [78 ] containing eight epoxide groups (denoted herein as EP–POSS) were used as alternative additives. The molecular structures of the various EPOSS components are shown in Figure 11 .
4
Epoxy Resin Synthesis with Silica Additives
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A bisphenol A-type epoxy resin (YD-115, E.E.W. 187 g/eq, KUKDO CHEMICAL CO., Seoul, Republic of Korea) containing diglycidyl ether of bisphenol A (DGEBA) with butyl glycidyl ether (BGE) was used. Butyl glycidyl ether (BGE) and polyether diamines (JEFFAMINE® D-230, A.H.E.W. 60 g/eq, HUNTSMAN Corporation, Salt Lake City, TX, USA ) were used as the curing agents. The molecular structures of the epoxy and polyether diamines are shown in Figure 1 a.
Fumed silica (AEROSIL®150; surface area: 150 ± 15 m2/g) and PDMS-treated fumed silica (AEROSIL®R202; surface area: 100 ± 20 m2/g) were provided by Evonik Industries (Essen, Germany).
Fumed silica (AEROSIL®150; surface area: 150 ± 15 m2/g) and PDMS-treated fumed silica (AEROSIL®R202; surface area: 100 ± 20 m2/g) were provided by Evonik Industries (Essen, Germany).
5
Synthesis of Epoxy Resin Composites
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Example 3
Materials: Epon™ 828, a diglycidyl ether of bisphenol A, with a number average molecular weight of 377 g mol−1 and epoxy-equivalent weight (EEW) of 188.5, was obtained from Momentive Performance Materials (Waterford, N.Y.). Jeffamine® D230, a polyether diamine of number-average molecular weight 240 g mol−1 and amine proton equivalent weight of 60, was obtained from Huntsman Corporation (The Woodlands, Tex.). Nanomer® nanoclay was purchased from Sigma-Aldrich (Saint Louis, Mo.). All other reagents were obtained from Sigma-Aldrich (Saint Louis, Mo.). The epoxy resin and curing agents were used without further purification. Nuclear magnetic resonance (NMR) spectroscopy of resin components was performed using a Bruker Ultrashield 500 Plus, 500 mHz NMR in deuterated solvents purchased from Cambridge Isotope Laboratories, Inc. (Tewksbury, Mass.). High-resolution mass spectrometry data were obtained using a Waters Xevo G2 QTOF mass spectrometer in both positive and negative mode. The sample was dissolved in a mixture of acetonitrile/methanol (70/30) with a small amount of water.
Synthesis of Compounds 1 and 2: Compound 1 (1-(6-isocyanatohexyl)-3-(6-methyl-4-oxo-1,4-dihydropyrimidin-2-yl)urea) was synthesized according to literature procedure.15
6
Epoxy Nanocomposite Synthesis Using POSS
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Bisphenol A diglycidyl ether (DGEBA) epoxy monomer (EPON 826, from Hexion (Columbus, OH, USA) [52 ]), having an epoxide equivalent weight (EEW) of 182 g/eq, was used as the basic epoxy resin. Poly (propylene glycol) bis (2-aminopropyl) ether (Jeffamine D230, from Huntsman (The Woodlands, TX, USA) [53 ]), having an amine hydrogen equivalent weight (AHEW) of 60 g/eq, was used as the basic crosslinker. In addition, the following POSS reactants were used: N-Phenylaminopropyl POSS® (AM0281, from Hybrid Plastics (Hattiesburg, MS, USA) [54 ]), with an AHEW of 186 g/eq, hereafter denoted as AM-POSS, or Glycidyl POSS® (EP0409, also from Hybrid Plastics [55 ]), with an EEW of 167 g/eq, hereafter denoted as EP-POSS. The molecular structures of the EPOSS components are presented in Figure 1 .
7
Fabrication of Carbon Fiber-Reinforced Shape Memory Polymer Composites
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Thermosetting SMP was prepared by applying the formulation previously used by our group. Bisphenol A type epoxy (Epofix®; Struer, Denmark) was used, with diamine (Jeffamine D-230; Huntsman Corporation, The Woodlands, TX, USA) as the curing agent. Four layers of woven carbon fabric (TI-3101; TEI Fabrics, Taiwan) were used for reinforcement. CF-SMPCs were fabricated with a vacuum-assisted resin transfer molding (VARTM) method which manufacturing process of fiber-reinforced composite using a vacuum to assist resin flow into fiber-reinforcement. Polymer composite specimens were cured at 110 °C for 3 h and removed from the mold used in the VARTM process. Then, specimens were further cured at 80 °C for 2 h for shape stability and thermodynamically stability of switching segment, which play important role in shape memory mechanism. We confirmed that the epoxy polymer composite had cured completely under that curing condition before proceeding with the experiments through DSC analysis in our previous work [43 (link)].
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