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Dimension 3000

Manufactured by Bruker
Sourced in United States

The Dimension 3000 is an atomic force microscope (AFM) system developed by Bruker. It is designed to provide high-resolution surface imaging and analysis capabilities for a wide range of applications.

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5 protocols using dimension 3000

1

Characterization of Nanomaterial Properties

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SEM images were collected using FEI Nova NanoSEM 2300. AFM image was collected from Dimension 3000 (Bruker). Raman spectrum was collected from Renishaw inVia confocal Raman microscope. XPS spectrum was collected from VersaProbe II Scanning ESCA Microprobe. Electrical conductivity measurement is perform using the four-point probe station.35 (link)
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2

Multi-Modal Characterization of Advanced Materials

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Optical images are collected by optical microscopy (Nikon DS-Ri2). AFM topography is acquired on a Bruker Dimension 3000 in a tapping mode. SEM images are taken on Zeiss Supra 55. XPS spectra are collected from PHI Versaprobe II. TEM measurements are performed on a FEI Tecnai Osiris TEM, operating at a 200 keV accelerating voltage. SAED is measured on a JEOL 2100 TEM. The SAED simulation is performed through STEM_CELL software. PXRD scanning are performed on a Bruker D2 Phaser with Cu Kα radiation of wavelength λ = 1.54184 Å at 30 kV and 10 mA. SERS measurement is performed on a Horiba-JY T64000, using a triple-grating mode with 1800 g mm–1 gratings, and a 532 nm laser line. Solution- and solid-state UV–Vis spectra are taken with Agilent Cary 5000. REELS measurement is carried out on Thermo Scientific Nexsa G2 and data is analyzed using Avantage software.
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3

Characterization of Nanomaterial Structures

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The UV-visible absorbance was measured using an Ocean Optics Jazz spectrometer.36 The atomic force microscope images were measured with a Bruker Dimension 3000 in tapping mode. The DF-TEM imaging was conducted with a Philips EM400T transmission electron microscope, operated at 120 kV. The images were recorded with an SIS Cantega 2 K CCD camera. X-ray diffraction was performed at the Stanford Synchrotron Radiation Lightsource (SSRL) on beam line 11–3 with an area detector (MAR345 image plate), an energy of 12.735 keV, and an incidence angle of ≈0.12°.
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4

Electrical Measurements of Nanomaterials

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The electrical measurement was carried out at room temperature using a commercial AFM microscope (Dimension 3000, Bruker, Camarillo, CA, USA). The electrical signals to the AFM were customized, using a break box, for device initialization and subsequent data acquisition. Non-invasive measurements were achieved with a contact force of 1.2 nN. The tip quality was also checked before and after measurements, to ensure that the tip apex suffered no degradation during prolonged measurements. The details of the measurements are described elsewhere [18 (link)].
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5

Characterization of Material Properties

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Contact angle measurements were performed with a Rame-Hart Inc. NRL C.A. Goniometer 100–00. AFM measurements were performed on a Bruker Dimension 3000 in tapping mode. The UV-Vis absorbance measurements were performed with an Ocean Optics Jazz spectrometer. X-ray diffraction measurements were performed at the Stanford Synchrotron Radiation Lightsource (SSRL) on beam line 11–3 with an area detector (MAR345 image plate), an energy of 12.735 keV, and an incidence angle of ≈0.12°. Samples were enclosed in a helium chamber to reduce air scattering and beam damage. The data was processed using previously published methods to convert detector images into intensity versus scattering angle, q.36 (link),38 ,39 The XPS measurements were performed with a SPECS XPS with a 6 channel PHOIBIS 150 analyzer with pressure less than 3x10−10 Torr. Films were spun cast onto OTS Si then removed with carbon tape so that the bottom of the film was exposed for XPS measurements. The TOF-SIMS measurements were performed with ION TOF SIMS V instrument. The depth profiles were acquired with Cs ion beam sputtering and Bi ion beam analyzing.
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